Partial dielectric loaded septum polarizer

1. A waveguide device comprising:

a first layer comprising an upper section of a first common waveguide and a first divided waveguide portion;

a second layer comprising a lower section of the first common waveguide and a second divided waveguide portion; and

a third layer between the first layer and the second layer, the third layer comprising an intermediate section of the first common waveguide, and further comprising a first conductive septum dividing an opening in the first common waveguide to define the first divided waveguide portion and the second divided waveguide portion, wherein:

the first layer further comprises an upper section of a second common waveguide and a third divided waveguide portion;

the second layer further comprises a lower section of the second common waveguide and a fourth divided waveguide portion; and

the third layer further comprising an intermediate section of the second common waveguide, and a second conductive septum dividing an opening in the second common waveguide to define the third divided waveguide portion and the fourth divided waveguide portion.

2. The waveguide device of claim 1 , wherein the first conductive septum is offset from a center of the third layer.

3. The waveguide device of claim 2 , wherein the first conductive septum is arranged on a surface of the third layer.

4. The waveguide device of claim 1 , wherein:

a bottom surface of the first layer contacts an upper surface of the third layer; and

an upper surface of the second layer contacts a lower surface of the third layer.

5. The waveguide device of claim 1 , further comprising a dielectric insert partially filling the first common waveguide.

6. The waveguide device of claim 1 , wherein:

the first layer further comprises a first combiner/divider coupled to the first divided waveguide portion; and

the second layer further comprises a second combiner/divider coupled to the second divided waveguide portion.

7. The waveguide device of claim 6 , wherein:

the first combiner/divider is further coupled to the third divided waveguide portion within the first layer; and

the second combiner/divider is further coupled to the fourth divided waveguide portion within the second layer.

8. The waveguide device of claim 1 , wherein the third layer further comprises a section of the second divided waveguide portion.

9. The waveguide device of claim 1 , further comprising a combiner/divider structure including combiner/dividers within the first, second and third layers and coupled to the first and second divided waveguide portions.

10. A waveguide device comprising:

a first layer comprising an upper section of a first common waveguide and a first divided waveguide portion;

a second layer comprising a lower section of the first common waveguide and a second divided waveguide portion;

a third layer between the first layer and the second layer, the third layer comprising an intermediate section of the first common waveguide, and further comprising a first conductive septum dividing an opening in the first common waveguide to define the first divided waveguide portion and the second divided waveguide portion, wherein the second layer further comprises an upper section of a second common waveguide and a third divided waveguide portion;

a fourth layer comprising a lower section of the second common waveguide and a fourth divided waveguide portion; and

a fifth layer between the second layer and the fourth layer, the fifth layer comprising an intermediate section of the second common waveguide, and further comprising a second conductive septum dividing an opening in the second common waveguide to define the third divided waveguide portion and the fourth divided waveguide portion.

11. The waveguide device of claim 10 , wherein the fifth layer has an H-frame cross-section.

12. The waveguide device of claim 10 , wherein:

the first layer further comprises an upper section of a third common waveguide and a fifth divided waveguide portion;

the second layer further comprises a lower section of the third common waveguide and a sixth divided waveguide portion; and

the third layer further comprising an intermediate section of the third common waveguide, and a third conductive septum dividing an opening in the third common waveguide to define the fifth divided waveguide portion and the sixth divided waveguide portion.

13. The waveguide device of claim 12 , wherein:

the first layer further comprises a first combiner/divider coupled to the first divided waveguide portion; and

the second layer further comprises a second combiner/divider coupled to the second divided waveguide portion.

14. The waveguide device of claim 13 , wherein:

the first combiner/divider is further coupled to the fifth divided waveguide portion within the first layer; and

the second combiner/divider is further coupled to the sixth divided waveguide portion within the second layer.

15. The waveguide device of claim 10 , wherein the first conductive septum is offset from a center of the third layer.

16. The waveguide device of claim 15 , wherein the first conductive septum is arranged on a surface of the third layer.

17. The waveguide device of claim 10 , wherein:

a bottom surface of the first layer contacts an upper surface of the third layer; and

an upper surface of the second layer contacts a lower surface of the third layer.

18. The waveguide device of claim 10 , further comprising a dielectric insert partially filling the first common waveguide.

19. The waveguide device of claim 10 , wherein:

the first layer further comprises a first combiner/divider coupled to the first divided waveguide portion; and

the second layer further comprises a second combiner/divider coupled to the second divided waveguide portion.

20. The waveguide device of claim 19 , wherein:

a third combiner/divider is coupled to the third divided waveguide portion within the second layer; and

a fourth combiner/divider is further coupled to the fourth divided waveguide portion within the fourth layer.

21. The waveguide device of claim 10 , wherein the third layer further comprises a section of the second divided waveguide portion.

22. The waveguide device of claim 10 , further comprising a combiner/divider structure including combiner/dividers within the first, second and third layers and coupled to the first and second divided waveguide portions.

