IP Library Granted Patent US 9,910,302
Granted Patent B2
US 9,910,302 · App. 15/481,669 · Granted Mar 6, 2018

Ultra-responsive phase shifters for depletion mode silcon modulators

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Quick Facts
Patent No.
US 9,910,302
App. No.
15/481,669
Granted
Mar 6, 2018
Kind
B2
Abstract

A novel phase shifter design for carrier depletion based silicon modulators, based on an experimentally validated model, is described. It is believed that the heretofore neglected effect of incomplete ionization will have a significant impact on ultra-responsive phase shifters. A low VπL product of 0.3V·cm associated with a low propagation loss of 20 dB/cm is expected to be observed. The phase shifter is based on overlapping implantation steps, where the doses and energies are carefully chosen to utilize counter-doping to produce an S-shaped junction. This junction has a particularly attractive VπL figure of merit, while simultaneously achieving attractively low capacitance and optical loss. This improvement will enable significantly smaller Mach-Zehnder modulators to be constructed that nonetheless would have low drive voltages, with substantial decreases in insertion loss. The described fabrication process is of minimal complexity; in particular, no high-resolution lithographic step is required.

Claims (15)

1. An optical modulator semiconductor device comprising:

a substrate;

an optical waveguide disposed upon the substrate;

a p-′type region of semiconductor material disposed within the optical waveguide, the p-type region having a p-′type contact terminal;

an n-_type region of semiconductor material disposed within the optical waveguide, the n-type region having an n-type contact terminal;

wherein the n-type region and the p-′type region share a non-planar junction interface that is shaped so as to enhance an overlap between an optical mode in the optical waveguide and the junction interface when the optical modulator semiconductor device is operational;

wherein the n-type region and the p-type region are configured to comprise at least one of a PNP structure or an NPN structure as viewed in a direction perpendicular to the substrate, and wherein the optical waveguide includes one or more N and P implantation overlap regions comprising at least a portion of the non-planar junction interface.

2. The optical modulator semiconductor device of claim 1 , wherein the non-planar junction interface comprises a convex side and a concave side as viewed in a first cross-section taken perpendicular to a light propagation direction in the optical waveguide.

3. The optical modulator semiconductor device of claim 2 , wherein the p-type region is on the concave side of the non-planar junction interface and the n-′type region is on the convex side of the non-planar junction interface.

4. The optical modulator semiconductor device of claim 2 , wherein the n-type region is on the concave side of the non-planar junction interface and the p-′type region is on the convex side of the non-planar junction interface.

5. The optical modulator semiconductor device of claim 1 , wherein in a first cross-section the p-type region is on a concave side of the non-planar junction interface and the n-type region is on a convex side of the non-planar junction interface, and wherein in a second cross-section the n-′type region is on a concave side of the non-planar junction interface and the p-type region is on a convex side of the non-planar junction interface, wherein the first and second cross-sections are perpendicular to a light propagation direction in the optical waveguide.

6. The optical modulator semiconductor device of claim 5 wherein the optical waveguide includes one or more N and P implantation overlap regions comprising the PNP structure and the NPN structure.

7. The optical modulator semiconductor device of claim 1 , wherein the semiconductor is silicon.

8. The optical modulator semiconductor device of claim 1 , wherein the p-type region is doped with boron.

9. The optical modulator semiconductor device of claim 1 , wherein the n-type region is doped with one of phosphorous or arsenic.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 10, 2023
From: ELENION TECHNOLOGIES LLC
To: NOKIA SOLUTIONS AND NETWORKS OY
Reel/Frame 063271/0691 →
RELEASE OF SECURITY INTEREST Recorded Mar 27, 2020
From: HERCULES CAPITAL, INC.
To: ELENION TECHNOLOGIES CORPORATION; ELENION TECHNOLOGIES, LLC
Reel/Frame 052251/0186 →
SECURITY INTEREST Recorded Feb 8, 2019
From: ELENION TECHNOLOGIES, LLC; ELENION TECHNOLOGIES CORPORATION
To: HERCULES CAPITAL INC., AS AGENT
Reel/Frame 048289/0060 →
RELEASE OF SECURITY INTEREST Recorded Feb 8, 2019
From: EASTWARD FUND MANAGEMENT, LLC
To: ELENION TECHNOLOGIES CORPORATION
Reel/Frame 048290/0070 →
SECURITY INTEREST Recorded Apr 16, 2018
From: ELENION TECHNOLOGIES CORPORATION
To: EASTWARD FUND MANAGEMENT, LLC
Reel/Frame 045959/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 7, 2017
From: LIU, YANG; BAEHR-JONES, THOMAS WETTELAND
To: SILICON LIGHTWAVE SERVICES, LLC
Reel/Frame 041928/0675 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 7, 2017
From: SILICON LIGHTWAVE SERVICES, LLC
To: CORIANT ADVANCED TECHNOLOGY, LLC
Reel/Frame 041928/0717 →
CHANGE OF NAME Recorded Apr 7, 2017
From: CORIANT ADVANCED TECHNOLOGY, LLC
To: ELENION TECHNOLOGIES, LLC
Reel/Frame 042190/0464 →