Apparatus and methods for integrated MEMS devices
A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.
1. A system for a plurality of integrated devices comprising CMOS and MEMS devices, the system including:
a receiving stage configured to receive a diced wafer comprising the plurality of integrated devices disposed upon an adhesive substrate, wherein the diced wafer is associated with a known good device data associated with the plurality of integrated devices;
a reel and tape packaging stage configured to receive and seal a first set of integrated devices from the plurality of integrated devices into a transport tape media, and configured to wind the transport tape media upon a reel;
a testing stage coupled to the receiving stage and to the reel and tape packaging stage, wherein the testing stage comprises a testing platform comprising a socket substrate having a plurality of sockets, wherein the socket substrate is removably coupled to the testing platform, wherein each socket from the plurality of sockets is configured to releasably secure an integrated device from the plurality of integrated devices and configured to provide electrical power to the integrated device and to receive electrical response data from the integrated device during a testing phase, and wherein the testing platform is configured to physically stress the integrated device during the testing phase;
a first pick and place device coupled to the testing stage and to the receiving stage, wherein the first pick and place device is configured to remove a second set of integrated devices from the plurality of integrated devices from the adhesive substrate in response to the known good device data, and wherein the first pick and place device is configured to dispose the second set of integrated devices into the plurality of sockets of the socket substrate; and
a second pick and place device coupled to the testing stage and to the reel and tape packaging stage, wherein the second pick and place device is configured to remove the second set of integrated devices from the socket substrate, and wherein the second pick and place device is configured to dispose the first set of integrated devices into the transport tape media of the reel and tape packaging stage in response to electrical response data from integrated devices from the second set of integrated devices.
2. The system of claim 1 wherein a number of integrated devices from the first set of integrated devices is equal to or less than a number of integrated devices from the second set of integrated devices.
3. The system of claim 1
wherein the physical stress comprises shaking stress; and
wherein the testing platform is configured to shake the second set of integrated devices in a direction selected from a group consisting of: x-direction, y-direction, z-direction, x-y-direction, x-z-direction, and y-z direction.
4. The system of claim 1
wherein the physical stress comprises rotational stress; and
wherein the testing platform is configured to rotate the second set of integrated devices along an axis selected from a group consisting of: x-axis, y-axis, z-axis, x-y-axis, x-z-axis, and y-z axis.
5. The system of claim 1 wherein the MEMS devices are selected from a group consisting of: an accelerometer, a gyroscope, a magnetometer and a pressure sensor.
6. The system of claim 1
wherein the testing stage further comprises a processor coupled to the testing platform, wherein the processor is configured to determine integrated devices for the first set of integrated devices from the second set of integrated devices in response to the electrical response data from integrated devices from the second set of integrated devices.
7. The system of claim 6 wherein the processor is configured to compare electrical response data for each integrated device in the second set of integrated devices to a plurality of threshold data to determine the first set of integrated devices.
8. The system of 6 wherein the electrical response indicates a lack of a stiction condition.
9. The system of claim 1 wherein the second set of integrated devices is selected from the plurality of integrated devices in response to the known good device data.
10. The system of claim 1
wherein the tape and reel stage comprises at least a first transport tape media and a second transport tape media;
wherein the second pick and place device is configured to dispose the first set of integrated devices into the first transport tape media of the reel and tape packaging stage in response to electrical response data from integrated devices from the second set of integrated devices; and
wherein the second pick and place device is configured to dispose remaining integrated devices from the second set of integrated devices not within the first set of integrated devices into the second transport tape media.