Integrated antenna for direct chip attach connectivity module package structures
Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include a die disposed on a first substrate, at least one component adjacent the die on the first substrate, a molding material on the die and the at least one component, wherein the die and the at least one component are completely embedded in the molding material, a second substrate, wherein the first substrate is disposed on a top surface of the second substrate, and at least one communication structure disposed on a surface of the second substrate.
1. A microelectronic package structure comprising:
a die on a first substrate;
at least one component adjacent the die on the first substrate;
a molding material on the die and the at least one component, wherein the die and the at least one component are completely embedded in the molding material;
a second substrate, wherein the first substrate is on a top surface of the second substrate, and wherein the second substrate comprises low density routing printed circuit board (PCB); and
at least one communication structure on a surface of the second substrate.
2. The microelectronic package structure of claim 1 wherein a top surface of the second substrate does not comprise the molding material.
3. The microelectronic package structure of claim 1 wherein a shielding material is on a top surface and on a side surface of the molding material.
4. The microelectronic package structure of claim 1 wherein an individual one of the at least one communication structure is on a top surface of the second substrate.
5. The microelectronic package structure of claim 1 wherein a first communication structure is on a bottom surface of the second substrate.
6. The microelectronic package structure of claim 5 wherein a second communication structure is on a top surface of the second substrate.
7. The microelectronic package structure of claim 1 wherein the at least one component and the at least one die are fully embedded in the molding material.
8. A microelectronic package structure comprising:
a die on a first substrate;
at least one component adjacent the die on the first substrate;
a molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material; and
a first portion of a first communication structure on a portion of a top surface of the molding material, and a second portion of the first communication structure through a portion of the molding material and on a top surface of the first substrate.
9. The microelectronic package structure of claim 8 wherein the first communication structure comprises an antenna structure, and wherein a shielding material is adjacent the antenna structure and is directly on a top surface of the molding material.
10. The microelectronic package structure of claim 8 wherein a second substrate is on a bottom surface of the first substrate.
11. The microelectronic package structure of claim 10 wherein a second communication structure is on a top surface of the second substrate.
12. The microelectronic package structure of claim 10 wherein a second communication structure is on a bottom surface of the second substrate.
13. The microelectronic package structure of claim 10 wherein a top surface of the second substrate comprises a second communication structure thereon, and a bottom surface of the second substrate comprises a third communication structure thereon.
14. The microelectronic package structure of claim 8 wherein a top surface and a side surface of the molding material comprises an RF shielding material thereon.
15. The microelectronic package structure of claim 8 , wherein a bottom surface of the first substrate comprises a second communication structure thereon.
16. A system comprising:
a processor to process data;
a memory for storage of data;
a transmitter or a receiver for transmission and reception of data;
and
a module including:
a die on a first substrate;
at least one component adjacent the die on the first substrate;
a molding material on the die and the at least one component, wherein the die and the at least one component are completely embedded in the molding component;
a second substrate, wherein the first substrate is on a top surface of the second substrate; and
a first antenna on a top surface of the second substrate, and a second antenna on a bottom surface of the second substrate.
17. The system of claim 16 wherein a top surface of the second substrate does not comprise the molding material thereon.
18. The method of claim 16 wherein the second substrate comprises a low density substrate.
19. The system of claim 16 further comprising wherein an RF shielding material is on a top surface of the molding material adjacent a communication structure on the molding material.
20. The system of claim 16 further comprising wherein the first substrate comprises an embedded trace substrate.
21. The system of claim 16 wherein a first portion of a first communication structure is on a portion of a top surface of the molding material, and a second portion of the first communication structure is through a portion of the molding material and is on a top surface of the first substrate.
22. The system of claim 21 wherein the first antenna is not below a footprint of the first substrate.
23. The system of claim 16 wherein the die comprises a wireless die or a system on a chip.