Light emitting device
A light emitting device includes a substrate, micro light emitting chips, reflective structures and conductive bumps. The substrate has pads. The micro light emitting chips are disposed on the substrate separately, and each of the micro light emitting chips includes a light emitting layer, a first type electrode and a second type electrode isolated from the first type electrode, wherein the first type electrode and the second type electrode are disposed on one side of the light emitting layer. The reflective structures are physically separated from each other and spaced apart from the substrate. Each of the reflective structures is disposed around one of the micro light emitting chips. The conductive bumps and located between the micro light emitting chips and the substrate, wherein the micro light emitting chips are electrically boned to the pads of the substrate through the conductive bumps.
1. A light emitting device, comprising:
a substrate, having a plurality of pads;
a plurality of micro light emitting chips, disposed on the substrate separately, and each of the micro light emitting chips comprising a light emitting layer, a first type electrode and a second type electrode separated from the first type electrode, wherein the first type electrode and the second type electrode are disposed on one side of the light emitting layer;
a plurality of reflective structures, physically separated from each other and spaced apart from the substrate, wherein each of the reflective structures is disposed around one of the micro light emitting chips; and
a plurality of conductive bumps, disposed corresponding to the micro light emitting chips and located between the micro light emitting chips and the substrate, wherein the micro light emitting chips are electrically bonded to the pads of the substrate through the conductive bumps,
wherein each of the micro light emitting chips further comprises a first type semiconductor layer, a second type semiconductor layer, a via hole, and an insulating layer, the light emitting layer is located between the first type semiconductor layer and the second type semiconductor layer, the first type electrode is electrically connected to the first type semiconductor layer, and the second type electrode is electrically connected to the second type semiconductor layer, the via hole penetrates through the first type semiconductor layer and the light emitting layer, and the second type electrode is disposed within the via hole to electrically contact the second type semiconductor layer, the insulating layer is disposed on the first type semiconductor layer and a sidewall of the via hole, the insulating layer exposes a portion of the surface of the first type semiconductor layer to form a contact opening, and the first type electrode is disposed on the contact opening to contact the first type semiconductor layer, and the insulating layer exposes the second type semiconductor layer in the via hole, and the first type electrode and the second type electrode are disposed between the substrate and the first type semiconductor layer,
wherein a thickness of one of the reflective structures is thinning gradually toward the substrate, and each of the reflective structures directly covers side surfaces of the first semiconductor layer and side surfaces of the light emitting layer of each of the micro light emitting chips.
2. The light emitting device as claimed in claim 1 , wherein the reflective structures and the insulating layer are the same layer in each of the micro light emitting chips.
3. The light emitting device as claimed in claim 1 , wherein a material of the reflective structures is an insulating material.
4. The light emitting device as claimed in claim 3 , wherein each of the reflective structures is a multi-layer structure.
5. The light emitting device as claimed in claim 1 , wherein a maximum peak current density of an external quantum efficiency curve of each of the micro light emitting chips is between 0.01 A/cm 2 and 2 A/cm 2 .
6. The light emitting device as claimed in claim 1 , wherein a defect density of each of the micro light emitting chips is between 10 4 /cm 2 and 10 8 /cm 2 .