IP Library Granted Patent US 10,363,724
Granted Patent B2
US 10,363,724 · App. 15/509,574 · Granted Jul 30, 2019

Resin composition and compression-molded article of same

Inventors: Takuya Teranishi (Tokyo, JP); Akira Oota (Tokyo, JP); Masahiro Ichino (Tokyo, JP); Toru Kondo (Tokyo, JP)
Assignee: Mitsubishi Chemical Corporation
B32B27/38B32B5/022B32B5/28C08G59/226C08J5/24C08L51/00C08L63/00B32B2307/718C08J2363/00C08J2433/02C08L2207/53
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Quick Facts
Patent No.
US 10,363,724
App. No.
15/509,574
Granted
Jul 30, 2019
Kind
B2
Abstract

A resin composition including an epoxy resin (A), a curing agent (B), and vinyl polymer particles (C), in which the contained amount of epoxy resin (a1) having a molecular weight of 100-480 is 30-90 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of epoxy resin (a2) having a molecular weight of 2,000-40,000 is 10-70 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of the vinyl polymer particles (C) is 2-30 parts by mass per 100 parts by mass of the epoxy resin (A), and the instantaneous maximum thickening value of the vinyl polymer particles obtained by the following method is 0.3-5.0 Pa·s/° C.

Claims (40)

1. A resin composition, comprising:

(A) an epoxy resin comprising an epoxy resin (a1) with a molecular weight of 100 to 480 and an epoxy resin (a2) with a molecular weight of 2000 to 40000;

(B) a curing agent; and

(C) vinyl polymer particles, which are observed as particles in the resin composition at a temperature of 10 to 30° C. and are dissolved in or swollen by the resin composition at a temperature above 30° C.,

wherein:

a content of the epoxy resin (a1) is 30 to 90 parts by mass based on 100 parts by mass of the epoxy resin (A);

a content of the epoxy resin (a2) is 10 to 70 parts by mass based on 100 parts by mass of the epoxy resin (A);

a content of the vinyl polymer particles (C) is 2 to 30 parts by mass based on 100 parts by mass of the epoxy resin (A); and

a maximum value of instantaneous increase in viscosity of the vinyl polymer particles (C) is 0.3 to 5.0 Pa·s/° C.

2. The resin composition according to claim 1 , wherein:

the resin composition has a viscosity at 30° C. of 1.0×10 2 to 1.0×10 5 Pa·s; and

the resin composition has a minimum viscosity measured at a rate of temperature rise of 2° C./min. of 0.8 to 10 Pa·s.

3. The resin composition according to claim 1 , wherein the vinyl polymer particles (C) are core-shell particles having a core layer and shell layer both made of acrylic resin.

4. The resin composition according to claim 3 , wherein a glass transition temperature of the shell layer of the core-shell particles is 85 to 115° C., a value of solubility parameter is 20.20 to 20.50 [(J/cm 3 ) 1/2 ], and a mass ratio of the core layer and shell layer is 90:10 to 50:50.

5. The resin composition according to claim 1 , wherein the vinyl polymer particles (C) are obtained by conducting two or more stages of emulsion polymerization on vinyl monomer mixtures hating different compositions, and by spray-drying the emulsion of the vinyl polymer.

6. The resin composition according to claim 5 , wherein the vinyl monomer mixtures have monomers selected from the group consisting of (i) (meth)acrylates that may have a functional group and (ii) (meth)acrylic acids.

7. The resin composition according to claim 5 , wherein a glass transition temperature of the outermost emulsion-polymerized layer (i) of the vinyl polymer particles (C) is 85 to 115° C., a value of solubility parameter is 20.20 to 20.50 [(J/cm 3 ) 1/2 ], and a mass ratio of the outermost emulsion-polymerized layer (i) and the other emulsion-polymerized layer (ii) is 10:90 to 50:50.

8. The resin composition according to claim 1 , wherein an average particle diameter of the vinyl polymer particles (C) is 0.5 to 1.0 μM.

9. The resin composition according to claim 1 , wherein the curing agent (B) comprises at least one selected from the group consisting of an imidazole compound, dicyandiamide and a boron trichloride amine complex.

10. The resin composition according to claim 1 , wherein a thickening starting temperature of the vinyl polymer particles (C) is 70 to 90° C.

11. A prepreg, comprising:

the resin composition according to claim 1 ; and

a reinforcing fiber material.

12. A prepreg laminate, comprising the prepreg according to claim 11 .

13. A molded article formed by compression molding the prepreg according to claim 11 .

14. A prepreg laminate, comprising a plurality of prepreg sheets, wherein:

a layer comprises the resin composition according to claim 1 , and

the layer is further laminated on at least either outermost layer.

15. A molded article formed by compression molding the prepreg laminate according to claim 14 .

16. A prepreg laminate, comprising a plurality of prepreg sheets, wherein a prepreg layer of fiber-reinforced non-woven fabric, made by impregnating the resin composition according to claim 1 into a fiber-reinforced non-woven fabric with a fiber basis weight of 5 to 50 g/m 2 , is further laminated on at least either outermost layer.

17. A resin composition, comprising:

(A) an epoxy resin comprising an epoxy resin (a1) with a molecular weight of 100 to 480;

(B) a curing agent; and

(C) vinyl polymer particles, which are observed as particles in the resin composition at a temperature of 10 to 30° C. and are dissolved in or swollen by the resin composition at a temperature above 30° C.,

wherein:

a content of the epoxy resin (a1) is 30 to 80 parts by mass based on 100 parts by mass of the epoxy resin (A);

the resin composition has a viscosity at 30° C. of 1.0×10 2 to 1.0×10 5 Pa·s;

the resin composition has a minimum viscosity measured at a rate of temperature rise of 2° C./min. of 0.8 to 10 Pa·s;

a content of the vinyl polymer particles (C) is 2 to 30 parts by mass based on 100 parts by mass of the epoxy resin (A); and

a maximum value of instantaneous increase in viscosity of the vinyl polymer particles (C) is 0.3 to 5.0 Pa·s/° C.

Assignments (2)
CORPORATE NAME CHANGE Recorded Jun 19, 2017
From: MITSUBISHI RAYON CO., LTD.
To: MITSUBISHI CHEMICAL CORPORATION
Reel/Frame 042886/0294 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 8, 2017
From: TERANISHI, TAKUYA; OOTA, AKIRA; ICHINO, MASAHIRO; KONDO, TORU
To: MITSUBISHI RAYON CO., LTD.
Reel/Frame 041503/0105 →
Priority Claims (1)
JP 2014-211346 · Oct 16, 2014 · national
Continuity (1)
Related Publication 20170282516A1 · Oct 5, 2017