Semiconductor device and active matrix substrate using semiconductor device

1. A semiconductor device comprising:

an insulating substrate including a pixel area and a peripheral circuit area around the pixel area;

a first insulating layer which is provided on the insulating substrate and includes at least nitrogen;

a second insulating layer on the first insulating layer, wherein at least a portion of the second insulating layer is configured to block hydrogen from the first insulating layer;

a first thin-film transistor which is provided above the first insulating layer in the pixel area and comprises a first oxide semiconductor layer; and

a second thin-film transistor which is provided on the second insulating layer in the peripheral circuit area and comprises a second oxide semiconductor layer, wherein

the second insulating layer in the pixel area is thinner than that in the peripheral circuit area.

2. The device of claim 1 , wherein the first insulating layer is uniform in the pixel area and the peripheral circuit area.

3. The device of claim 1 , wherein threshold voltage of the first thin-film transistor is lower than threshold voltage of the second thin-film transistor.

4. The device of claim 1 , wherein the first insulating layer is one of a silicon nitride layer or a silicon oxynitride layer.

5. The device of claim 1 , wherein the first thin-film transistor is one of a write transistor, a drive transistor or a reset transistor included in a pixel arranged in the pixel area.

6. The device of claim 5 , wherein the second thin-film transistor is a protective transistor which protects the pixel area from electro-static discharge or an inspection transistor which inspects the pixel area.

7. The device of claim 1 , including an organic electroluminescence display device, a liquid crystal display device or an imaging device.

8. An active matrix substrate using the device of claim 1 .

9. A semiconductor device comprising:

an insulating substrate;

a first insulating layer which is provided on the insulating substrate and includes at least nitrogen;

a thin-film transistor which is provided above the first insulating layer and comprises a first oxide semiconductor layer;

a capacitor which is provided above the first insulating layer and comprises a second oxide semiconductor layer; and

a second insulating layer, wherein the second insulating layer comprises a first portion between the first insulating layer and the first oxide semiconductor layer of the thin-film transistor, and the second insulating layer comprises a second portion having a different thickness than the first portion.

10. The device of claim 9 , wherein

the first insulating layer is uniform under the first oxide semiconductor layer and the second oxide semiconductor layer, and

the second insulating layer is between the first insulating layer and the second oxide semiconductor layer, and the second insulating layer under the first oxide semiconductor layer is thicker than that under the second oxide semiconductor layer.

11. The device of claim 9 , wherein electrical resistance of the second oxide semiconductor layer is lower than electrical resistance of the first oxide semiconductor layer.

12. The device of claim 9 , wherein the first insulating layer is one of a silicon nitride layer or a silicon oxynitride layer.

13. The device of claim 9 , wherein

the insulating substrate includes a pixel area, and

the thin-film transistor is one of a write transistor, a drive transistor or a reset transistor included in a pixel arranged in the pixel area.

14. The device of claim 13 , wherein the capacitor is a capacitance element included in the pixel arranged in the pixel area.

15. The device of claim 9 , including an organic electroluminescence display device, a liquid crystal display device or an imaging device.

16. An active matrix substrate using the device of claim 9 .

17. A semiconductor device comprising:

an insulating substrate including a pixel area and a peripheral circuit area around the pixel area;

a first insulating layer which is provided on the insulating substrate and includes at least nitrogen;

a second insulating layer provided on the first insulating layer;

a first thin-film transistor which is provided on the second insulating layer in the pixel area and comprises a first oxide semiconductor layer; and

a second thin-film transistor which is provided on the second insulating layer in the peripheral circuit area and comprises a second oxide semiconductor layer, wherein

the first insulating layer in the pixel area is thicker than that in the peripheral circuit area.

18. The device of claim 17 , wherein the second insulating layer is uniform in the pixel area and the peripheral circuit area.

19. A semiconductor device comprising:

an insulating substrate;

a first insulating layer which is provided on the insulating substrate and includes at least nitrogen;

a second insulating layer provided on the first insulating layer;

a thin-film transistor which is provided on the second insulating layer and comprises a first oxide semiconductor layer; and

a capacitor which is provided on the second insulating layer and comprises a second oxide semiconductor layer, wherein

the first insulating layer under the first oxide semiconductor layer is thinner than that under the second oxide semiconductor layer.

20. The device of claim 19 , wherein the second insulating layer is uniform under the first oxide semiconductor layer and the second oxide semiconductor layer.