Environmentally controlled coating systems
Embodiments of an enclosed coating system according to the present teachings can be useful for patterned area coating of substrates in the manufacture of a variety of apparatuses and devices in a wide range of technology areas, for example, but not limited by, OLED displays, OLED lighting, organic photovoltaics, Perovskite solar cells, and organic semiconductor circuits. Enclosed and environmentally controlled coating systems of the present teachings can provide several advantages, such as: 1) Elimination of a range of vacuum processing operations such coating-based fabrication can be performed at atmospheric pressure. 2) Controlled patterned coating eliminates material waste, as well as eliminating additional processing typically required to achieve patterning of an organic layer. 3) Various formulations used for patterned coating with various embodiments of an enclosed coating apparatus of the present teachings can have a wide range of physical properties, such as viscosity and surface tension. Various embodiments of an enclosed coating system can be integrated with various components that provide a gas circulation and filtration system, a particle control system, a gas purification system, and a thermal regulation system and the like to form various embodiments of an enclosed coating system that can sustain an inert gas environment that is substantially low-particle for various coating processes of the present teachings that require such an environment.
1. A method for providing a coating on a substrate, comprising:
transferring the substrate to a slot die coating apparatus housed in an enclosure;
depositing an organic material in a pattern over a deposition region using the enclosed slot die coating apparatus, the deposition region being over at least a portion of an electronic device fabricated upon a substrate;
transferring the substrate with the organic material deposited thereon to an enclosed curing module;
supporting the substrate in the enclosed curing module using a pressurized gas cushion distributed between the substrate and a substrate support apparatus, the pressurized gas cushion being sufficient to float the substrate above the substrate support apparatus; and
performing an optical treatment on the organic material deposited on the substrate in the enclosed curing module to form an organic film layer in the pattern over the deposition region.
2. The method of claim 1 , wherein,
the substrate support apparatus comprises a porous material; and
the pressurized gas cushion is established by forcing gas through the porous material.
3. The method of claim 1 , wherein the pressurized gas cushion is established using pressurized gas.
4. The method of claim 1 , the pressurized gas cushion is established using a combination of a pressurized gas region and at least a partial vacuum region.
5. The method of claim 1 , further comprising maintaining a controlled processing environment at or near atmospheric conditions within the enclosure housing the slot die coating apparatus.
6. The method of claim 5 , further comprising maintaining the controlled processing environment at or below a specified particulate contamination level.
7. The method of claim 5 , wherein the particulate contamination level is maintained at 100 ppm or less.
8. The method of claim 1 , further comprising maintaining an inert gas environment within the enclosure housing the slot die coating apparatus.
9. The method of claim 1 , wherein the inert gas environment comprises an inert gas selected from nitrogen, any noble gas, and combinations thereof.
10. The method of claim 1 , wherein performing the optical treatment on the organic material comprises applying ultraviolet light to cure the organic material.
11. The method of claim 1 , further comprising sensing a position of the slot die coating assembly relative to the substrate during the depositing of the organic material.
12. The method of claim 1 , wherein the electronic device fabricated on the substrate comprises an organic-light emitting diode.