Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10 , and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10 . The first resin molding 40 has the recess 40 c comprising the bottom surface 40 a and the side surface 40 b formed therein, and the second resin molding 50 is placed in the recess 40 c . The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.
1. A method for manufacturing a surface mounted light emitting apparatus comprising:
(a) providing (i) a lead frame including a first lead having a plate shape and a second lead having a plate shape, said first lead including a first inner lead and a first outer lead, said second lead including a second inner lead and a second outer lead, (ii) an upper die having a loop-shaped recess at a bottom face, the loop-shaped recess being formed between an inner portion and an outer portion of the bottom face of the upper die, and (iii) a lower die having a flat top face at least at a portion corresponding to the loop-shaped recess, the inner portion and the outer portion of the bottom face of the said upper die,
(b) sandwiching (i) the first inner lead and the second inner lead between the inner portion of the bottom face of the upper die and the flat top face of the lower die and (ii) the first outer lead and the second outer lead between the outer portion of the bottom face of the upper die and the flat top face of the lower die,
(c) introducing a first thermosetting resin in a melted state into the loop-shaped recess of the upper die, a space between the first inner lead and the second inner lead, and a space surrounding side faces of the first inner lead and the second inner lead, the first thermosetting resin comprising at least one kind selected from the group consisting of filler, diffusing agent, pigment, fluorescent material, reflective material and light blocking material,
(d) heating the first thermosetting resin so as to be preliminarily cured;
(e) removing the upper die and the lower die after preliminarily curing the first thermosetting resin;
(f) heating the first thermosetting resin so as to be fully cured and form a first resin molding,
(g) mounting a light emitting device on the first inner lead,
(h) placing a second thermosetting resin in a recess of the first resin molding, the recess having a bottom face formed by the first inner lead, the second inner lead and the first resin molding and an inner side face corresponding to an inner face of the loop-shaped recess, and
(i) heating the second thermosetting resin so as to be cured and form a second resin molding.
2. The method for manufacturing a surface mounted light emitting apparatus according to claim 1 , wherein the inner face of loop-shaped recess is inclined so that the recess of the first resin molding becomes wider toward a mouth of the recess.
3. The method for manufacturing a surface mounted light emitting apparatus according to claim 2 , wherein an inclination angle of the inner side face from the bottom face of the recess is not smaller than 95 degree and not larger than 150 degree.
4. The method for manufacturing a surface mounted light emitting apparatus according to claim 1 , wherein a shape of the recess in a plan view is oval, circular, rectangular, pentagon or hexagon.
5. The method for manufacturing a surface mounted light emitting apparatus according to claim 1 , wherein, in a plan view, the first inner lead and the second inner lead extend from the bottom face of the recess of the first resin molding toward opposite directions with each other, at least one of the first inner lead and the second inner lead having a side face with a recess along the extending direction.
6. The method for manufacturing a surface mounted light emitting apparatus according to claim 1 , wherein the first thermosetting resin is one kind selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin.
7. The method for manufacturing a surface mounted light emitting apparatus according to claim 1 , wherein the first thermosetting resin introduced in a melted state is prepared by melting a solid thermosetting resin formed by B-staging.
8. The method for manufacturing a surface mounted light emitting apparatus according to claim 1 , wherein the first thermosetting resin in a melted state is introduced by a transfer molding process.
9. The method for manufacturing a surface mounted light emitting apparatus according to claim 1 , wherein the second thermosetting resin is one kind selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin.
10. The method for manufacturing a surface mounted light emitting apparatus according to claim 1 , wherein the placing of the second thermosetting resin in the recess of the first resin molding is done by dripping, injection or extrusion.
11. The method for manufacturing a surface mounted light emitting apparatus according to claim 1 , wherein the second thermosetting resin placed in the recess of the first resin molding has a surface at the same height with a top of the recess of the first resin molding.
12. The method for manufacturing a surface mounted light emitting apparatus according to claim 1 , wherein the first inner lead exposed from the first resin molding, the second inner lead exposed from the first resin molding, the first outer lead and the second outer lead are plated with metal after forming the first resin molding.
13. The method for manufacturing a surface mounted light emitting apparatus according to claim 1 , wherein the upper die and the lower die are configured so that a lower surface of the first inner lead is exposed from the first resin molding at least in a region directly under the light emitting device.
14. The method for manufacturing a surface mounted light emitting apparatus according to claim 1 , wherein the first lead and the second lead are cut off from the leadframe after forming the second resin molding.