Package and heat sealing device
Aspects of the present invention are directed to a heat sealed packaging wherein the heat seal is along a curved surface. Additional aspects of the present invention are directed to a device for heat sealing a package on a surface that is curved along the direction of force.
1. A device for heat sealing a package comprising:
a support boss plate having a boss with a face with one or more cavities for receiving a package and one or more gaskets secured to the face and surrounding at least a portion of the one or more cavities, wherein the gasket and at least the portion of the face on which the one or more gaskets is secured is non-flat, and
a heater plate having a heater with a face and one or more heating flanges mateable with the one or more gaskets on the support boss, wherein the one or more heating flanges are non-flat;
wherein upon mating of the support boss with the heater and an application of a downward directional force and heat, a package may be sealed with a non-linear seal along the downward directional force.
2. The device of claim 1 , wherein the support boss plate and the heater plate further include shut height bosses for optimizing the distance between the support boss and the heater when the support boss and heater are mated.
3. The device of claim 1 , wherein the one or more gaskets has a width of between about 0.05 mm and about 0.5 mm.
4. The device of claim 1 , wherein the one or more gaskets has a width of between about 0.125 mm and about 0.25 mm.
5. The device of claim 1 , wherein the one or more heating flanges has a width of 0.05 mm and about 0.5 mm.
6. The device of claim 5 , wherein the one or more heating flanges has a width of about 0.125 mm and about 0.25 mm.
7. The device of claim 1 , wherein the support boss plate and the heater boss plate comprise multiple bosses and multiple heaters corresponding to the multiple bosses.
8. The device of claim 7 , wherein the multiple bosses are independently adjustable about the x, y, and z axis.