IP Library Granted Patent US 10,012,522
Granted Patent B2
US 10,012,522 · App. 15/476,007 · Granted Jul 3, 2018

Thermal flow meter

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Quick Facts
Patent No.
US 10,012,522
App. No.
15/476,007
Granted
Jul 3, 2018
Kind
B2
Abstract

A thermal-type flowmeter includes a chip package. The chip package is formed through encapsulation with a resin of a sensor element, a drive circuit, a metal lead frame adapted to have mounted thereon the sensor element and the drive circuit, and a temperature detecting element. The chip package has an exposed structure in which a surface of the sensor element having the diaphragm is exposed. The temperature detecting element is mounted on the lead frame via an electrically conductive member.

Claims (15)

1. A thermal-type flowmeter including a sensor element having an exothermic resistor formed on a diaphragm, a temperature detecting element, and a drive circuit electrically connected to the sensor element, comprising:

a chip package formed through encapsulation with a resin of the sensor element, the drive circuit, a metal lead frame adapted to have mounted thereon the sensor element and the drive circuit, and the temperature detecting element, wherein:

the chip package has an exposed structure in which a surface of the sensor element having the diaphragm is exposed, and

the temperature detecting element is mounted on the lead frame via an electrically conductive member.

2. The thermal-type flowmeter according to claim 1 , wherein the chip package is in a shape with a portion thereof, where the temperature detecting element is mounted, being protruded.

3. The thermal-type flowmeter according to claim 2 , wherein a direction of the protrusion of the portion of the chip package is an upstream direction of a flow of the fluid under measurement.

4. The thermal-type flowmeter according to claim 2 , wherein a direction of the protrusion of the portion of the chip package is a direction perpendicular to the flow of

the fluid under measurement.

5. The thermal-type flowmeter according to claim 2 , wherein the chip package has a connection terminal for electrical connection with an outside of the chip package, and is in a shape with the portion thereof being protruded in a direction perpendicular to a direction of the connection terminal.

6. The thermal-type flowmeter according to claim 2 , wherein the chip package has the connection terminal for electrical connection with the outside of the chip package, and is in a shape with the portion thereof being protruded in a direction horizontal to the direction of the connection terminal.

7. The thermal-type flowmeter according to claim 1 , further comprising a sub-flow path that takes in a part of a fluid under measurement passing through a main flow path, wherein the chip package is provided such that a portion on which the sensor element is mounted is disposed in the sub-flow path and a portion on which the temperature detecting element is mounted is disposed in the main flow path.

8. The thermal-type flowmeter according to claim 1 , wherein:

the metal lead frame has a mounting portion on which the drive circuit is mounted and a protruding portion that protrudes from the mounting portion, and

the temperature detecting element is mounted on the protruding portion.

9. The thermal-type flowmeter according to claim 1 , wherein the chip package has a capacitor mounted on the lead frame, the capacitor being encapsulated with the resin.

Assignments (1)
CHANGE OF NAME Recorded Mar 25, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 056299/0447 →