Radiation-emitting apparatus having an outer optoelectronic device surrounding an inner optoelectronic device and methods for producing the same

1. Radiation-emitting apparatus, comprising

a substrate,

an inner optoelectronic device and an outer optoelectronic device which at least partially laterally surrounds the inner optoelectronic device, wherein each of the optoelectronic devices comprises a layer sequence that is suitable for generating electromagnetic radiation having at least one first electrode surface, at least one second electrode surface and at least one functional layer between the first electrode surface and the second electrode surface, wherein the functional layer is suitable for generating electromagnetic radiation in a switched-on operating state, and

a cover element that is arranged on the optoelectronic devices and comprises at least one first contact element, that is connected to the first electrode surface of the inner optoelectronic device in an electrically conductive manner, and at least one second contact element that is connected to the second electrode surface of the inner optoelectronic device in an electrically conductive manner.

2. Radiation-emitting apparatus according to claim 1 , wherein the substrate and/or the cover element is translucent.

3. Radiation-emitting apparatus according to claim 1 , wherein the contact elements comprise a transparent conductive oxide or consist of a transparent conductive oxide.

4. Radiation-emitting apparatus according to claim 1 , wherein each of the contact elements extends in each case as far as an edge of the radiation-emitting apparatus.

5. Radiation-emitting apparatus according to claim 1 , wherein an intermediate region between the inner optoelectronic device and the outer optoelectronic device is translucent.

6. Radiation-emitting apparatus according to claim 1 , further comprising contact structures arranged at an edge of the inner optoelectronic device and connected to the electrode surfaces of the inner optoelectronic device in an electrically conductive manner, wherein the contact elements are each connected to the contact structures in an electrically conductive manner.

7. Radiation-emitting apparatus according to claim 6 , wherein the contact elements are attached to the contact structures via a conductive adhesive.

8. Radiation-emitting apparatus according to claim 6 , wherein the contact elements are connected to the contact structures via recesses in a thin-film encapsulation layer that is arranged at least over the layer sequence of the inner optoelectronic device.

9. Radiation-emitting apparatus according to claim 1 , wherein the outer optoelectronic device completely laterally surrounds the inner optoelectronic device.

10. Radiation-emitting apparatus according to claim 1 , wherein the outer optoelectronic device and the inner optoelectronic device are arranged concentrically with respect to each other.

11. Radiation-emitting apparatus according to claim 1 , wherein the contact elements are in the form of strips.

12. Radiation-emitting apparatus, comprising

a substrate,

an inner optoelectronic device and an outer optoelectronic device which at least partially laterally surrounds the inner optoelectronic device, wherein each of the optoelectronic devices comprises a layer sequence that is suitable for generating electromagnetic radiation having at least one first electrode surface, at least one second electrode surface and at least one functional layer between the first electrode surface and the second electrode surface, wherein the functional layer is suitable for generating electromagnetic radiation in a switched-on operating state, and

a cover element that is arranged on the optoelectronic devices and comprises at least one first contact element, that is connected to the first electrode surface of the inner optoelectronic device in an electrically conductive manner, and at least one second contact element that is connected to the second electrode surface of the inner optoelectronic device in an electrically conductive manner, wherein each of the contact elements extends in each case as far as an edge of the radiation-emitting apparatus.

13. Radiation-emitting apparatus according to claim 12 , wherein the contact elements are each connected to contact structures in an electrically conductive manner, which contact structures are arranged at an edge of the inner optoelectronic device and are connected to the electrode surfaces of the inner optoelectronic device in an electrically conductive manner.

14. Radiation-emitting apparatus according to claim 13 , wherein the contact elements are connected to the contact structures via recesses in a thin-film encapsulation layer that is arranged at least over the layer sequence of the inner optoelectronic device.

15. Method for producing a radiation-emitting apparatus, comprising the following method steps:

providing a substrate and an inner optoelectronic device and an outer optoelectronic device arranged on the substrate, wherein the outer optoelectronic device at least partially laterally surrounds the inner optoelectronic device;

providing a cover element, wherein the cover element comprises a cover support and at least one first and one second contact element on a major surface of the cover support; and

attaching the cover element to the optoelectronic devices, wherein the first contact element is connected to the first electrode surface of the inner optoelectronic device in an electrically conductive manner and the second contact element is connected to the second electrode surface of the inner optoelectronic device in an electrically conductive manner.

16. Method according to claim 15 , further providing contact structures arranged at an edge of the inner optoelectronic device and connected to the electrode surfaces of the inner optoelectronic device in an electrically conductive manner, wherein the contact elements are attached to the contact structures via a conductive adhesive.

17. Method according to claim 16 , wherein the contact structures are exposed by using laser ablation.

18. Method according to claim 15 , wherein the contact elements are structured by using laser ablation.