Electronic component mounting system

1. An electronic component mounting system comprising:

a solder printer that prints solder paste onto a circuit board;

a mounter provided with a board holding device that holds the circuit board, a component supply device that supplies electronic components, and a mounting device that picks up the electronic component supplied by the component supply device and mounts the picked up component on the circuit board held by the board holding device by raising and lowering a component holding tool;

an elapsed time acquiring section that acquires an elapsed time from a time of printing onto the circuit board by the solder printer until the circuit board arrives in position to mount the electronic component; and

a raising and lowering operation changing section that changes raising and lowering operation of the component holding tool when the elapsed time from printing acquired by the elapsed time acquiring section exceeds an allowance time, which is a maximum elapsed time from the time of printing before the solder dries, wherein

the mounter mounts the electronic component on the solder printed on the circuit board by the solder printer by raising and lowering the component holding tool according to the raising and lowering operation changed by the raising and lowering operation changing section.

2. The electronic component mounting system according to claim 1 , wherein

the raising and lowering operation changing section includes a mounting parameter determining section that determines a mounting parameter, which is a parameter used for control of raising and lowering operation of the component holding tool, based on the elapsed time from printing, and

the mounter mounts the electronic component on the solder on the circuit board according to the mounting parameter determined by the mounting parameter determining section.

3. The electronic component mounting system according to claim 2 , wherein

the mounting parameter is a pressing force that is a pressing force with which the component holding tool presses the electronic component against the solder printed on the circuit board.

4. The electronic component mounting system according to claim 2 , wherein

the mounting parameter is a pressing time that is a length of time for which the component holding tool presses the electronic component against the solder printed on the circuit board.

5. The electronic component mounting system according to claim 1 , wherein

the elapsed time acquiring section, as the elapsed time from printing, acquires the elapsed time that is from a point in time at which printing on the circuit board by the solder printer was completed to a point in time at which the circuit board arrived at the mounter,

the electronic component mounting system is further provided with an estimated required time memorizing section that memorizes an estimated required time, which is a time estimated to be required from the point in time at which the circuit board arrived at the mounter until work scheduled to be performed by the mounter is completed,

and further wherein

the raising and lowering operation changing section changes raising and lowering operation of the component holding tool based on the elapsed time from printing acquired by the elapsed time acquiring section and the estimated required time memorized by the estimated required time memorizing section.

6. The electronic component mounting system according to claim 5 , wherein

the estimated required time is a time estimated to be required from the point in time at which the circuit board arrived at the mounter until a final work out of a series of work to be performed by the mounter is completed.

7. The electronic component mounting system according to claim 2 , further provided with a correlation data memorizing section that memorizes correlation data, which is data representing a relationship between the elapsed time from printing and the mounting parameter appropriate for mounting the electronic component on the printed solder, wherein

the correlation data memorizing section memorizes different correlation data according to solder type.

8. An electronic component mounting system comprising:

a solder printer that prints solder paste onto a circuit board;

a mounter provided with a board holding device that holds the circuit board, a component supply device that supplies electronic components, and a mounting device that picks up the electronic component supplied by the component supply device and mounts the picked up component on the circuit board held by the board holding device by raising and lowering a component holding tool;

an elapsed time acquiring section that acquires an elapsed time from a time of printing onto the circuit board by the solder printer until the circuit board arrives in position to mount the electronic component;

an estimated elapsed time calculating section that calculates an estimated elapsed time based on a sum of the elapsed time acquired by the elapsed time acquiring section and an estimated required time, which is a time estimated to be required from a point in time at which circuit board arrives in the position to a point in time at which work to be performed at the position is scheduled to be completed; and

a raising and lowering operation changing section that changes raising and lowering operation of the component holding tool when the estimated elapsed time calculated by the estimated elapsed time calculating section exceeds an allowance time, which is a maximum elapsed time from the time of printing before the solder dries, wherein

the mounter mounts the electronic component on the solder printed on the circuit board by the solder printer by raising and lowering the component holding tool according to the raising and lowering operation changed by the raising and lowering operation changing section.