IP Library › Granted Patent US 10,151,892
Granted Patent B2
US 10,151,892 · App. 15/494,236 · Granted Dec 11, 2018

Method to bond two surfaces with precured epoxy and optical subassembly including the same

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Quick Facts
Patent No.
US 10,151,892
App. No.
15/494,236
Granted
Dec 11, 2018
Kind
B2
Abstract

In an example, a method may include dispensing a portion of epoxy on a first surface. The method may also include curing the portion of epoxy to form precured epoxy. The method may also include positioning the first surface and a second surface separated from each other by a gap. The precured epoxy is located within the gap between the first surface and the second surface. The method may also include dispensing bulk epoxy into the gap and in contact with the precured epoxy, the first surface, and the second surface. The method may also include curing the bulk epoxy to bond the first surface to the second surface.

Claims (56)

1. A method to bond a first surface to a second surface, the method comprising:

dispensing a portion of epoxy on the first surface;

curing the portion of epoxy to form precured epoxy;

positioning the first surface and the second surface separated from each other by a gap, wherein the precured epoxy is located within the gap between the first surface and the second surface;

dispensing bulk epoxy into the gap and in contact with the precured epoxy, the first surface, and the second surface; and

curing the bulk epoxy to bond the first surface to the second surface.

2. The method of claim 1 , wherein:

the portion of epoxy comprise a first portion of epoxy;

the precured epoxy comprises a first precured epoxy;

curing the portion of epoxy to form the precured epoxy comprises curing the first portion of epoxy for a first predetermined amount of time to form the first precured epoxy; and

the method further comprises:

after curing the first portion of epoxy and before dispensing the bulk epoxy, dispensing a second portion of epoxy on the first surface at a different location than the first portion of epoxy; and

curing the second portion of epoxy for the first predetermined amount of time to form a second precured epoxy.

3. The method of claim 2 , further comprising:

after curing the second portion of epoxy and before dispensing the bulk epoxy, dispensing a third portion of epoxy on the first surface at a different location than the first portion of epoxy and the second portion of epoxy;

curing the third portion of epoxy for the first predetermined amount of time to form a third precured epoxy;

after curing the third portion of epoxy and before dispensing the bulk epoxy, dispensing a fourth portion of epoxy on the first surface at a different location than the first portion of epoxy, the second portion of epoxy, and the third portion of epoxy; and

curing the fourth portion of epoxy for a second predetermined amount of time to form a fourth precured epoxy.

4. The method of claim 3 , wherein the second predetermined amount of time is longer than the first predetermined amount of time.

5. The method of claim 4 , wherein the first predetermined amount of time is 30 minutes and the second predetermined amount of time is 2 hours.

6. The method of claim 3 , wherein the first surface includes an inner cylindrical wall surface of an optical subassembly (OSA) block, and wherein the first portion of epoxy, the second portion of epoxy, the third portion of epoxy, and the fourth portion of epoxy are angularly spaced around on the inner cylindrical wall surface of the OSA block.

7. The method of claim 1 , wherein:

the first surface includes an inner cylindrical wall surface of an optical subassembly (OSA) block;

the inner cylindrical wall surface of the OSA block defines a cylindrical cavity;

the second surface includes an outer cylindrical wall surface of an OSA receptacle; and

positioning the first surface and the second surface separated from each other by the gap includes positioning the outer cylindrical wall surface of the OSA receptacle at least partially inside the cylindrical cavity and separated from the inner cylindrical wall surface of the OSA block by a cylindrical gap.

8. The method of claim 7 , wherein an epoxy bond shear strength between the OSA block and the OSA receptacle is at least 7 kgF.

9. The method of claim 7 , wherein dispensing the bulk epoxy into the gap and in contact with the precured epoxy, the first surface, and the second surface includes dispensing the bulk epoxy into the cylindrical gap with an epoxy coverage of at least 40%.

