IP Library Granted Patent US 10,404,656
Granted Patent B2
US 10,404,656 · App. 15/514,026 · Granted Sep 3, 2019

Antenna system

Inventor: Takuji Mochizuki (Tokyo, JP)
Assignee: NEC Corporation
H04L61/2076H01Q1/02H01Q1/405H01Q1/42H01Q9/0414H01Q23/00H04L41/0213H04L41/082H05K7/20
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Quick Facts
Patent No.
US 10,404,656
App. No.
15/514,026
Granted
Sep 3, 2019
Kind
B2
Abstract

[Problem] To provide an antenna system that excellently dissipates heat to the outside of a housing, said heat having been generated by means of an electronic component. [Solution] An electronic circuit board 10 has an electronic component mounted thereon, and has an antenna that is formed on one surface. A protection member 20 covers the one surface of the electric circuit board 10 . A heat transfer unit 30 transfers heat to the protection member 20 , said heat having been generated by means of the electronic component mounted on the electric circuit board 10.

Claims (23)

1. An antenna system comprising:

an electric circuit board on which an electronic component is mounted, the electric circuit board including an antenna formed on one of surfaces of the electric circuit board;

a protection member covering the one of surfaces of the electric circuit board;

a heat transfer part which transfers heat generated by the electronic component mounted on the electric circuit board to the protection member, and

a sub resonator provided on an outer surface of the protection member.

2. An antenna system comprising:

an electric circuit board on which an antenna is formed, the electronic circuit board having a surface on which an electronic component is mounted;

a protection member covering at least part of another surface of the electric circuit board; and

a heat transfer part which transfer heat generated by the electronic component mounted on the electric circuit board,

wherein

at least part of heat generated by the electronic component is transferred to a side of the another surface via the heat transfer part and

the protection member is provided with a through hole that exposes the another surface of the electric circuit board for releasing the heat, which is transferred to the another surface, to outside.

3. The antenna system according to claim 2 , wherein the antenna formed on the electric circuit board is a slot antenna.

4. The antenna system according to claim 2 , wherein the protection member is made of a material with a higher thermal conductivity than that of plastic.

5. The antenna system according to claim 1 , wherein the heat transfer part includes a resin member formed in such a way that the one surface of the electric circuit board and the protection member are thermally coupled to each other.

6. The antenna system according to claim 1 wherein

resonance frequency of the sub resonator is equal to that of the antenna formed on the electric circuit board,

the heat transfer part includes a connection member by which the one surface of the electric circuit board and the sub resonator are thermally coupled to each other,

at least part of heat generated by the electronic component is transferred to the sub resonator via the connection member, and

the heat transferred to the sub resonator is released to outside.

7. The antenna system according to claim 1 , wherein the heat transfer part is provided in the electric circuit board and includes a via provided so as to transfer heat to a surface facing the protection member.

8. The antenna system according to claim 2 , wherein a surface of the electric circuit board which faces the protection member and the protection member are in contact with each other and thermally coupled to each other.

9. The antenna system according to claim 2 , wherein the heat transfer part is provided in the electric circuit board and includes a via provided so as to transfer heat to a surface facing the protection member.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 9, 2017
From: MOCHIZUKI, TAKUJI
To: NEC CORPORATION
Reel/Frame 042659/0827 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2017
From: KINOSHITA, SHINGO
To: NEC CORPORATION
Reel/Frame 041718/0492 →
Priority Claims (1)
JP 2014-195176 · Sep 25, 2014 · national
Continuity (1)
Related Publication 20170302621A1 · Oct 19, 2017
Cited By (1)
US 12,228,676