IP Library Granted Patent US 11,830,711
Granted Patent B2
US 11,830,711 · App. 15/514,634 · Granted Nov 28, 2023

Cobalt sputtering target

Inventors: Kunihiro Oda (Ibaraki, JP); Takayuki Asano (Ibaraki, JP)
Assignee: JX Metals Corporation
H01J37/3426C22C19/07C23C14/3414
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Quick Facts
Patent No.
US 11,830,711
App. No.
15/514,634
Granted
Nov 28, 2023
Kind
B2
Abstract

A Co sputtering target having a purity of 99.99% to 99.999% and a Si content of 1 wtppm or less. Provided is a Co sputtering target capable of improving barrier properties and adhesiveness by suppressing conversion into highly reactive silicide by a reduction in the Si content in cobalt.

Claims (3)

1. A Co sputtering target consisting of cobalt having a purity of 99.99% to 99.999% and an impurity Si content of 1 wtppm or less, wherein the target has a thickness of 9 mm to 15 mm, and wherein the thickness T (mm) and PTF value P (%) of the target satisfy a relation expressed as (P-80)/T≥−1.82.

2. The Co sputtering target according to claim 1 , wherein the thickness of the target is 9 mm to 12.7 mm.

3. The Co sputtering target according to claim 1 , wherein the thickness and the PTF value of the target satisfy the relational expression of −1.82≤(P-80)/T≤−1.25.

Assignments (2)
CHANGE OF NAME Recorded Oct 12, 2023
From: JX NIPPON MINING & METALS CORPORATION
To: JX METALS CORPORATION
Reel/Frame 065221/0471 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2017
From: ODA, KUNIHIRO; ASANO, TAKAYUKI
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041752/0550 →