IP Library Granted Patent US 10,291,206
Granted Patent B2
US 10,291,206 · App. 15/497,606 · Granted May 14, 2019

Acoustic wave device

Inventors: Taisei Irieda (Tokyo, JP); Yoshio Satoh (Tokyo, JP); Tokihiro Nishihara (Tokyo, JP); Shinji Taniguchi (Tokyo, JP)
Assignee: TAIYO YUDEN CO., LTD.
H03H9/70H01L41/0805H03H9/02228H03H9/173H03H9/205H03H9/25H03H9/542H03H9/64H03H9/725H03H9/0014H03H9/131H03H9/706
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Quick Facts
Patent No.
US 10,291,206
App. No.
15/497,606
Granted
May 14, 2019
Kind
B2
Abstract

An acoustic wave device includes: a piezoelectric thin film resonator that is connected between a first node and a second node; and a resonant circuit that is connected in parallel with the piezoelectric thin film resonator between the first node and the second node, and has a resonant frequency f 0 that meets a condition of 2×fa×0.92≤f 0 where fa represents an antiresonant frequency of the piezoelectric thin film resonator.

Claims (25)

1. An acoustic wave device comprising:

a piezoelectric thin film resonator that is connected between a first node and a second node; and

a resonant circuit that is connected in parallel with the piezoelectric thin film resonator between the first node and the second node, and has a resonant frequency f 0 that is equal to or more than 2×fa×0.92 where fa represents an antiresonant frequency of the piezoelectric thin film resonator.

2. The acoustic wave device according to claim 1 , wherein

the resonant frequency f 0 is equal to or more than 2×fa×0.95 and is equal to or less than 2×fa×1.08.

3. The acoustic wave device according to claim 1 , wherein

the resonant circuit includes a capacitor and an inductor connected in series between the first node and the second node.

4. The acoustic wave device according to claim 1 , wherein

the resonant circuit includes an acoustic wave resonator connected in series between the first node and the second node.

5. The acoustic wave device according to claim 4 , wherein

the acoustic wave resonator is another piezoelectric thin film resonator or a Lamb wave resonator,

the piezoelectric thin film resonator and the acoustic wave resonator are formed on a same substrate, and

the piezoelectric thin film resonator and the acoustic wave resonator share a single piezoelectric film.

6. The acoustic wave device according to claim 1 , further comprising:

a filter that includes one or more series resonators connected in series between an input terminal and an output terminal and one or more parallel resonators connected in parallel between the input terminal and the output terminal, wherein

at least one of the one or more series resonators and the one or more parallel resonators is the piezoelectric thin film resonator with which the resonant circuit is connected in parallel.

7. The acoustic wave device according to claim 6 , wherein

at least one of a series resonator located closest to the output terminal among the one or more series resonators and a parallel resonator located closest to the output terminal among the one or more parallel resonators is the piezoelectric thin film resonator with which the resonant circuit is connected in parallel.

8. The acoustic wave device according to claim 7 , wherein

one of the series resonator located closest to the output terminal among the one or more series resonators and the parallel resonator located closest to the output terminal among the one or more parallel resonators is the piezoelectric thin film resonator with which the resonant circuit is connected in parallel, and

another of the series resonator located closest to the output terminal and the parallel resonator located closest to the output terminal is divided into a first resonator and a second resonator so that a second harmonic is canceled.

9. The acoustic wave device according to claim 1 , further comprising:

a filter that includes the piezoelectric thin film resonator with which the resonant circuit is connected in parallel.

10. The acoustic wave device according to claim 9 , further comprising

a multiplexer including the filter.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2017
From: IRIEDA, TAISEI; SATOH, YOSHIO; NISHIHARA, TOKIHIRO; TANIGUCHI, SHINJI
To: TAIYO YUDEN CO., LTD.
Reel/Frame 042151/0401 →
Priority Claims (1)
JP 2016-116558 · Jun 10, 2016 · national
Continuity (1)
Related Publication 20170359050A1 · Dec 14, 2017
Cited By (1)
US 12,580,550