Techniques for shielding within an optical transceiver housing to mitigate electromagnetic interference between optical subassemblies disposed within the same

1. An optical transceiver module comprising:

a housing including at least a first housing portion and a second housing portion, each of the first and second housing portions including a base portion having at least one sidewall extending therefrom that defines a compartment, wherein the first housing portion is configured to couple to the second housing portion to form a cavity therebetween;

a transmitter optical subassembly (TOSA) arrangement coupled to the base portion of the first housing portion and electrically coupled to a first flexible printed circuit (FPC);

a receiver optical subassembly (ROSA) arrangement coupled to the base portion of the second housing portion and electrically coupled to a second FPC; and

a first shield coupled to at least one of the first housing portion or the second housing portion to reduce electromagnetic interference between the TOSA arrangement and the ROSA arrangement.

2. The optical transceiver module of claim 1 , wherein the TOSA arrangement and the ROSA arrangement are disposed opposite each other within the cavity when the first housing portion is coupled to the second housing portion.

3. The optical transceiver module of claim 1 , wherein the TOSA arrangement includes at least one laser diode driver (LDD), and wherein the first shield coupled to the first housing portion covers at least a portion of the at least one LDD.

4. The optical transceiver module of claim 1 , wherein the TOSA arrangement is electrically coupled to the first FPC via wire bonding, and wherein the first shield covers at least a portion of the wire bonding.

5. The optical transceiver module of claim 4 , wherein the first shield comprises a metal or a metal alloy.

6. The optical transceiver module of claim 1 , further comprising a second shield coupled to the second housing portion.

7. The optical transceiver module of claim 6 , wherein the ROSA arrangement is electrically coupled to the second FPC via wire bonding, and wherein the second shield covers at least a portion of the wire bonding.

8. The optical transceiver module of claim 6 , wherein the ROSA includes a transimpedance amplifier (TIA), and wherein the second shield covers at least a portion of the TIA.

9. The optical transceiver module of claim 6 , wherein the first shield has a first thickness and the second shield has a second thickness, the second thickness being greater than the first thickness.

10. An optical transceiver module comprising:

a housing including at least a first housing portion and a second housing portion, each of the first and second housing portions including a base portion having at least one sidewall extending therefrom that defines a compartment, wherein the first housing portion is configured to couple to the second housing portion to form a cavity therebetween;

a transmitter optical subassembly (TOSA) arrangement coupled to the base portion of the first housing portion, the TOSA arrangement including at least one driving circuit;

a receiver optical subassembly (ROSA) arrangement coupled to the base portion of the second housing portion, the ROSA arrangement including an array of photodiodes and associated transimpedance amplifier (TIA); and

a first shield coupled to the first housing portion and at least partially surrounding the at least one driving circuit of the TOSA to reduce electromagnetic interference between the TOSA arrangement and the ROSA arrangement.

11. The optical transceiver module of claim 10 , wherein the TOSA arrangement and the ROSA arrangement are disposed opposite each other within the cavity when the first housing portion is coupled to the second housing portion.

12. The optical transceiver module of claim 11 , further comprising:

a first flexible printed circuit (FPC) electrically coupled to the at least one driving circuit using at least a first set of wire bonds; and

a second FPC electrically coupled to the array of photodiodes and associated TIAs using at least a second set of wire bonds.

13. The optical transceiver module of claim 12 , wherein the first shield at least partially covers the first set of wire bonds.

14. The optical transceiver module of claim 10 , wherein the first shield includes a width which is substantially equal to that of a width of the first housing portion.

15. The optical transceiver module of claim 10 , wherein the first shield is coupled to the first housing portion using a silver epoxy.

16. The optical transceiver module of claim 10 , further comprising a second shield coupled to the second housing portion.

17. The optical transceiver module of claim 16 , wherein the second shield covers at least a portion of the TIA of the ROSA arrangement.

18. The optical transceiver module of claim 16 , wherein the first shield has a first thickness and the second shield has a second thickness, the second thickness being greater than the first thickness.

19. An optical transceiver comprising:

a pluggable housing;

an optical transceiver module housing at least partially disposed within the pluggable housing, the optical transceiver module housing comprising:

a first housing portion defined by a first base and at least one first sidewall extending therefrom, wherein the first base and an inner surface of the first sidewall define a first compartment; and

a second housing portion defined by a second base and at least one second sidewall extending therefrom, wherein the second base and an inner surface of the second sidewall define a second compartment;

a transmitter optical subassembly (TOSA) arrangement disposed within the first compartment;

a receiver optical subassembly (ROSA) disposed within the second compartment, wherein the TOSA arrangement and ROSA arrangement are disposed in an opposing fashion;

a first flexible printed circuit (FPC) electrically coupled to the TOSA arrangement using at least a first set of wire bonds and a second FPC electrically coupled to the ROSA arrangement using at least a second set of wire bonds;

a first shield coupled to the first housing portion and at least partially covering the first set of wire bonds;

a second shield coupled to the second housing portion and at least partially covering the second set of wire bonds; and

a printed circuit board assembly (PCBA) electrically coupled to the first FPC and to the second FPC.

20. The optical transceiver of claim 19 , wherein the optical transceiver module is configured to send and receive channel wavelengths at a rate of at least 100 gigabits per second.