Plated material and terminal using this plated material
A plated material includes a base metal made from Cu or an alloy containing Cu as a main raw material, an underlayer made from Ni formed on the base metal, and an Ag plated layer formed on the underlayer. A thickness of the underlayer is 0.1 μm to 1.0 μm. A thickness of the Ag plated layer is 1.0 μm or less.
1. A plated material comprising;
a base metal made from Cu or an alloy containing Cu as a main raw material;
an underlayer made from Ni formed on the base metal; and
an Ag plated layer directly formed on the underlayer, wherein
a thickness of the underlayer is 0.1 μm to 1.0 μm,
a thickness of the Ag plated layer is 1.0 μm or less, and
the Ag plated layer is exposed, wherein the Ag plated layer has a surface Vickers hardness Hv of 65 or more, and has a contact resistance of 1 mΩ or less when a contact load of 1 N is applied after the plated material is left to stand for a few days in a SO 2 atmosphere.
2. A terminal, wherein the plated material according to claim 1 is used at least in a sliding portion.
3. The terminal according to claim 2 , wherein a thickness of the base metal made from Cu or an alloy containing Cu as a main raw material is 0.15 mm to 0.8 mm.
4. The plated material according to claim 1 , wherein the Ag plated layer comprises a plurality of interstices.
5. The plated material according to claim 4 , wherein the interstices extend from an exposed surface of the Ag plated layer to the underlayer.
6. The plated material according to claim 1 , wherein the Ag plated layer consists of Ag.