Photovoltaic device encapsulation
A photovoltaic device comprising a first electrode, a second electrode, an active layer disposed at least partially between the first and second electrodes, an interfacial layer disposed at least partially between the first and second electrodes, and a non-stoichiometric oxide layer disposed at least partially between and in contact with one of the first or second electrodes and an encapsulant layer. The active layer of the photovoltaic device comprises a photoactive material.
1. A photovoltaic device comprising:
a first substrate and a second substrate;
a first electrode;
a second electrode;
an active layer disposed at least partially between the first and second electrodes, the active layer comprising a photoactive material;
an interfacial layer disposed at least partially between the first and second electrodes;
an encapsulant layer disposed at least partially between the first substrate and the first electrode or between the second substrate and the second electrode; and
a reactive non-stoichiometric oxide layer disposed at least partially between the first or second electrodes and the encapsulant layer, wherein the reactive non-stoichiometric oxide layer is in direct contact with both the first or second electrodes and the encapsulant layer, wherein the reactive non-stoichiometric oxide layer comprises V 2 O 3 , the first or second electrode is disposed between the reactive non-stoichiometric oxide layer and the interfacial layer, the encapsulant layer has a permeability equal to or less than 200 g/m 2 per day when measured at 85 degrees Celsius, and the encapsulant layer comprises one or more compounds each selected from the group consisting of an epoxy, silicone, polypropylene, polybutylene, polyisobutylene, glass, or combinations thereof,
wherein the reactive non-stoichiometric oxide layer further comprises one or more compounds each selected from the group consisting of SiO, CrO 2 , MnO, FeO, CeO, LaO, HfO, ZrO, TiO, AlO, GeO, or combinations thereof.
2. The photovoltaic device of claim 1 , wherein the reactive non-stoichiometric oxide layer further comprises SiO.
3. The photovoltaic device of claim 1 , wherein the photoactive material comprises a perovskite material.
4. The photovoltaic device of claim 1 , wherein the interfacial layer comprise an oxide, sulfide, or nitride of one or more metals selected from the group consisting of Al, Bi, In, Mo, Ni, Si, Ti, V, Nb, Sn Zn and combinations thereof.
5. The photovoltaic device of claim 1 , wherein the reactive non-stoichiometric oxide layer has a thickness equal to or greater than one nanometer and less than or equal to fifty nanometers.
6. The photovoltaic device of claim 1 , wherein the encapsulant layer has a thickness equal to or greater than ten microns and less than or equal to ten millimeters.
7. The photovoltaic device of claim 1 , wherein the reactive non-stoichiometric oxide layer further comprises one or more compounds selected from the group consisting of Fe 3 O 4 , CuFeO 2 , Mn 3 O 4 .
8. The photovoltaic device of claim 1 , wherein the first and second electrode layers comprise ITO.
9. A device comprising:
a first substrate and a second substrate;
a first electrode;
a second electrode;
an active layer disposed at least partially between the first and second electrodes;
an encapsulant layer disposed at least partially between the first substrate and the first electrode or between the second substrate and the second electrode; and
a reactive non-stoichiometric oxide layer disposed at least between the first or second electrodes and the encapsulant layer, wherein the reactive non-stoichiometric oxide layer is in direct contact with both the first or second electrodes and the encapsulant layer, wherein the reactive non-stoichiometric oxide layer comprises V 2 O 3 , the first or second electrode is disposed between the reactive non-stoichiometric oxide layer and the active layer, the reactive non-stoichiometric oxide layer has a thickness less than or equal to fifty nanometers, the encapsulant layer has a permeability equal to or less than 200 g/m 2 per day when measured at 85 degrees Celsius, and the encapsulant layer comprises one or more compounds each selected from the group consisting of an epoxy, silicone, polypropylene, polybutylene, polyisobutylene, glass, or combinations thereof, wherein the reactive non-stoichiometric oxide layer further comprises one or more compounds each selected from the group consisting of SiO, CrO 2 , MnO, FeO, CeO, LaO, HfO, ZrO, TiO, AlO, GeO, or combinations thereof.
10. The device of claim 9 , wherein the reactive non-stoichiometric oxide layer further comprises SiO.
11. The device of claim 9 , wherein the active layer comprises a one or more transistors.
12. The device of claim 9 , wherein the active layer comprises one or more interfacial layers comprising an oxide, sulfide, or nitride of one or more metals selected from the group consisting of Al, Bi, In, Mo, Ni, Si, Ti, V, Nb, Sn, Zn and combinations thereof.
13. The device of claim 9 , wherein the reactive non-stoichiometric oxide layer has a thickness equal to or greater than one nanometer.
14. The device of claim 9 , wherein the encapsulant layer has a thickness equal to or greater than ten microns and less than or equal to ten millimeters.
15. The device of claim 9 , wherein the reactive non-stoichiometric oxide layer further comprises one or more compounds each selected from the group consisting of Fe 3 O 4 , CuFeO 2 , and Mn 3 O 4 .
16. The device of claim 9 , wherein the first and second electrode layers comprise ITO.
17. A photovoltaic device comprising:
a first substrate and a second substrate;
a first electrode;
a second electrode;
an active layer disposed at least partially between the first and second electrodes, the active layer comprising a photoactive material ;
an interfacial layer disposed at least partially between the first and second electrodes;
a first encapsulant layer disposed at least partially between the first substrate and the first electrode;
a second encapsulant layer disposed at least partially between the second substrate and the second electrode;
a first reactive non-stoichiometric oxide layer disposed at least partially between the first electrode and the first encapsulant layer, wherein the first reactive non-stoichiometric oxide layer is in direct contact with both the first electrode and the first encapsulant layer, wherein the first reactive non-stoichiometric oxide layer comprises V 2 O 3 , and the first electrode is disposed between the first reactive non-stoichiometric oxide layer and the interfacial layer; and
a second reactive non-stoichiometric oxide layer disposed at least partially between and in contact with the second electrode and the second encapsulant layer, wherein the second reactive non-stoichiometric oxide layer comprises V 2 O 3 , second electrode is disposed between the second reactive non-stoichiometric oxide layer and the interfacial layer, the first and second encapsulant layers have a permeability equal to or less than 200 g/m 2 per day when measured at 85 degrees Celsius, and the encapsulant layer comprises one or more compounds each selected from the group consisting of an epoxy, silicone, polypropylene, polybutylene, polyisobutylene, glass, or combinations thereof, wherein the first and second reactive non-stoichiometric oxide layers further comprise one or more compounds each selected from the group consisting of SiO, CrO 2 , MnO, FeO, CeO, LaO, HfO, ZrO, TiO, AlO, GeO, or combinations thereof.
18. The device of claim 17 , wherein the first and second reactive non-stoichiometric oxide layers further comprise SiO.