Thin film transistor
A thin film transistor includes an oxide semiconductor layer including a channel region, and a source region and a drain region having a resistivity lower than that of the channel region; a gate insulating layer disposed on the channel region of the oxide semiconductor layer; a gate electrode disposed on the gate insulating layer; and an aluminum oxide layer covering the lateral surface of the gate insulating layer, and the source region and the drain region, wherein the gate insulating layer has a multi-layer structure including a first insulating layer and a second insulating layer, and the first insulating layer contains silicon oxide as a main component, and is disposed on and in contact with the channel region.
1. A thin film transistor, comprising:
an oxide semiconductor layer including a channel region, and a source region and a drain region having a resistivity lower than a resistivity of the channel region;
a gate insulating layer disposed on the channel region of the oxide semiconductor layer;
a gate electrode disposed on the gate insulating layer, wherein a lateral surface of the channel region, the lateral surface of the gate insulating layer, and a lateral surface of the gate electrode are approximately flush with each other; and
an aluminum oxide layer covering a lateral surface of the gate insulating layer, and the source region and the drain region,
wherein the gate insulating layer has a multi-layer structure including a first insulating layer and a second insulating layer, and
the first insulating layer contains silicon oxide as a main component, and is disposed on and in contact with the channel region.
2. The thin film transistor according to claim 1 ,
wherein the second insulating layer has an oxygen content smaller than an oxygen content of the first insulating layer.
3. The thin film transistor according to claim 2 ,
wherein the second insulating layer contains silicon nitride as a main component.
4. The thin film transistor according to claim 1 ,
wherein the second insulating layer has a binding energy to oxygen higher than a binding energy to oxygen of the first insulating layer.
5. The thin film transistor according to claim 4 ,
wherein the second insulating layer contains one of aluminum oxide, fluorine-added silicon oxide, carbon-added silicon oxide, and silicon oxynitride as a main component.
6. The thin film transistor according to claim 1 ,
wherein the second insulating layer contains, as a main component, silicon oxide having an oxygen content higher than an oxygen content of the first insulating layer.
7. The thin film transistor according to claim 1 ,
wherein the gate insulating layer further includes a third insulating layer disposed between the first insulating layer and the second insulating layer.