Luminaire including a heat dissipation structure
There are provided luminaire assemblies and methods of assemblies thereof. For example, there is provided a luminaire assembly including a hollow core and an overmolded thermal dissipation structure molded over the hollow core.
1. A method for assembling a luminaire, the method comprising:
performing a metal extrusion process for providing an extruded hollow core having an approximately V-shape cross-section and comprising at least one sidewall having an outer surface and a platform configured to hold a printed circuit board;
overmolding a thermal dissipation structure on the outer surface of the at least one sidewall of the extruded hollow core, the overmolded thermal dissipation structure including a lip configured to support an edge of the extruded hollow core, wherein the overmolded thermal dissipation structure includes a plurality of fins which are equally spaced and arranged perpendicular to an axis of extrusion of the extruded hollow core; and
disposing a lens beneath the extruded hollow core in a direction opposite to the overmolded thermal dissipation structure, a portion of the lens being disposed above the lip of the overmolded thermal dissipation structure, the lens having a curved shape extending in a direction opposite to the overmolded thermal dissipation structure;
wherein said platform has-a light source disposed thereon.
2. The method of claim 1 , wherein the overmolded thermal dissipation structure and the hollow core are made of the same material.
3. The method of claim 1 , wherein the overmolded thermal dissipation structure and the hollow core are made of one of (i) aluminum and (ii) copper.
4. The method of claim 1 , wherein the light source is a light emitting diode (LED).
5. The method of claim 1 , wherein coefficients of thermal expansion of the overmolded thermal dissipation structure and of the hollow core are substantially the same.
6. A method for assembling a luminaire, the method comprising:
providing an overmolded thermal dissipation structure on an extruded hollow core configured to support a platform having a light source disposed thereon and wherein the extruded hollow core has a substantially V-shaped cross-section, the overmolded thermal dissipation structure including a lip configured to support an edge of the extruded hollow core, wherein the overmolded thermal dissipation structure includes a plurality of fins which are equally spaced and arranged perpendicular to an axis of extrusion of the extruded hollow core; and
providing a lens disposed beneath the extruded hollow core in a direction opposite to the overmolded thermal dissipation structure, a portion of the lens being disposed above the lip of the overmolded thermal dissipation structure, the lens having a curved shape extending in a direction opposite to the overmolded thermal dissipation structure.
7. The method of claim 6 , further comprising disposing the overmolded thermal dissipation structure on an outer surface of the extruded hollow core.
8. A luminaire assembly, comprising:
a hollow core, wherein the hollow core includes an extruded metal and has an approximately V-shape cross-section;
an overmolded thermal dissipation structure molded directly over the hollow core, and the hollow core and the overmolded thermal dissipation structure molded directly over the hollow core are tightly fitted together, wherein the overmolded thermal dissipation structure includes a plurality of fins which are equally spaced and arranged perpendicular to an axis of extrusion of the hollow core;
a printed circuit board assembled on the hollow core and an LED light source disposed on the printed circuit board; and
a lens disposed beneath the hollow core in a direction opposite to the overmolded thermal dissipation structure, the lens having a curved shape extending in a direction opposite to the overmolded thermal dissipation structure;
wherein the hollow core includes a cavity that passes electrical wiring interfacing with the printed circuit board, and wherein the hollow core and the overmolded thermal dissipation structure each are comprised of aluminum.
9. The luminaire assembly claim 8 , further comprising the printed circuit board disposed on a platform.
10. The luminaire assembly of claim 8 , wherein the hollow core and the overmolded thermal dissipation structure are made from materials that have substantially the same coefficient of thermal expansion (CTE).
11. A luminaire assembly, comprising:
a hollow core, wherein the hollow core includes an extruded metal and has a shaped cross- section, the hollow core having a body extending between two open ends;
an overmolded thermal dissipation structure molded over the hollow core, wherein the overmolded thermal dissipation structure includes a plurality of fins;
a printed circuit board assembled on the outside of the body of the hollow core at a location between the two open ends, and a light source comprising a plurality of light emitting diodes (LEDs) disposed on the printed circuit board; and
a lens disposed beneath the hollow core in a direction opposite to the overmolded thermal dissipation structure;
wherein the hollow core includes a cavity configured to pass electrical wiring interfacing with the printed circuit board; and
wherein the hollow core and the overmolded thermal dissipation structure each are comprised of aluminum.
12. The luminaire assembly claim 1 , further comprising the printed circuit board disposed on a platform of the body of the hollow core.
13. The luminaire assembly of claim 11 , wherein the hollow core and the overmolded thermal dissipation structure are made from materials that have substantially the same coefficient of thermal expansion (CTE).