IP Library Granted Patent US 10,417,459
Granted Patent B2
US 10,417,459 · App. 15/507,697 · Granted Sep 17, 2019

Physical barrier to inhibit a penetration attack

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Quick Facts
Patent No.
US 10,417,459
App. No.
15/507,697
Granted
Sep 17, 2019
Kind
B2
Abstract

An apparatus that includes a substrate and a first plurality of circuit components mounted on the substrate, which is associated with a protected area. The apparatus includes a connector formed on the substrate to at least partially circumscribe the protected area and a second plurality of circuit components mounted on the substrate to at least partially circumscribe the connector to form a security barrier to physically inhibit a penetration attack into the protected area.

Claims (33)

1. An apparatus comprising:

a first substrate configured to provide a first physical barrier for a protected area that contains one or more protected circuit components;

a connector contact formed on the first substrate, the connector contact being configured to couple the first substrate to a second substrate, the second substrate providing a second physical barrier for the protected area; and

a plurality of sets of two or more electrical contacts formed on the first substrate and at least partially circumscribing the protected area, the plurality of sets of two or more electrical contacts being configured for mounting a corresponding plurality of circuit components to the first substrate, each of the plurality of circuit components having a matching set of two or more electrical contacts, wherein the plurality of circuit components provide a third physical barrier for the protected area,

wherein the first, second, and third physical barriers are each configured to physically inhibit a penetration attack into the protected area.

2. The apparatus of claim 1 , wherein the plurality of circuit components comprise:

a first row of circuit components having first spaces between adjacent circuit components of the first row; and

a second row of circuit components to at least partially circumscribe the first row of circuit components, wherein the circuit components of the second row are staggered with respect to the circuit components of the first row to physically block insertion of a tool associated with the penetration attack through one of the first spaces.

3. The apparatus of claim 1 , wherein the plurality of circuit components comprise one or more integrated circuits.

4. The apparatus of claim 1 , wherein:

the plurality of sets of two or more electrical contacts completely circumscribe the protected area; and

the first substrate comprises a first penetration detection layer to provide a first electrical response to the penetration attack entering the protected area from a first direction.

5. The apparatus of claim 4 , wherein the second substrate comprises a second penetration detection layer to provide a second electrical response to the penetration attack entering the protected area from a second direction.

6. A method comprising:

coupling together a plurality of substrates to form a partial enclosure that protects at least one integrated circuit from a penetration attack along a first path extending through at least one of the substrates, the partial enclosure including at least one gap between the plurality of substrates; and

mounting a plurality of circuit components on at least one of the plurality of substrates to form a physical barrier to protect the at least one integrated circuit from a penetration attack along a second path extending through the at least one gap, wherein each of the plurality of circuit components includes at least two electrical terminals and is mounted to a matching set of at least two electrical contacts formed on the at least one of the plurality of substrates.

7. The method of claim 6 , further comprising disposing a conductive gasket between at least two of the plurality of substrates, the conductive gasket being configured to provide an electrical response to an attempted disassembly of the partial enclosure.

8. The method of claim 6 , wherein mounting the plurality of circuit components to form the physical barrier comprises arranging the plurality of circuit components to form a plurality of staggered rows.

9. The method of claim 6 , wherein at least one of the plurality of circuit components is configured to provide an electrical response to the penetration attack along the second path through a respective matching set of at least two electrical contacts.

10. The method of claim 6 , wherein the physical barrier forms an inner security barrier that is circumscribed by an electrical connector disposed between at least two of the plurality of substrates.

11. An apparatus comprising:

a first substrate comprising a first penetration detection layer to provide a first electrical response to a penetration attack through the first substrate;

an integrated circuit mounted on the first substrate;

a second substrate comprising a second penetration detection layer to provide a second electrical response to a penetration attack through the second substrate;

a connector disposed between the first and second substrates and circumscribing the integrated circuit, the connector being configured to electrically couple the first and second penetration detection layers; and

a plurality of circuit components mounted on the first substrate to circumscribe the connector to form a physical barrier to inhibit a penetration attack through the connector, wherein each of the plurality of circuit components are mounted between a matching pair of conductive pads formed on the first substrate.

12. The apparatus of claim 11 , wherein the plurality of circuit components comprise one or more passive integrated circuit components.

13. The apparatus of claim 11 , wherein the plurality of circuit components comprise:

a first row of circuit components to circumscribe the connector, wherein adjacent circuit components of the first row have first spaces therebetween; and

a second row of circuit components to circumscribe the first row of circuit components, wherein the circuit components of the second row are staggered with respect to the circuit components of the first row.

14. The apparatus of claim 11 , wherein the integrated circuit comprises a secure key manager.

15. The apparatus of claim 11 , further comprising:

a metal enclosure enclosing the first substrate, the second substrate, the integrated circuit, the connector and the plurality of circuit components.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Aug 22, 2019
From: NIBC BANK N.V., AS SECURITY AGENT
To: UTIMACO INC.
Reel/Frame 050135/0404 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE STATE OF INCORPORATON PREVIOUSLY RECORDED AT REEL: 048375 FRAME: 0257. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 30, 2019
From: ENTIT SOFTWARE LLC
To: UTIMACO, INC.
Reel/Frame 049912/0960 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2019
From: ENTIT SOFTWARE LLC
To: UTIMACO, INC.
Reel/Frame 048375/0257 →
SECURITY INTEREST Recorded Feb 5, 2019
From: UTIMACO INC.
To: NIBC BANK N.V.
Reel/Frame 048240/0281 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2018
From: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
To: ENTIT SOFTWARE LLC
Reel/Frame 048261/0084 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2017
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 041871/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2017
From: LEWIS, JOHN M.; DIEP, ALVIN H.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 041403/0983 →