Component mounting method and component mounting device

1. A component mounting method for using a component mounting tool which includes a plurality of claw sections that pinch and pick up a component at a component supply position, and release the component on a board to mount the component onto a predetermined position of the board, and the component mounting tool being mounted to be movable between the component supply position and the board, the method comprising:

determining pinching locations of the component to be pinched by the plurality of claw sections such that positions and a release operation of the plurality of claw sections do not interfere with mounted components which are already mounted on the board when the plurality of claw sections release the component;

defining standard pinching locations at which the component is ordinarily pinched by the plurality of claw sections;

when the standard pinching locations of the component interfere with the mounted components during at least one of positions and a release operation of the plurality of claw sections, changing the standard pinching locations of the component to final pinching locations of the component to avoid interference; and

pinching the component at the final pinching locations and mounting the component onto the board by the plurality of claw sections.

2. The component mounting method according to claim 1 ,

wherein the standard pinching locations of the component are defined as side surfaces of a body of the component, and are defined using body center data which indicates a center of the body, and standard angle data which indicates directional angles at which the standard pinching locations lie based on the center of the body as a reference,

wherein the pinching locations of the component are defined using pinching center deviation data which indicates a deviation amount of a pinching center which is deviated from the center of the body of the component, and angle data which indicates the directional angles at which the pinching locations lie based on the pinching center as a reference,

wherein the pinching center deviation data is set to zero data and the angle data is caused to match the standard angle data when the pinching locations of the component are not changed from the standard pinching locations, and

wherein at least one change of a pinching center change in which the pinching center deviation data is set to non-zero data and an angle change in which the angle data is set to data which is different from the standard angle data when the pinching locations of the component are changed from the standard pinching locations is performed.

3. The component mounting method according to claim 2 ,

wherein the standard pinching locations of the component are defined by component shape data which holds various values relating to a shape of the component, and

wherein the pinching locations of the component are defined in board sequence data which defines a mounting order and mounting coordinate positions of a plurality of components to be mounted onto the board.

4. The component mounting method according to claim 1 ,

wherein the standard pinching locations of the component are defined by component shape data which holds various values relating to a shape of the component, and

wherein the pinching locations of the component are defined in board sequence data which defines a mounting order and mounting coordinate positions of a plurality of components to be mounted onto the board.

5. The component mounting method according to claim 4 ,

wherein a required time for mounting the plurality of components onto the board is called a mounting cycle time, and

wherein in a case in which at least one of positions and a release operation of the plurality of claw sections interferes with the mounted components when the plurality of claw sections pinch the standard pinching locations of the component,

a first mounting cycle time of a case in which the interference is avoided using a first method of changing the pinching locations of the component from the standard pinching locations is estimated,

a second mounting cycle time of a case in which the interference is avoided using a second method of changing a mounting order of the plurality of components which is defined in the board sequence data is estimated, and

the method with a shorter time among the first mounting cycle time and the second mounting cycle time is adopted.

6. A component mounting device comprising:

a component mounting tool which includes a plurality of claw sections that pinch and pick up a component at a component supply position, and release the component on a board to mount the component onto a predetermined position of the board, and the component mounting tool being mounted to be movable between the component supply position and the board; and

a pinching location determination device to determine pinching locations of the component to be pinched by the plurality of claw sections such that positions and a release operation of the plurality of claw sections do not interfere with mounted components which are already mounted on the board when the plurality of claw sections release the component, and to define standard pinching locations at which the component is ordinarily pinched by the plurality of claw sections,

wherein when the standard pinching locations of the component interfere with the mounted components during at least one of positions and a release operation of the plurality of claw sections, the pinching location determination device changes the standard pinching locations of the component to final pinching locations of the component to avoid interference.

7. A component mounting device comprising:

a component mounting tool which includes a plurality of claw sections that pinch and pick up a component at a component supply position, and release the component on a board to mount the component onto a predetermined position of the board, and the component mounting tool being mounted to be movable between the component supply position and the board; and

circuitry configured to determine pinching locations of the component to be pinched by the plurality of claw sections such that positions and a release operation of the plurality of claw sections do not interfere with mounted components which are already mounted on the board when the plurality of claw sections release the component, and to define standard pinching locations at which the component is ordinarily pinched by the plurality of claw sections,

wherein when the standard pinching locations of the component interfere with the mounted components during at least one of positions and a release operation of the plurality of claw sections, the circuitry is configured to change the standard pinching locations of the component to final pinching locations of the component to avoid interference.

8. The component mounting device according to claim 7 ,

wherein the standard pinching locations of the component are defined by component shape data which holds various values relating to a shape of the component, and

wherein the pinching locations of the component are defined in board sequence data which defines a mounting order and mounting coordinate positions of a plurality of components to be mounted onto the board.

9. The component mounting device according to claim 8 ,

wherein a required time for mounting the plurality of components onto the board is called a mounting cycle time, and

wherein in a case in which at least one of positions and a release operation of the plurality of claw sections interferes with the mounted components when the plurality of claw sections pinch the standard pinching locations of the component,

the circuitry is configured to estimate a first mounting cycle time of a case in which the interference is avoided using a first method of changing the pinching locations of the component from the standard pinching locations,

the circuitry is configured to estimate a second mounting cycle time of a case in which the interference is avoided using a second method of changing a mounting order of the plurality of components which is defined in the board sequence data, and

the circuitry is configured to adopt the method with a shorter time among the first mounting cycle time and the second mounting cycle time.

10. The component mounting device according to claim 7 ,

wherein the standard pinching locations of the component are defined as side surfaces of a body of the component, and are defined using body center data which indicates a center of the body, and standard angle data which indicates directional angles at which the standard pinching locations lie based on the center of the body as a reference,

wherein the pinching locations of the component are defined using pinching center deviation data which indicates a deviation amount of a pinching center which is deviated from the center of the body of the component, and angle data which indicates the directional angles at which the pinching locations lie based on the pinching center as a reference,

wherein the circuitry is configured to set the pinching center deviation data to zero data and to cause the angle data to match the standard angle data when the pinching locations of the component are not changed from the standard pinching locations, and

wherein the circuitry is configured to perform at least one change of a pinching center change in which the pinching center deviation data is set to non-zero data and an angle change in which the angle data is set to data which is different from the standard angle data when the pinching locations of the component are changed from the standard pinching locations.

11. The component mounting device according to claim 10 ,

wherein the standard pinching locations of the component are defined by component shape data which holds various values relating to a shape of the component, and

wherein the pinching locations of the component are defined in board sequence data which defines a mounting order and mounting coordinate positions of a plurality of components to be mounted onto the board.