Waterborne adhesives for reduced basis weight multilayer substrates and use thereof
View Patent ↗The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
1. An adhesive to decrease the basis weight of a substrate comprising:
(a) an emulsion-based polymer selected from the group consisting of polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, and mixtures thereof; and
(b) a plurality of microspheres, wherein the microspheres have a volume of about 10 to about 50V/V % in the adhesive.
2. The adhesive of claim 1 , wherein the microspheres are radiation and/or heat expandable polymeric microspheres having an expansion temperature (T exp ) of about 80° C. to about 135° C. and a maximum expansion temperature (T max ) of about 120° C. to about 200° C.