Curable composition and resin for treatment of a subterranean formation

1. A method of treating a subterranean formation, comprising:

placing a curable composition into the subterranean formation as an alternative to cement, the curable composition comprising:

40 to 80 wt. %, based on the total weight of the curable composition, of an epoxy silane monomer;

5 to 50 wt. %, based on the total weight of the curable composition, of a hardener; and

1 to 40 wt. %, based on the total weight of the curable composition, of a carrier fluid; and

curing the curable composition in the subterranean formation to form an epoxy silane resin, wherein the epoxy silane resin adheres to a casing disposed in the subterranean formation, thereby cementing or plugging the subterranean formation.

2. The method of claim 1 , wherein the epoxy silane monomer has the structure:

wherein:

at each occurrence, R 1 and R 2 are each independently chosen from —H and substituted or unsubstituted (C 1 -C 10 )hydrocarbyl;

R 3 is independently chosen from —H, substituted or unsubstituted (C 1 -C 10 )hydrocarbyl, and the structure:

R 4 is chosen from —H and substituted or unsubstituted (C 1 -C 10 )hydrocarbyl;

at each occurrence, J is independently selected from a bond and substituted or unsubstituted (C 1 -C 5 )hydrocarbylene;

at each occurrence, L is independently chosen from substituted or unsubstituted (C 1 -C 10 )hydrocarbylene interrupted or terminated by 0, 1, 2, or 3 groups independently chosen from —O— and —S—; and

c is 0 to about 10.

3. The method of claim 2 , wherein at each occurrence, R 1 , R 2 , R 3 , and R 4 are each independently chosen from —H and (C 1 -C 5 )alkyl.

4. The method of claim 2 , wherein at each occurrence, R 1 , R 2 , R 3 , and R 4 are each independently chosen from —H and methyl.

5. The method of claim 2 , wherein at each occurrence J is independently chosen from a bond and a (C 1 -C 5 )alkylene, and wherein at each occurrence L is independently chosen from —OCH 2 (CH 2 ) 3 CH 2 —, —OCH 2 (CH 2 ) 2 CH 2 —, —OCH 2 CH 2 CH 2 —, —OCH 2 CH 2 —, and —OCH 2 —.

6. The method of claim 2 , wherein at each occurrence J is propylene, wherein at each occurrence L is —OCH 2 —, and wherein c is 0 to 3.

7. The method of claim 2 , wherein R 3 at each occurrence independently has the structure:

wherein:

at each occurrence, R 2 is independently chosen from —H and (C 1 -C 10 )alkyl;

R 4 is independently chosen from —H and (C 1 -C 10 )alkyl;

at each occurrence, J is independently chosen from a bond and a (C 1 -C 5 )alkylene;

at each occurrence, L is independently chosen from —OCH 2 (CH 2 ) 3 CH 2 —, —OCH 2 (CH 2 ) 2 CH 2 —, —OCH 2 CH 2 CH 2 —, —OCH 2 CH 2 —, and —OCH 2 —; and

c is 0 to 5.

8. The method of claim 2 , wherein R3 at each occurrence independently has the structure:

wherein:

at each occurrence, R 2 is independently chosen from —H and methyl;

R 4 is independently chosen from —H and methyl;

at each occurrence, J is —CH 2 CH 2 H 2 —;

at each occurrence, L is —OCH 2 —; and

c is 0 to 3.

9. The method of claim 1 , wherein the epoxy silane monomer has a structure chosen from:

wherein:

f is 0 to about 6, and

at each occurrence R A is independently chosen from —H and —CH 3 , wherein the ratio of —H to —CH 3 is about 1 to 3 to about 3 to 1.

10. The method of claim 1 , wherein the epoxy silane monomer comprises about 55 wt % to about 70 wt % of the curable composition, and the hardener comprises about 15 wt % to about 35 wt % of the curable composition.

11. The method of claim 1 , wherein the hardener has the structure:

wherein:

at each occurrence, R 5 is independently chosen from substituted or unsubstituted (C 1 -C 10 )hydrocarbylene;

at each occurrence, A is independently chosen from —O—, and —NH—;

L 2 is independently chosen from a substituted or unsubstituted (C 1 -C 10 )hydrocarbylene;

R 6 is independently chosen from —NH 2 , —Si(OR 7 ) 3 , and —OH, wherein at each occurrence, R 7 is independently chosen from a (C 1 -C 5 )hydrocarbyl; and

i is 1 to about 80.

12. The method of claim 11 , wherein at each occurrence R 5 is independently chosen from —(CH 2 ) 2 — and —CH(CH 3 )CH 2 —, and wherein at each occurrence L 2 is independently chosen from —CH 2 CH(CH 3 )— and —(CH 2 ) 3 —.

13. The method of claim 11 , wherein at each occurrence R 6 is independently chosen from —Si(OR 7 ) 3 , wherein at each occurrence R 7 is independently chosen from —CH 3 , —CH 2 CH 3 , and —(CH 2 ) 2 CH 3 .

14. The method of claim 11 , wherein at each occurrence R 6 is —Si(OCH 3 ) 3 , and wherein i is 1 to about 75.

15. The method of claim 11 , wherein the hardener has a structure chosen from:

wherein n is 1 to about 80.

16. The method of claim 1 , wherein the hardener comprises:

wherein:

y is 1 to about 10; and

x+z is 1 to about 5.

17. The method of claim 1 , wherein the curable composition further comprises an epoxy silane resin-coated proppant, and wherein the placing of the curable composition in the subterranean formation comprises fracturing at least part of the subterranean formation to form a subterranean fracture.

18. A method of treating a subterranean formation, comprising:

placing a curable composition into the subterranean formation as an alternative to cement, the curable composition comprising:

an epoxy silane monomer having a structure chosen from:

wherein the epoxy silane monomer comprises about 40 wt % to about 80 wt % of the curable composition;

a hardener having a structure chosen from:

wherein n is 1 to 5,

wherein the hardener comprises about 5 wt % to about 50 wt % of the curable composition; and

a carrier fluid comprising water, wherein the carrier fluid comprises about 1 wt % to about 40 wt % of the curable composition; and

curing the curable composition in the subterranean formation to form an epoxy silane resin, wherein the epoxy silane resin adheres to a casing disposed in the subterranean formation, thereby cementing or plugging the subterranean formation.