Organic EL device
According to one embodiment, an organic EL device includes an insulating substrate including a first main surface and a second main surface, a switching element formed on the insulating substrate at the first main surface side, a first electrode electrically connected to the switching element, a second electrode opposed to the first electrode, an organic luminescent layer disposed between the first electrode and the second electrode, a reflective plate disposed between the insulating substrate and the first electrode, and a conductive film covering the second main surface of the insulating substrate.
1. An organic EL device comprising:
an array substrate including:
an insulating substrate including a first main surface and a second main surface,
an organic luminescence layer on a first main surface side of the insulating substrate, and a conductive film directly on the second main surface;
a flexible printed circuit board on the first main surface side of the insulating substrate; and
a driving IC chip on the first main surface side of the insulating substrate, wherein
the conductive film is formed over an entirety of the array substrate,
the driving IC chip overlaps the conductive film, and
a cutting plane of the insulating substrate and a cutting plane of the conductive film are flush with one another.
2. An organic EL device comprising:
an array substrate including:
an insulating substrate including a first main surface and a second main surface,
an organic luminescence layer on a first main surface side of the insulating substrate, and a conductive film directly on the second main surface;
a flexible printed circuit board on the first main surface side of the insulating substrate; and
a driving IC chip on the first main surface side of the insulating substrate, wherein
the conductive film is formed over an entirety of the array substrate,
the driving IC chip overlaps the conductive film, and
the flexible printed circuit board overlaps the conductive film.
3. An organic EL device comprising:
an array substrate including:
an insulating substrate including a first main surface and a second main surface,
an organic luminescence layer on a first main surface side of the insulating substrate, and a conductive film directly on the second main surface;
a flexible printed circuit board on the first main surface side of the insulating substrate; and
an insulative cover,
wherein
the conductive film is formed over an entirety of the array substrate, and
the conductive film is sandwiched between the insulating cover and the insulating substrate.
4. The organic EL device of claim 2 , further comprising an insulating cover, wherein the conductive film is sandwiched between the insulating cover and the insulating substrate.
5. The organic EL device of claim 1 , wherein the conductive film is formed of a nitride.
6. The organic EL device of claim 2 , wherein the conductive film is formed of a nitride.
7. The organic EL device of claim 1 , wherein the conductive film is formed of a high-melting-point metal nitride.
8. The organic EL device of claim 2 , wherein the conductive film is formed of a high-melting-point metal nitride.
9. The organic EL device of claim 1 , wherein the insulating substrate is formed of resin material.
10. The organic EL device of claim 2 , wherein the insulating substrate is formed of resin material.
11. The organic EL device of claim 3 , wherein the insulating cover overlaps the flexible printed circuit board.
12. The organic EL device of claim 4 , wherein the insulating cover overlaps the flexible printed circuit board.
13. The organic EL device of claim 2 , wherein a cutting plane of the insulating substrate and a cutting plane of the conductive film are flush with one another.
14. The organic EL device of claim 3 , wherein a cutting plane of the insulating substrate and a cutting plane of the conductive film are flush with one another.
15. The organic EL device of claim 14 , wherein the insulating cover exposes the cutting plane of the conductive film.
16. The organic EL device of claim 1 , further comprising an insulating cover, wherein
the conductive film is sandwiched between the insulating cover and the insulating substrate, and
the insulating cover exposes the cutting plane of the conductive film.
17. The organic EL device of claim 14 , wherein the insulating cover covers an entire of the cutting plane of the conductive film.