IP Library Granted Patent US 10,084,006
Granted Patent B2
US 10,084,006 · App. 15/513,109 · Granted Sep 25, 2018

Optical receiver, portable electronic device, and method of producing optical receiver

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Quick Facts
Patent No.
US 10,084,006
App. No.
15/513,109
Granted
Sep 25, 2018
Kind
B2
Abstract

Provided are an optical receiver that can realize a reduction in the variation of sensitivity in the ultraviolet light region and a reduction in noise in the visible light region and the infrared light region, a portable electronic device, and a method of producing an optical receiver. The first light-receiving device (PD 1 ) and the second light-receiving device (PD 2 ) of the optical receiver ( 1 ) are each constituted by forming a second conductivity-type N-type well layer (N_well) on a first conductivity-type P-type substrate (P_sub), forming a first conductivity-type P-type well layer (P_well) in the N-type well layer (N_well), and forming a second conductivity-type N-type diffusion layer (N) in the P-type well layer (P_well). The P-type substrate P_sub, the N-type well layer (N_well), and the P-type well layer (P_well) are electrically at the same potential or are short-circuited.

Claims (12)

1. An optical receiver comprising: a first light-receiving device; a second light-receiving device having a same structure as that of the first light-receiving device; and a filter disposed on the first light-receiving device and cutting a wavelength in an ultraviolet region, said optical receiver outputting only an output of a wavelength in the ultraviolet region by calculation of outputs from the first light-receiving device and the second light-receiving device, wherein

the first light-receiving device and the second light-receiving device are each constituted by forming a second conductivity-type first diffusion layer on a first conductivity-type semiconductor substrate, forming a first conductivity-type second diffusion layer in the first diffusion layer, and forming a second conductivity-type third diffusion layer in the second diffusion layer; and

the semiconductor substrate, the first diffusion layer, and the second diffusion layer are electrically at the same potential or are short-circuited;

an insulating film for a wiring layer is formed on the semiconductor substrate for forming a wiring layer; and

a first insulating film made of the same material as that of the insulating film for a wiring layer and a second insulating film made of a material different from that of the first insulating film are laminated between the semiconductor substrate and the insulating film for a wiring layer.

2. The optical receiver according to claim 1 , wherein the insulating film for a wiring layer and the first insulating film are silicon oxide films, and the second insulating film is a silicon nitride film.

3. The optical receiver according to claim 1 , wherein the filter cutting a wavelength in the ultraviolet region is composed of interference films formed by sequential repeated lamination of silicon dioxide (SiO 2 ) and niobium pentoxide (Nb 2 O 5 ), silicon dioxide (SiO 2 ) and titanium dioxide (TiO 2 ), or silicon dioxide (SiO 2 ) and aluminum oxide (Al 2 O 3 ).

4. The optical receiver according to claim 3 , wherein the interference films are formed by sequential repeated lamination of silicon dioxide (SiO 2 ) for an oxide film and niobium pentoxide (Nb 2 O 5 ), titanium dioxide (TiO 2 ), or aluminum oxide (Al 2 O 3 ) for a metal film by sputtering, and the sputtering is performed at a sputtering treatment temperature of 95° C. or less.

5. A portable electronic device comprising the optical receiver according to claim 1 .

6. A method of producing the optical receiver according to claim 1 , wherein

the first diffusion layers, the second diffusion layers, and the third diffusion layers of the first light-receiving device and the second light-receiving device are, respectively, simultaneously formed; and

the insulating films each for a wiring layer, the first insulating films, and the second insulating films of the first light-receiving device and the second light-receiving device on the semiconductor substrate are, respectively, simultaneously formed.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2025
From: SHARP KABUSHIKI KAISHA
To: SHARP FUKUYAMA LASER CO., LTD.
Reel/Frame 071863/0508 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2017
From: UCHIHASHI, MASAAKI; NATSUAKI, KAZUHIRO; UCHIDA, MASAYO; TAKIMOTO, TAKAHIRO
To: SHARP KABUSHIKI KAISHA
Reel/Frame 041683/0362 →