Radio frequency identification (RFID) tag device and related methods
Implementations of antennas may include a meandering T-matching structure, a first meandering feed line coupled to the meandering T-matching structure, and a first radiating part coupled to the first meandering feed line. Implementations may include a second meandering feed line coupled to the meandering T-matching structure, and a second radiating part coupled to the meandering feed line. A gap may physically separate the first meandering feed line and the second meandering feed line.
1. An antenna comprising:
a meandering T-matching structure;
a first meandering feed line coupled to the meandering T-matching structure;
a first radiating part coupled to the first meandering feed line;
a second meandering feed line coupled to the meandering T-matching structure; and
a second radiating part coupled to the second meandering feed line;
wherein a gap physically separates the first meandering feed line and the second meandering feed line.
2. The antenna of claim 1 , wherein the first meandering feed line comprises a first frequency-tuning stub.
3. The antenna of claim 2 , wherein the second meandering feed line comprises a second frequency-tuning stub.
4. The antenna of claim 1 , wherein one of the first radiating part and the second radiating part comprises a power transfer portion.
5. A radio frequency identification (RFID) tag comprising:
a dielectric substrate comprising a first side and a second side;
a ground plane coupled to a first side of the dielectric substrate, wherein the ground plane comprises a metal exclusion region;
an antenna coupled to the second side of the dielectric substrate,
wherein the antenna is coupled to the metal exclusion region through a first via and a second via in the dielectric substrate;
wherein the antenna comprises a meandering T-matching structure; and
an integrated circuit coupled to the first side of the dielectric substrate.
6. The RFID tag of claim 5 , wherein the dielectric substrate is 3.2 millimeters thick.
7. The RFID tag of claim 5 , wherein the dielectric substrate is 1.6 millimeters thick.
8. The RFID tag of claim 5 , wherein the antenna comprises a first frequency tuning stub and a second frequency tuning stub.
9. A radio frequency identification (RFID) tag comprising:
a dielectric substrate comprising a first side and a second side;
a ground plane coupled to a first side of the dielectric substrate, wherein the ground plane comprises a metal exclusion region;
an antenna coupled to the second side of the dielectric substrate, the antenna comprising:
a meandering T-matching structure;
a first meandering feed line coupled to the meandering T-matching structure;
a first radiating part coupled to the first meandering feed line;
a second meandering feed line coupled to the meandering T-matching structure; and
a second radiating part coupled to the second meandering feed line;
wherein a gap physically separates the first meandering feed line and the second meandering feed line;
wherein the antenna is coupled to the metal exclusion region through a first via and a second via, the first via positioned at a first side of the gap and the second via positioned at a second side of the gap; and
an integrated circuit coupled to the dielectric substrate.
10. The RFID tag of claim 9 , wherein the integrated circuit is coupled to the first side of the dielectric substrate.
11. The RFID tag of claim 9 , wherein the integrated circuit is coupled to the second side of the dielectric substrate.
12. The RFID tag of claim 11 , wherein the integrated circuit spans the gap between the first meandering feed line and the second meandering feed line.
13. The RFID tag of claim 9 , wherein the antenna further comprises a first frequency tuning stub coupled to the first meandering feed line.
14. The RFID tag of claim 13 , wherein the antenna further comprises a second frequency tuning stub coupled to the second meandering feed line.
15. The RFID tag of claim 9 , wherein the dielectric substrate is 3.2 millimeters thick.
16. The RFID tag of claim 9 , wherein the dielectric substrate is 1.6 millimeters thick.