IP Library Granted Patent US 10,941,304
Granted Patent B2
US 10,941,304 · App. 15/477,868 · Granted Mar 9, 2021

Metal powder sintering paste and method of producing the same, and method of producing conductive material

Inventors: Teppei Kunimune (Tokushima, JP); Masafumi Kuramoto (Tokushima, JP)
Assignee: NICHIA CORPORATION
C09D5/24B22F1/0055B22F1/0074B22F9/30C09D7/68H01B1/22B22F2201/03B22F2201/50B22F2301/255B22F2998/10
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,941,304
App. No.
15/477,868
Granted
Mar 9, 2021
Kind
B2
Abstract

There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.

Claims (71)

1. A metal powder sintering paste,

the paste comprising, as a principal component, silver particles having a median diameter of 0.3 μm to 5 μm, and

further comprising an anionic surfactant, and

being substantially free from resin,

wherein

the surfactant is one in which when the temperature is increased with thermogravimetric-differential thermal analysis (TG-DTA) from room temperature to 350° C. at 2° C./min, a residue is reduced to not more than 20% by mass with respect to the initial mass, and

wherein

a content of the surfactant is not more than 2% by mass with respect to the paste.

2. The metal powder sintering paste according to claim 1 , wherein

the surfactant is a saturated carboxylic acid represented by Formula (I) below:

R 1 O(CH 2 CH(R 2 )O) n1 CH 2 COOR 3   (I)

wherein R 1 is a linear or branched alkyl group having at least 7 carbon atoms,

R 2 is any one of —H, —CH 3 , —CH 2 CH 3 , and —CH 2 CH 2 CH 3 ,

R 3 is —H or alkali metal, and

n1 is in a range of 2 to 5.

3. The metal powder sintering paste according to claim 1 , wherein

the surfactant is liquid at 25° C.

4. The metal powder sintering paste according to claim 1 , wherein

the silver particles are in a flake form.

5. The metal powder sintering paste according to claim 1 , wherein

in the silver particles, the content of particles with a particle diameter of smaller than 0.3 μm is not more than 5% by mass.

6. The metal powder sintering paste according to claim 5 , wherein

in the silver particles, the content of particles with a particle diameter of smaller than 0.5 μm is not more than 15% by mass.

7. The metal powder sintering paste according to claim 1 , wherein

the metal powder sintering paste further comprises an organic solvent as a dispersion medium.

8. The metal powder sintering paste according to claim 7 , wherein

the organic solvent has a boiling point in a range of 150 to 250° C.

9. The metal powder sintering paste according to claim 1 , capable of being sintered to form a conductive material having an electric resistance of not higher than 6 μΩ·cm.

10. The metal powder sintering paste according to claim 1 , wherein

the content of the silver particles is at least 70% by mass with respect to the paste.

11. A metal powder sintering paste,

the paste comprising, as a principal component, silver particles having a median diameter of 0.3 μm to 5 μm, and

further comprising an anionic surfactant, and

being substantially free from resin,

wherein

a content of the surfactant is not more than 2% by mass with respect to the paste, and

wherein

a bleed ratio is less than 1.70,

wherein the bleed ratio is calculated as a ratio of a diameter after bleeding to an original diameter of the paste

when the paste is applied onto a substrate having a gold electrode with a surface roughness Ra of 0.04 μm on its surface by a stamping method to have a diameter of 170±50 μm, which then is left to stand for 20 minutes, and

the diameter after bleeding is measured by measuring the diameter including a dispersion medium that had bled.

12. The metal powder sintering paste according to claim 11 , wherein

the surfactant is one in which when the temperature is increased with thermogravimetric-differential thermal analysis (TG-DTA) from room temperature to 350° C. at 2° C./min, a residue is reduced to not more than 20% by mass with respect to the initial mass.

13. The metal powder sintering paste according, to claim 11 , wherein

the surfactant is a saturated carboxylic acid represented by Formula (I) below:

R 1 O(CH 2 CH(R 2 )O) n1 CH 2 COOR 3   (I)

wherein R 1 is a linear or branched alkyl group having at least 7 carbon atoms,

R 2 is any one of —H, —CH 2 CH 3 , and —CH 2 CH 2 CH 3 ,

R 3 is —H or alkali metal, and

n1 is in a range of 2 to 5.

14. The metal powder sintering paste according to claim 11 , wherein

the surfactant is liquid at 25° C.

15. The metal powder sintering paste according to claim 11 , wherein

the silver particles are in a flake form.

16. The metal powder sintering paste according to claim 11 , wherein

in the silver particles, a content of particles with a particle diameter of smaller than 0.3 μm is not more than 5% by mass.

17. The metal powder sintering paste according to claim 16 , wherein

in the silver particles, a content of particles with a particle diameter of smaller than 0.5 μm is not more than 15% by mass.

18. The metal powder sintering paste according to claim 11 , wherein

the metal powder sintering paste further comprises an organic solvent as a dispersion medium.

19. The metal powder sintering paste according to claim 18 , wherein

the organic solvent has a boiling point in a range of 150 to 250° C.

20. The metal powder sintering paste according to claim 11 , capable of being sintered to form a conductive material having an electric resistance of not higher than 6 μΩ·cm.

21. The metal powder sintering paste according to claim 11 , wherein

a content of the silver particles is at least 70% by mass with respect to the paste.

22. A method of producing the metal powder sintering paste according to claim 1 , comprising mixing an anionic surfactant and silver particles having a median diameter of 0.3 μm to 5 μm together but substantially not with resin.

23. A method of producing a conductive material, comprising a step of calcining a metal powder sintering paste according to claim 1 .

24. The method of producing a conductive material according to claim 23 , wherein

the calcining is carried out at a temperature in a range of 160° C. to 300° C.

25. The method of producing a conductive material according to claim 23 , wherein

the calcining is carried out in an air oven at 160° C. to 250° C. for 30 to 120 minutes.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 4, 2017
From: KUNIMUNE, TEPPEI; KURAMOTO, MASAFUMI
To: NICHIA CORPORATION
Reel/Frame 041847/0814 →
Priority Claims (1)
JP JP2016-075314 · Apr 4, 2016 · national
Continuity (1)
Related Publication 20170283624A1 · Oct 5, 2017