IP Library Granted Patent US 10,168,371
Granted Patent B2
US 10,168,371 · App. 15/478,293 · Granted Jan 1, 2019

System and methods for determining the impact of moisture on dielectric sealing material of downhole electrical feedthrough packages

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Quick Facts
Patent No.
US 10,168,371
App. No.
15/478,293
Granted
Jan 1, 2019
Kind
B2
Abstract

A system for determining the impact of moisture on a dielectric sealing material may include a testing apparatus having a testing chamber. A dielectric sealing material and a conducting pin may be exposed to the testing chamber. A first electrical lead may be coupled to the conducting pin, and a second electrical lead may be coupled to the dialectic material. An insulation resistance measurement unit may be coupled to both the first electrical lead and the second electrical lead, and the insulation resistance measurement unit may be configured to measure an insulation resistance value between the electrical leads. The insulation resistance measurement unit may measure a first insulation resistance value of the dielectric sealing material in a first environmental condition, and the insulation resistance measurement unit may measure a second insulation resistance value of the dielectric sealing material at a second environmental condition, that is different than the first environmental condition.

Claims (36)

1. A system for determining the impact of moisture on a dielectric sealing material, the system comprising:

a testing apparatus comprising a testing chamber, the testing chamber surrounded by a rigid shell;

a dielectric sealing material and a conducting pin positioned within the rigid shell and exposed to the testing chamber;

a first electrical lead coupled to the conducting pin;

a second electrical lead coupled to the testing apparatus, the dialectic sealing material positioned between the first electrical lead and the second electrical lead;

an insulation resistance measurement unit coupled to both the first electrical lead and the second electrical lead, the insulation resistance measurement unit configured to measure an insulation resistance value between the electrical leads;

a fluid conducting aperture positioned within the rigid shell, the fluid conducting aperture configured to transfer a fluid into the testing chamber; and

wherein the insulation resistance measurement unit measures a first insulation resistance value of the dielectric sealing material in a first environmental condition, and the insulation resistance measurement unit measures a second insulation resistance value of the dielectric sealing material at a second environmental condition after a hydraulic pressurized fluid has been introduced into the testing chamber.

2. The system of claim 1 , wherein the rigid metal shell comprises a first flange and a second flange.

3. The system of claim 2 , wherein the first flange is removably coupled to the second flange with a plurality of bolt fasteners, and wherein a plate holding the dielectric material is positioned between the first flange and the second flange.

4. The system of claim 3 , wherein an O-ring is positioned between the first flange and the second flange to seal the hydraulic pressurized fluid inside the testing chamber.

5. The system of claim 1 , wherein the hydraulic pressurized fluid is a hydraulic pressurized fluid comprising a heat transfer oil with minimum film temperature of 310 degrees Celsius and minimum bulk temperature of 300 degrees Celsius.

6. The system of claim 1 , wherein the fluid is a hydraulic pressurized fluid comprising de-ionized water useful for evaluating the impact of moisture on the dielectric sealing material performance by simulating water-based or moisture-rich downhole conditions.

7. The system of claim 1 , further comprising a hydraulic pump, the hydraulic pump configured to communicate the fluid into the testing chamber through the fluid conducting aperture.

8. The system of claim 7 , wherein the hydraulic pump introduces the fluid into the chamber to generate a pressure greater than 2,000 PSI.

9. The system of claim 7 , further comprising a pressure sensor configured to measure the pressure within the testing chamber.

10. The system of claim 1 , further comprising a temperature control unit, the temperature control unit configured to maintain the dielectric sealing material at elevated temperatures in the second environmental condition.

11. The system of claim 10 , wherein the temperature control unit heats the dielectric material to a temperature greater than 50 degrees Celsius.

12. The system of claim 1 , further comprising a data logging unit to record the first insulation resistance value and the second insulation resistance value, as well as time elapsed pressure and temperature data.

13. The system of claim 12 , wherein a processor unit retrieves data from the data logging unit and determines the difference between the first sample IR value and the second sample IR value, the difference useful for determining moisture resistance of the dielectric sealing material.

14. A testing apparatus for determining the impact of moisture on a dielectric sealing material, the apparatus comprising:

a testing chamber surrounded by a rigid shell;

a dielectric sealing material positioned within the testing chamber, the dielectric sealing material surrounding a conducting pin;

a first electrical lead coupled to the conducting pin;

a second electrical lead electrically coupled to the dialectic material;

an insulation resistance measurement unit coupled to both the first electrical lead and the second electrical lead, the insulation resistance measurement unit configured to measure an insulation resistance value between the electrical leads; and

a fluid conducting aperture positioned within the rigid shell, the fluid conducting aperture configured to transfer a fluid into the testing chamber.

15. The apparatus of claim 14 , in communication with a hydraulic pump, the hydraulic pump configured to communicate the fluid into the testing chamber through the fluid conducting aperture.

16. The apparatus of claim 14 , further comprising a plate, the plate holding the dielectric sealing material in a position exposing the dielectric sealing material to the testing chamber.

