IP Library Granted Patent US 10,392,539
Granted Patent B2
US 10,392,539 · App. 15/509,877 · Granted Aug 27, 2019

Crash durable epoxy adhesive compositions having improved low-temperature impact resistance and wash off resistance

Inventors: Gary L. Jialanella (Oxford, MI); Andreas Lutz (Galgenen, CH); Eric E. Cole (Waterford, MI); Glenn G. Eagle (Bloomfield Hills, MI); Rajesh H. Turakhia (Lake Jackson, TX); Yanli Feng (Shanghai, CN)
Assignee: Dow Global Technologies LLC
C09J163/00C08L63/00C09J5/06C09J11/02C09J153/00C09J175/04
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,392,539
App. No.
15/509,877
Granted
Aug 27, 2019
Kind
B2
Abstract

Aspects of the present invention provide a one component epoxy adhesive composition having improved impact resistance at low temperatures, such as −40° C. or less. In a first aspect, the adhesive includes one or more epoxy resins; at least one polyurethane based toughener; at least one amphipathic block copolymer; and one or more epoxy curing agents. In a further, aspect epoxy adhesive compositions having improved wash off resistance are also provided.

Claims (31)

1. A one-component adhesive composition comprising:

one or more epoxy resins;

at least one polyurethane based toughener containing aliphatic diisocyanate groups that are blocked or capped with bisphenol A or diisopropyl amine;

at least one epoxy functionalized amphiphilic block copolymer having a molecular weight from 5,000 g/mole to 20,000 g/mole; and

one or more epoxy curing agents,

wherein the adhesive composition has a viscosity of less than 300 pascal second, and exhibits an improvement in wash off resistance in comparison to a similar adhesive composition that does not include an epoxy functionalized amphiphilic block copolymer.

2. The adhesive of claim 1 , wherein the one or more epoxy resins includes at least one diglycidyl ether of a bisphenol.

3. The adhesive of claim 1 , wherein the amount of the one or more epoxy resins is from about 30 to 60 weight percent, based on the total weight of the adhesive composition.

4. The adhesive of claim 1 , wherein polyurethane based toughener is a reaction product of an aliphatic diisocyanate and a polyol having a molecular weight ranging between 2,000 and 12,000 Daltons.

5. The adhesive of claim 1 , wherein the amount of polyurethane based-toughener is from about 10 to 25 weight percent, based on the total weight of the adhesive composition.

6. The adhesive of claim 1 , wherein the amphiphilic block copolymer comprises a block copolymer of one or more of ethylene oxide and propylene oxide and at least one further alkylene oxide containing at least four C atoms.

7. The adhesive of claim 6 , wherein the further alkylene oxide comprises butylene oxide.

8. The adhesive of claim 1 , wherein the amount of amphiphilic block copolymer is from about 2 to 14 weight percent, based on the total weight of the adhesive composition.

9. The adhesive of claim 1 , further comprising at least one filler.

10. The adhesive of claim 9 , wherein the filler is selected from the group consisting of mineral fillers, glass particles, and fused silica.

11. The adhesive composition of claim 1 , wherein the epoxy functionalized amphiphilic block copolymer comprises a reaction product between a carboxylic or hydroxyl terminated ethylene oxide-butylene oxide block copolymer and an epoxy resin.

12. The adhesive composition of claim 1 , wherein the amphiphilic block copolymer is a block copolymer of ethylene oxide and butylene oxide.

13. The adhesive composition of claim 12 , wherein the one or more epoxy curing agents are selected from one or more of dicyandiamide, isophthalic acid dihydrazide, adipic acid dihydrazide and 4,4′-diaminodiphenylsulphone.

14. The adhesive composition of claim 13 , further comprising a latent catalyst.

15. The adhesive composition of claim 1 wherein:

30 to 60 weight percent, based on the weight of the adhesive, is at least one diglycidyl ether of a bisphenol A;

the polyurethane-based toughener contains aliphatic isocyanate groups capped with bisphenol A and diisopropyl amine and is present in an amount of 10 to 25 weight percent, based on the weight of the adhesive;

the amphiphilic block copolymer is a block copolymer of ethylene oxide and butylene oxide, contains hydroxyl or carboxylic acid groups and is present in an amount of 2 to 14 weight percent, based on the weight of the adhesive;

the one or more epoxy curing agents are selected from one or more of dicyandiamide, isophthalic acid dihydrazide, adipic acid dihydrazide and 4,4′-diaminodiphenylsulphone;

the adhesive composition further comprises a latent catalyst.

16. The adhesive composition of claim 1 wherein:

30 to 60 weight percent, based on the weight of the adhesive, is at least one diglycidyl ether of a bisphenol A;

the polyurethane-based toughener contains aliphatic isocyanate groups capped with bisphenol A and diisopropyl amine and is present in an amount of 10 to 25 weight percent, based on the weight of the adhesive;

the amphiphilic block copolymer is an epoxy-functional block copolymer of ethylene oxide and butylene oxide and is present in an amount of 10 to 20 weight percent, based on the weight of the adhesive;

the one or more epoxy curing agents are selected from one or more of dicyandiamide, isophthalic acid dihydrazide, adipic acid dihydrazide and 4,4′-diaminodiphenylsulphone;

the adhesive composition further comprises a latent catalyst.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 069923/0030 →
CHANGE OF LEGAL ENTITY Recorded Sep 10, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068907/0881 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068922/0001 →
Continuity (2)
Provisional Application 62098678 · Dec 31, 2014
Related Publication 20170292049A1 · Oct 12, 2017