10. An optical subassembly (OSA), comprising:

a first surface;

a second surface separated from the first surface by a gap;

precured epoxy on the first surface and located within the gap; and

bulk epoxy in the gap and in contact with the precured epoxy, the first surface, and the second surface, the bulk epoxy bonding the first surface and the second surface together,

wherein:

the precured epoxy is formed by dispensing and curing a portion of epoxy on the first surface before the bulk epoxy is dispensed into the gap and cured; and

the precured epoxy is separated from the second surface by the gap.

11. The OSA of claim 10 , wherein the portion of epoxy comprise a first portion of epoxy and a second portion of epoxy such that the precured epoxy includes a first precured epoxy and a second precured epoxy, wherein the first portion of epoxy is dispensed and cured on the first surface to form the first precured epoxy before the second portion of epoxy is dispensed and cured on the first surface to form the second precured epoxy.

12. The OSA of claim 11 , wherein the portion of epoxy further comprises a third portion of epoxy and a fourth portion of epoxy such that the precured epoxy further includes a third precured epoxy and a fourth precured epoxy, wherein the third portion of epoxy is dispensed and cured on the first surface to form the third precured epoxy after the second portion of epoxy is dispensed and on the first surface to form the second precured epoxy, wherein the fourth portion of epoxy is dispensed and cured on the first surface to form the fourth precured epoxy after the third portion of epoxy is dispensed and cured on the first surface to form the third precured epoxy.

13. The OSA of claim 12 , wherein the first surface includes an inner cylindrical wall surface of an OSA block, wherein the first precured epoxy, the second precured epoxy, the third precured epoxy, and the fourth precured epoxy are angularly spaced around the inner cylindrical wall surface.

14. The OSA of claim 12 , wherein the first portion of epoxy, the second portion of epoxy, and the third portion of epoxy is each precured for a first predetermined amount of time and the fourth portion of epoxy is precured for a second predetermined amount of time.

15. The OSA of claim 14 , wherein the second predetermined amount of time is longer than the first predetermined amount of time.

16. The OSA of claim 15 , wherein the first predetermined amount of time is 30 minutes and the second predetermined amount of time is 2 hours.

17. The OSA of claim 10 , wherein the first surface includes an inner cylindrical wall surface of an OSA block, the inner cylindrical wall surface of the OSA block defines a cylindrical cavity, and the second surface includes an outer cylindrical wall surface of an OSA receptacle, and wherein the outer cylindrical wall surface of the OSA receptacle is positioned at least partially inside the cylindrical cavity and separated from the inner cylindrical wall surface of the OSA block by a cylindrical gap.

18. The OSA of claim 17 , wherein an epoxy bond shear strength between the OSA block and the OSA receptacle is at least 7 kgF and an epoxy coverage of the bulk epoxy in the cylindrical gap is at least 40%.

19. A method to bond a first surface of an optical subassembly (OSA) block to a second surface of an OSA receptacle, the method comprising:

dispensing a first portion of epoxy on the first surface;

curing the first portion of epoxy to form first precured epoxy;

dispensing a second portion of epoxy on the first surface;

curing the second portion of epoxy to form second precured epoxy;

dispensing a third portion of epoxy on the first surface;

curing the third portion of epoxy to form third precured epoxy;

dispensing a fourth portion of epoxy on the first surface;

curing the fourth portion of epoxy to form fourth precured epoxy;

positioning the first surface and the second surface separated from each other by a gap, wherein the first precured epoxy, the second precured epoxy, the third precured epoxy, and the fourth precured epoxy are located within the gap between the first surface and the second surface;

dispensing bulk epoxy into the gap and in contact with the first precured epoxy, the second precured epoxy, the third precured epoxy, the fourth precured epoxy, the first surface, and the second surface; and

curing the bulk epoxy to bond the first surface to the second surface.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2017
From: CHONG, KAM MENG; SIEW, CHIEW LOON; WONG, YIH PIN; SOONG, CHEE WAI; ARIFIN, SARAH IDAYU BINTI ZAINAL; AZIZI, AZIEMA BINTI MOHAMAD; SINGH, SHASHIPAL SINGH DALBIR
To: FINISAR CORPORATION
Reel/Frame 042131/0384 →