Electronic package including cavity defined by resin and method of forming same
An electronic component may include a substrate having a functional unit formed on a main surface of the substrate and a first resin layer formed on the main surface, the first resin layer having a first surface facing the main surface and a second surface opposed to the first surface, the first resin layer defining a cavity on the first surface enclosing the functional unit, the first resin layer defining a recess on the second surface, and a solder layer being formed in the recess so as not to exceed the second surface in a thickness direction. The functional unit may include a surface acoustic wave (SAW) element or a film bulk acoustic resonator (FBAR) having a mechanically movable portion. The substrate may be formed of dielectric material.
1. An electronic component comprising:
a substrate including a main surface;
a functional unit formed on the main surface of the substrate; and
a resin layer formed on the main surface of the substrate, the resin layer including a first surface facing the main surface of the substrate and a second surface opposed to the first surface, the resin layer defining a cavity on the first surface enclosing the functional unit, a portion of the first surface defining a wall of the cavity parallel to the main surface of the substrate, the resin layer including a recess on the second surface, and a solder layer disposed in the recess, the solder layer not exceeding the second surface in a thickness direction.
2. The electronic component of claim 1 wherein the functional unit includes one of a surface acoustic wave (SAW) element or a film bulk acoustic resonator (FBAR) having a mechanically movable portion.
3. The electronic component of claim 1 wherein the substrate is formed of dielectric material.
4. The electronic component of claim 1 wherein the resin layer is provided with a through hole extending from the recess and passing through the resin layer to the main surface, a metal layer distinct from the solder layer being disposed in the through hole and electrically connecting the solder layer to the main surface.
5. The electronic component of claim 1 wherein a portion of the solder layer is disposed on the second surface of the resin layer in the recess.
6. The electronic component of claim 1 wherein a gap is provided between a periphery of the solder layer and a peripheral surface of the resin layer defining the recess.
7. An electronic device comprising:
an electronic component including a first substrate having a functional unit formed on a main surface of the first substrate and a first resin layer formed on the main surface thereof, the first resin layer having a first surface facing the main surface of the first substrate and a second surface opposed to the first surface, the first resin layer defining a cavity on the first surface enclosing the functional unit, a portion of the first surface defining a wall of the cavity parallel to the main surface of the first substrate, the first resin layer including a recess on the second surface, a through hole extending from the recess and passing through the resin layer to the main surface of the first substrate, a metal layer being disposed in the through hole;
a second substrate having an electrode pad formed on a main surface thereof, a solder layer disposed in the recess in contact with the electrode pad, the solder layer, the metal layer, and the electrode pad having a combined thickness corresponding to a distance between the main surface of the first substrate and the main surface of the second substrate; and
a second resin layer sealing the electronic component and the second substrate.
8. The electronic device of claim 7 wherein the functional unit includes one of a surface acoustic wave (SAW) element or a film bulk acoustic resonator (FBAR) having a mechanically movable portion.
9. The electronic device of claim 7 wherein the first substrate is formed of dielectric material.
10. The electronic device of claim 7 wherein the first surface is in contact with the main surface of the first substrate.
11. The electronic device of claim 7 wherein the second surface is in contact with the main surface of the second substrate.
12. The electronic device of claim 7 wherein the second resin layer is in contact with the first substrate, the first resin layer, and the second substrate.
13. The electronic device of claim 7 wherein a portion of the first resin layer is disposed between the cavity and the second substrate, the second surface of the portion of the first resin layer being in direct contact with the main surface of the second substrate.