IP Library Granted Patent US 10,001,600
Granted Patent B2
US 10,001,600 · App. 15/487,918 · Granted Jun 19, 2018

Waveguide mode expander having an amorphous-silicon shoulder

Inventors: Guoliang Li (Albuquerque, NM); Damien Lambert (Los Altos, CA); Nikhil Kumar (Albuquerque, NM)
Assignee: Skorpios Technologies, Inc.
G02B6/14G02B6/1228G02B6/132G02B6/136G02B6/305G02B2006/12038G02B2006/12061G02B2006/12097G02B2006/12147G02B2006/12152
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Quick Facts
Patent No.
US 10,001,600
App. No.
15/487,918
Granted
Jun 19, 2018
Kind
B2
Abstract

A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.

Claims (32)

1. A method for manufacturing a waveguide mode expander, the method comprising:

providing a substrate having a device layer disposed on the substrate;

applying photoresist on the device layer;

etching the device layer to form a first recess, the first recess having a shape of a first pattern;

removing photoresist from the device layer;

filling the first recess with non-crystalline silicon to form a shoulder;

etching the device layer to define a waveguide;

etching the shoulder to align with the waveguide;

covering the shoulder with cladding;

applying photoresist on the cladding;

etching the cladding to form a second recess, the second recess having a shape of a second pattern;

removing photoresist from the cladding; and

filling the second recess with non-crystalline silicon, wherein:

the non-crystalline silicon forms a ridge of the waveguide mode expander;

the shoulder is between the substrate and the ridge; and

the ridge has a narrower width than the shoulder.

2. The method for manufacturing a waveguide mode expander of claim 1 , wherein etching the cladding uses a highly selective etch such that the cladding is more easily etched than the shoulder.

3. The method for manufacturing a waveguide mode expander of claim 1 , wherein the second pattern comprises a triangle taper.

4. The method for manufacturing a waveguide mode expander of claim 1 , wherein the second pattern comprises a parabolic taper.

5. The method for manufacturing a waveguide mode expander of claim 1 , further comprising:

applying, wherein the cladding is a first cladding, a second cladding on both the first cladding and the non-crystalline silicon;

etching the second cladding to form a third recess, the third recess having a shape of a third pattern; and

filling the third recess with additional non-crystalline silicon to form a second stage of the ridge, wherein filling the second recess formed a first stage of the ridge.

6. The method for manufacturing a waveguide mode expander of claim 5 , wherein:

the first stage is wider than the second stage; and

the second stage is thicker than the first stage.

7. The method for manufacturing a waveguide mode expander of claim 5 , further comprising:

applying, a third cladding the second cladding;

etching the third cladding to form a fourth recess, the fourth recess having a shape of a fourth pattern; and

filling the fourth recess with additional non-crystalline silicon to form a third stage of the ridge.

8. The method for manufacturing a waveguide mode expander of claim 1 , wherein filling the first recess with non-crystalline silicon comprises filling the first recess with amorphous silicon.

9. The method for manufacturing a waveguide mode expander of claim 8 , the method further comprising converting the amorphous silicon to polycrystalline silicon.

Assignments (1)
NUNC PRO TUNC ASSIGNMENT Recorded Apr 14, 2017
From: LI, GUOLIANG; LAMBERT, DAMIEN; KUMAR, NIKHIL
To: SKORPIOS TECHNOLOGIES, INC.
Reel/Frame 042012/0310 →
Continuity (5)
Division 14722983 · May 27, 2015
Division 14722970 · May 27, 2015
Provisional Application 62003404 · May 27, 2014
Provisional Application 62044867 · Sep 2, 2014
Related Publication 20170351028A1 · Dec 7, 2017