23. A method of manufacturing a waveguide device, the method comprising:

forming a first layer comprising an upper section of a first common waveguide and a first divided waveguide portion;

forming a second layer comprising a lower section of the first common waveguide and a second divided waveguide portion; and

forming a third layer between the first layer and the second layer, the third layer comprising an intermediate section of the first common waveguide, and further comprising a first conductive septum dividing an opening in the first common waveguide to define the first divided waveguide portion and the second divided waveguide portion, wherein:

the first layer further comprises an upper section of a second common waveguide and a third divided waveguide portion;

the second layer further comprises a lower section of the second common waveguide and a fourth divided waveguide portion; and

the third layer further comprising an intermediate section of the second common waveguide, and a second conductive septum dividing an opening in the second common waveguide to define the third divided waveguide portion and the fourth divided waveguide portion.

24. The method of claim 23 , wherein the first conductive septum is offset from a center of the third layer.

25. The method of claim 24 , wherein the first conductive septum is arranged on a surface of the third layer.

26. The method of claim 23 , wherein:

a bottom surface of the first layer contacts an upper surface of the third layer; and

an upper surface of the second layer contacts a lower surface of the third layer.

27. The method of claim 23 , further comprising forming a dielectric insert partially filling the first common waveguide.

28. The method of claim 23 , wherein:

the first layer further comprises a first combiner/divider coupled to the first divided waveguide portion; and

the second layer further comprises a second combiner/divider coupled to the second divided waveguide portion.

29. The method of claim 28 , wherein:

the first combiner/divider is further coupled to the third divided waveguide portion within the first layer; and

the second combiner/divider is further coupled to the fourth divided waveguide portion within the second layer.

30. The method of claim 23 , wherein the third layer further comprises a section of the second divided waveguide portion.

31. The method of claim 23 , further comprising a combiner/divider structure including combiner/dividers within the first, second and third layers and coupled to the first and second divided waveguide portions.

32. A method of manufacturing a waveguide device, the method comprising:

forming a first layer comprising an upper section of a first common waveguide and a first divided waveguide portion;

forming a second layer comprising a lower section of the first common waveguide and a second divided waveguide portion; and

forming a third layer between the first layer and the second layer, the third layer comprising an intermediate section of the first common waveguide, and further comprising a first conductive septum dividing an opening in the first common waveguide to define the first divided waveguide portion and the second divided waveguide portion, wherein the second layer further comprises an upper section of a second common waveguide and a third divided waveguide portion;

forming a fourth layer comprising a lower section of the second common waveguide and a fourth divided waveguide portion; and

forming a fifth layer between the second layer and the fourth layer, the fifth layer comprising an intermediate section of the second common waveguide, and further comprising a second conductive septum dividing an opening in the second common waveguide to define the third divided waveguide portion and the fourth divided waveguide portion.

33. The method of claim 32 , wherein the fifth layer has an H-frame cross-section.

34. The method of claim 32 , wherein:

the first layer further comprises an upper section of a third common waveguide and a fifth divided waveguide portion;

the second layer further comprises a lower section of the third common waveguide and a sixth divided waveguide portion; and

the third layer further comprising an intermediate section of the third common waveguide, and a third conductive septum dividing an opening in the third common waveguide to define the fifth divided waveguide portion and the sixth divided waveguide portion.

35. The method of claim 34 , wherein:

the first layer further comprises a first combiner/divider coupled to the first divided waveguide portion; and

the second layer further comprises a second combiner/divider coupled to the second divided waveguide portion.

36. The method of claim 35 , wherein:

the first combiner/divider is further coupled to the fifth divided waveguide portion within the first layer; and

the second combiner/divider is further coupled to the sixth divided waveguide portion within the second layer.

37. The method of claim 32 , wherein the first conductive septum is offset from a center of the third layer.

38. The method of claim 37 , wherein the first conductive septum is arranged on a surface of the third layer.

39. The method of claim 32 , wherein:

a bottom surface of the first layer contacts an upper surface of the third layer; and

an upper surface of the second layer contacts a lower surface of the third layer.

40. The method of claim 32 , further comprising forming a dielectric insert partially filling the first common waveguide.

41. The method of claim 32 , wherein:

the first layer further comprises a first combiner/divider coupled to the first divided waveguide portion; and

the second layer further comprises a second combiner/divider coupled to the second divided waveguide portion.

42. The method of claim 30 , wherein:

a third combiner/divider is coupled to the third divided waveguide portion within the second layer; and

a fourth combiner/divider is coupled to the fourth divided waveguide portion within the fourth layer.

43. The method of claim 32 , wherein the third layer further comprises a section of the second divided waveguide portion.

44. The method of claim 32 , further comprising a combiner/divider structure including combiner I dividers within the first, second and third layers and coupled to the first and second divided waveguide portions.