Quantum dots having a nanocrystalline core, a nanocrystalline shell surrounding the core, and an insulator coating for the shell
Semiconductor structures having insulators coatings and methods of fabricating semiconductor structures having insulators coatings are described. In an example, a method of coating a semiconductor structure involves adding a silicon-containing silica precursor species to a solution of nanocrystals. The method also involves, subsequently, forming a silica-based insulator layer on the nanocrystals from a reaction involving the silicon-containing silica precursor species. The method also involves adding additional amounts of the silicon-containing silica precursor species after initial forming of the silica-based insulator layer while continuing to form the silica-based insulator layer to finally encapsulate each of the nanocrystals.
1. A method of coating a semiconductor structure, the method comprising:
adding a silicon-containing silica precursor species to a solution of oblong-shaped semiconductor nanocrystals;
forming, subsequently, a silica-based insulator layer on the oblong-shaped semiconductor nanocrystals from a reaction involving the silicon-containing silica precursor species; and
adding additional amounts of the silicon-containing silica precursor species to the solution of oblong-shaped semiconductor nanocrystals after initial forming of the silica-based insulator layer and while continuing to form the silica-based insulator layer to encapsulate each of the oblong-shaped semiconductor nanocrystals in a non-oblong-shaped silica-based insulator layer formed by two bulbous portions separated by a waist portion, the non-oblong-shaped silica-based insulator layer bonded directly to the oblong-shaped semiconductor nanocrystal.
2. The method of claim 1 , wherein adding additional amounts of the silicon-containing silica precursor species to the solution comprises using multiple discrete injections of the silicon-containing silica precursor species to the solution.
3. The method of claim 1 , wherein adding additional amounts of the silicon-containing silica precursor species comprises using a single prolonged injection of the silicon-containing silica precursor species to the solution.
4. The method of claim 1 , wherein adding the silicon-containing silica precursor species to the solution comprises adding tetraethylorthosilicate (TEOS).
5. The method of claim 1 , wherein forming, subsequently, the silica-based insulator layer comprises encapsulating the oblong-shaped semiconductor nanocrystals individually and discretely.
6. The method of claim 1 , wherein adding the silicon-containing silica precursor species to the solution comprises adding tetrapropylorthosilicate (TPOS), tetrabutlyorthosilicate (TBOS), or both.
7. The method of claim 1 , wherein continuing to form the silica-based insulator layer to encapsulate each of the oblong-shaped semiconductor nanocrystals in the non-oblong-shaped silica-based insulator layer formed by two bulbous portions separated by the waist portion comprises forming a dumbbell-shaped silica coating encapsulating each oblong-shaped semiconductor nanocrystal.
8. The method of claim 1 , wherein each oblong-shaped semiconductor nanocrystal in the solution has an anisotropic nanocrystalline core comprising a first semiconductor material and having an aspect ratio between, but not including, 1.0 and 2.0, and a nanocrystalline shell from a second, different, semiconductor material to at least partially surround the anisotropic nanocrystalline core.