Power conversion device having a cover that covers DC positive and negative terminals
An object of the invention is to provide a power conversion device which secures insulation and is miniaturized still more without being affected by electromagnetic noises. A power conversion device according to the invention includes a power semiconductor module which converts a DC current into an AC current and includes a DC positive terminal and a DC negative terminal, and a resin cover portion which includes an insulating portion disposed between the DC positive terminal and the DC negative terminal. The cover portion holds a metal member which covers the DC positive terminal and the DC negative terminal.
1. A power conversion device, comprising: a power semiconductor module that converts a DC current into an AC current and includes a DC positive terminal and a DC negative terminal; a cover portion that includes a first insulating portion, the first insulating portion being disposed with respect to another conductor that approaches each of the DC positive terminal and the DC negative terminal, wherein the cover portion holds a metal member that covers the DC positive terminal and the DC negative terminal; and a driver circuit board in which a drive circuit is mounted to drive the power semiconductor module, wherein the driver circuit hoard is disposed at a position to face the power semiconductor module with the cover portion interposed there between, the driver circuit board includes a circuit element mounted in a surface on a side where the cover portion is disposed.
2. The power conversion device according to claim 1 , wherein the cover portion includes the first insulating portion disposed between the DC positive terminal and the DC negative terminal.
3. The power conversion device according to claim 1 ,
wherein a part of the metal member is fixed to a housing.
4. The power conversion device according to claim 1 ,
wherein the power semiconductor module includes a power semiconductor element and a gate terminal that transfers a signal to control the power semiconductor element,
wherein the DC positive terminal, the DC negative terminal, and the gate terminal protrude toward the same direction, and
wherein the cover portion forms a concave portion in which the gate terminal is disposed.
5. The power conversion device according to claim 1 ,
wherein the power semiconductor module includes a plurality of power semiconductor modules, and
wherein the metal member is configured to cover a DC positive terminal and a DC negative terminal of the plurality of power semiconductor modules.