IP Library Granted Patent US 9,825,208
Granted Patent B2
US 9,825,208 · App. 15/506,059 · Granted Nov 21, 2017

Method of producing an optoelectronic semiconductor component

Inventors: Isabel Otto (Regensburg, DE); Ion Stoll (Tegernheim, DE)
Assignee: OSRAM Opto Semiconductors GmbH
H01L33/504C25D13/02C25D13/12H01L25/0753H01L33/005H01L2933/0041
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Quick Facts
Patent No.
US 9,825,208
App. No.
15/506,059
Granted
Nov 21, 2017
Kind
B2
Abstract

A method of producing an optoelectronic semiconductor component includes providing a semiconductor body; applying a photoconductive layer on a radiation exit surface of the semiconductor body, wherein the semiconductor body emits electromagnetic radiation during operation; exposing at least one sub-region of the photoconductive layer with electromagnetic radiation generated by the semiconductor body; and depositing a conversion layer on the sub-region of the photoconductive layer by an electrophoresis process.

Claims (19)

1. A method of producing an optoelectronic semiconductor component comprising:

providing a semiconductor body;

applying a photoconductive layer on a radiation exit surface of the semiconductor body, wherein the semiconductor body emits electromagnetic radiation during operation;

exposing at least one sub-region of the photoconductive layer with electromagnetic radiation generated by the semiconductor body; and

depositing a conversion layer on the sub-region of the photoconductive layer by an electrophoresis process.

2. The method according to claim 1 , wherein the photoconductive layer is applied to the radiation exit surface of the semiconductor body by CVD, ALD, PLD, PVD, an electrophoresis process or wet-chemically.

3. The method according to claim 1 , wherein the photoconductive layer is directly applied to a semiconductor layer of the semiconductor body.

4. The method according to claim 1 , wherein the photoconductive layer is applied to an insulation layer that at least partially covers a semiconductor layer of the semiconductor body.

5. The method according to claim 1 , wherein the photoconductive layer is applied to an electrically conductive layer that is electrically insulated from the semiconductor body by an insulation layer.

6. The method according to claim 1 , wherein the sub-pixel region to which the conversion layer is applied is supplied with current in the electrophoretic process independently of the other sub-pixel region.

7. The method according to claim 1 , wherein the first wavelength range comprises blue light, the second wavelength range comprises green light and the third wavelength range comprises red light.

8. The method according to claim 1 , wherein the photoconductive layer contains or consists of TiO 2 , ZnO, ZnS, ZnSe, CdS, SrTiO 3 , ZnO, AgI, GaN, In x Ga 1−x N, FeTiO 3 .

9. The method according to claim 8 , wherein a thickness of the photoconductive layer is 10 nm to 5 μm.

10. The method according to claim 1 , wherein the semiconductor body comprises at least one pixel region comprising at least two different sub-pixel regions, wherein each sub-pixel region comprises an active layer suitable to emit electromagnetic radiation of a first wavelength range, and in which the photoconductive layer is applied to the radiation exit surface of at least one sub-pixel region.

11. The method according to claim 10 , wherein

a first sub-pixel region is provided with a first conversion layer suitable to convert radiation of the first wavelength range into radiation of the second wavelength range; and

a second sub-pixel region is provided with a further conversion layer suitable to convert radiation of the first wavelength range into radiation of a third wavelength range different from the first and the second wavelength range.

12. The method according to claim 1 , wherein a voltage is applied between the photoconductive layer and a counter-electrode arranged on the side of the photoconductive layer facing away from the semiconductor body.

13. The method according to claim 12 , wherein exposure of the sub-region of the photoconductive layer and the electrophoretic process are performed in an alternating manner.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051467/0906 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2017
From: OTTO, ISABEL; STOLL, ION
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 041758/0925 →
Priority Claims (1)
DE 10 2014 112 769 · Sep 4, 2014 · national
Continuity (1)
Related Publication 20170250323A1 · Aug 31, 2017