Printed circuit body
A printed circuit body includes a bus bar as a metal member electrically connected with a connected body, an insulator layer providing insulation properties, and a conductor layer formed across the metal member and the insulator layer and electrically connected with the metal member. The metal member and the insulator layer are positioned such that a metal-member side connected surface of the metal member on which the conductor layer is provided and an insulator-layer side connected surface of the insulator layer on which the conductor layer is provided are positioned at an identical plane. This configuration allows connection between the bus bar and the conductor layer and circuit formation to be simultaneously achieved at manufacturing of the printed circuit body, thereby facilitating formation of a wiring structure of the bus bar and the conductor layer.
1. A printed circuit body comprising:
a metal member electrically connected with a connected body;
an insulator layer providing insulation properties; and
a conductor layer formed across the metal member and the insulator layer and electrically connected with the metal member, wherein
the metal member and the insulator layer are positioned such that a metal-member side connected surface of the metal member on which the conductor layer is provided and an insulator-layer side connected surface of the insulator layer on which the conductor layer is provided are positioned at an identical plane, wherein
the metal member includes a recess formed in a depth equivalent to a thickness of the insulator layer, and the metal-member side connected surface and the insulator-layer side connected surface are positioned at an identical plane with an end part of the insulator layer being housed in the recess.
2. The printed circuit body according to claim 1 , further comprising:
a second insulator layer on which the metal member and the insulator layer are placed separately from each other, wherein
the conductor layer is formed across the metal member, the second insulator layer, and the insulator layer, and
the metal member, the insulator layer, and the second insulator layer are positioned such that the metal-member side connected surface, the insulator-layer side connected surface, and a second insulator-layer side connected surface of the second insulator layer on which the conductor layer is provided are positioned at an identical plane.
3. The printed circuit body according to claim 2 , wherein
the second insulator layer includes a first recess formed in a depth equivalent to a thickness of the metal member and a second recess formed in a depth equivalent to a thickness of the insulator layer, and
the metal-member side connected surface, the insulator-layer side connected surface, and the second insulator-layer side connected surface are positioned at an identical plane with an end part of the metal member being housed in the first recess and an end part of the insulator layer being housed in the second recess.
4. The printed circuit body according to claim 3 , further comprising:
a protection layer covering and protecting the conductor layer.
5. The printed circuit body according to claim 3 , wherein
the conductor layer is a printed body formed by printing.
6. The printed circuit body according to claim 2 , further comprising:
a protection layer covering and protecting the conductor layer.
7. The printed circuit body according to claim 2 , wherein
the conductor layer is a printed body formed by printing.
8. The printed circuit body according to claim 1 , further comprising:
a protection layer covering and protecting the conductor layer.
9. The printed circuit body according to claim 8 , wherein
the conductor layer is a printed body formed by printing.
10. The printed circuit body according to claim 1 , wherein
the conductor layer is a printed body formed by printing.
11. The printed circuit body according to claim 10 , wherein
the conductor layer is the printed body formed by printing conductive paste and then performing firing to provide conduction, and
the conductive paste is any one of Ag paste, Cu paste, and Au paste, metal primary components of which are silver (Ag), copper (Cu), and gold (Au), respectively, or a mixture of two or more of these pastes.
12. The printed circuit body according to claim 1 , wherein the recess is formed at an end part of the metal member, facing the insulator layer in a width direction.
13. The printed circuit body according to claim 12 , wherein the recess is formed to extend from one end part of the metal member to the other end part in the width direction.
14. The printed circuit body according to claim 12 , wherein the recess is formed as a substantially rectangular parallelepiped space having a substantially rectangular sectional shape orthogonal to the width direction.
15. The printed circuit body according to claim 1 , wherein the conductor layer is formed in a linear shape, and includes a main line part extending on the insulator layer in a width direction, and a connection line part extending from the main line part to the metal member in a direction which is substantially orthogonal to a direction in which the main line part extends.