ETCH CUTTING SOLUTION FOR USE ON GLASS SUBSTRATES
Solutions suitable for etch cutting glass substrates are disclosed. The solutions can include: (a) about 20.1 to about 25 weight % of hydrofluoric acid; (b) about 7 to about 10.5 weight % of an organic carboxylic acid; (c) 0 to about 10 weight % of nitric acid; and (d) about 54.5 to about 72.9 weight % of water; wherein the weight % is based on the total weight of the etch cutting solution.
1 . An etch cutting solution comprising:
(a) about 20.1 weight % to about 25 weight % of hydrofluoric acid;
(b) about 7 weight % to about 10.5 weight % of an organic carboxylic acid;
(c) 0 to about 10 weight % of nitric acid; and
(d) about 54.5 weight % to about 72.9 weight % of water;
wherein the weight % is based on the total weight of the etch cutting solution, and provided that the etch cutting solution is essentially free of ammonium fluoride.
2 . The etch cutting solution of claim 1 , wherein the etch cutting solution comprises about 20.2 weight % to about 23 weight % of the hydrofluoric acid.
3 . The etch cutting solution claim 1 , wherein the etch cutting solution comprises about 10.5 weight % of the organic carboxylic acid.
4 . The etch cutting solution of claim 1 , wherein the etch cutting solution comprises about 5 weight % of the nitric acid.
5 . The etch cutting solution of claim 1 , wherein the organic carboxylic acid comprises an alpha-hydroxy-acid.
6 . The etch cutting solution of claim 5 , wherein the alpha-hydroxy-acid comprises a material selected from the group consisting of citric acid and glycolic acid.
7 . The etch cutting solution of claim 6 , wherein the alpha-hydroxy-acid comprises glycolic acid.
8 . The etch cutting solution of claim 1 , wherein the organic carboxylic acid comprises a material selected from the group consisting of oxalate acid, citric acid, propaneioic acid, lactic acid, and glycolic acid.
9 . An etch cutting solution comprising:
(a) about 20.1 weight % to about 25 weight % of hydrofluoric acid;
(b) about 7 weight % to about 10.5 weight % of glycolic acid;
(c) 0 to about 10 weight % of nitric acid; and
(d) about 54.5 weight % to about 72.9 weight % of water;
wherein the weight % is based on the total weight of the etch cutting solution.
10 . The etch cutting solution of claim 9 , wherein the etch cutting solution comprises about 20.2 weight % to about 23 weight % of the hydrofluoric acid.
11 . The etch cutting solution of claim 9 , wherein the etch cutting solution comprises about 10.5 weight % of the glycolic acid.
12 . The etch cutting solution of claim 9 , wherein the etch cutting solution comprises about 5 weight % of the nitric acid.