IP Library Granted Patent US 10,603,689
Granted Patent B2
US 10,603,689 · App. 15/513,588 · Granted Mar 31, 2020

Ultrasonic transducer, method for making same, ultrasonic transducer array, and ultrasonic test apparatus

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Quick Facts
Patent No.
US 10,603,689
App. No.
15/513,588
Granted
Mar 31, 2020
Kind
B2
Abstract

A structure that prevents a substrate from being warped is provided on a region or a location other than a membrane that determines the characteristics of a CMUT. In a CMUT in a structure in which a first conductive layer and a second conductive layer are provided sandwiching a cavity on a substrate, for example, as a warpage prevention structure, a warpage prevention layer that prevents the substrate from being warped is provided between the substrate and the first conductive film. When the insulating film disposed between the cavity and the first conductive film and the insulating film disposed between the cavity and the second conductive film are silicon oxide films, the warpage prevention layer includes a silicon nitride film.

Claims (14)

1. A manufacturing method for an ultrasound transducer comprising:

forming a plurality of layers including a first conductive film, a first insulating film, a second insulating film, a second conductive film, and a third insulating film on a predetermined region of a substrate by a first patterning process; and

manufacturing a plurality of ultrasound transducers having a first film stack,

wherein in a second patterning process that is the same as the first patterning process, a warpage prevention layer having the first film stack, that reduces warpage of the substrate, is formed in a predetermined pattern on an outer region of the substrate except the predetermined region of the substrate, and

wherein the plurality of ultrasound transducers are only formed in the predetermined region of the substrate among the predetermined region and the outer region of the substrate.

2. The manufacturing method for an ultrasound transducer according to claim 1 ,

wherein the predetermined pattern is the same pattern as a pattern of an ultrasound transducer array formed of the plurality of ultrasound transducers.

3. The manufacturing method for an ultrasound transducer according to claim 1 ,

wherein the predetermined pattern is formed of a plurality of patterns in different sizes.

4. The manufacturing method for an ultrasound transducer according to claim 1 ,

wherein the predetermined pattern is a pattern in which the warpage prevention layer is split into a plurality of separate blocks.

5. The manufacturing method for an ultrasound transducer according to claim 1 ,

wherein the substrate has a circular shape; and

the predetermined region is a polygon within the circle.

Assignments (5)
MERGER Recorded Jan 10, 2025
From: FUJIFILM HEALTHCARE CORPORATION
To: FUJIFILM CORPORATION
Reel/Frame 069869/0940 →
MERGER Recorded Oct 11, 2024
From: FUJIFILM HEALTHCARE CORPORATION
To: FUJIFILM CORPORATION
Reel/Frame 070608/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THE PROPERTY AND APPLICATION NUMBERS PREVIOUSLY RECORDED AT REEL: 058026 FRAME: 0559. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 31, 2022
From: HITACHI LTD.
To: FUJIFILM HEALTHCARE CORPORATION
Reel/Frame 058917/0853 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 4, 2021
From: HITACHI, LTD.
To: FUJIFILM HEALTHCARE CORPORATION
Reel/Frame 058026/0559 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2018
From: MACHIDA, SHUNTARO; RYUZAKI, DAISUKE; NAGATA, TATSUYA; YAMASHITA, NAOAKI; HANAOKA, YUKO; YOSHIMURA, YASUHIRO
To: HITACHI, LTD.
Reel/Frame 047507/0101 →