17. A method for determining the impact of moisture of a dielectric sealing material, the method comprising:

measuring a first insulation resistance value between the dielectric material and an electrically conductive pin at a first temperature, a first pressure, and a first moisture content and storing the first insulation resistance value in a data logging unit;

introducing a fluid to the dielectric sealing material to create a second moisture content and increasing the temperature of the dielectric sealing material to a second temperature; and

measuring a second insulation resistance value between the dielectric sealing material and the electrically conductive pin and storing the second insulation resistance value in the data logging unit.

18. The method of claim 17 , further comprising the step of increasing the first pressure to a second pressure through a pump acting on the fluid and measuring a third insulation resistance value between the dielectric material and the electrically conductive pin and storing the third insulation resistance value in the data logging unit.

19. The method of claim 17 , wherein the fluid is a hydraulic pressurized fluid selected from one of: de-ionized water, a heat transfer oil, and a combination of both de-ionized water and heat transfer oil.

20. The method of claim 18 wherein the second temperature is greater than 50 degrees Celsius and the second pressure is greater than 5,000 PSI.

Assignments (10)
RELEASE OF SECURITY INTEREST Recorded Feb 27, 2025
From: ARES CAPITAL CORPORATION
To: PACIFIC AEROSPACE & ELECTRONICS, LLC; OHIO ASSOCIATED ENTERPRISES, LLC; JOY SIGNAL TECHNOLOGY, LLC; FILCONN, LLC; HERMETIC SOLUTIONS GROUP INC.
Reel/Frame 070355/0621 →
SECURITY INTEREST Recorded Feb 27, 2025
From: X-MICROWAVE, LLC; TANTALUM PELLET COMPANY, LLC; EVANS CAPACITOR COMPANY, LLC; PACIFIC AEROSPACE & ELECTRONICS, LLC; OHIO ASSOCIATED ENTERPRISES, LLC; FILCONN, LLC; HERMETIC SOLUTIONS GROUP INC.; RUBBERCRAFT CORPORATION OF CALIFORNIA, LTD.; SWIFT TEXTILE METALIZING LLC; RMB PRODUCTS; BAL SEAL ENGINEERING, LLC; KAMATICS CORPORATION; BEI PRECISION SYSTEMS & SPACE COMPANY, INC.; PAKTRON LLC; OHMEGA TECHNOLOGIES, LLC; TICER TECHNOLOGIES, LLC; CUSTOM INTERCONNECTS, LLC; SANDERS INDUSTRIES HOLDINGS, INC.; AKROFIRE, LLC; KAMAN AEROSPACE CORPORATION; KAMAN CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 070344/0430 →
SECURITY INTEREST Recorded Nov 2, 2022
From: PACIFIC AEROSPACE & ELECTRONICS, LLC; OHIO ASSOCIATED ENTERPRISES, LLC; JOY SIGNAL TECHNOLOGY LLC; FILCONN, LLC; HERMETIC SOLUTIONS GROUP INC.
To: ARES CAPITAL CORPORATION
Reel/Frame 061638/0115 →
PATENT RELEASE AND REASSIGNMENT Recorded Nov 2, 2022
From: ANTARES CAPITAL LP
To: PACIFIC AEROSPACE & ELECTRONICS, LLC; HERMETIC SOLUTIONS GROUP INC.; FILCONN, LLC
Reel/Frame 061875/0569 →
PATENT RELEASE AND REASSIGNMENT Recorded Nov 2, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: FILCONN, LLC; PACIFIC AEROSPACE & ELECTRONICS, LLC; HERMETIC SOLUTIONS GROUP INC.
Reel/Frame 061875/0577 →
CHANGE OF NAME Recorded Jul 19, 2022
From: HERMETIC SOLUTIONS GROUP LLC
To: HERMETIC SOLUTIONS GROUP, INC
Reel/Frame 060550/0880 →
SECURITY INTEREST Recorded Feb 26, 2019
From: PACIFIC AEROSPACE & ELECTRONICS, LLC; HERMETIC SOLUTIONS GROUP INC.
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS ADMINISTRATIVE AGENT
Reel/Frame 048445/0372 →
SECURITY INTEREST Recorded Feb 22, 2019
From: PACIFIC AEROSPACE & ELECTRONICS, LLC; HERMETIC SOLUTIONS GROUP INC.
To: ANTARES CAPITAL LP, AS ADMINISTRATIVE AGENT
Reel/Frame 048403/0572 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE DATA PREVIOUSLY RECORDED ON REEL 047209 FRAME 566. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 11, 2019
From: PACIFIC AEROSPACE & ELECTRONICS, INC.
To: HERMETIC SOLUTIONS GROUP, LLC
Reel/Frame 048066/0301 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2018
From: PACIFIC AEROSPACE & ELECTRONICS, INC.
To: PA&E, HERMETIC SOLUTIONS GROUP, LLC
Reel/Frame 047209/0566 →