IP Library Granted Patent US 10,256,602
Granted Patent B2
US 10,256,602 · App. 15/516,964 · Granted Apr 9, 2019

Laser component and method of producing same

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Quick Facts
Patent No.
US 10,256,602
App. No.
15/516,964
Granted
Apr 9, 2019
Kind
B2
Abstract

A laser component has a housing, which includes a carrier having a cavity with a bottom surface and a sidewall, wherein the cavity widens starting from the bottom surface, the side wall is inclined relative to the bottom surface by an angle different from 45°, a laser chip, an emission direction of which is oriented parallel to the bottom surface, is arranged on the bottom surface in the cavity, a reflective element is arranged in the cavity and bears on an edge between the bottom surface and the side wall, a reflective surface of the reflective element defines an angle with the bottom surface of the cavity, and the emission direction defines an angle of 45° with the reflective surface of the reflective element.

Claims (28)

1. A laser component having a housing, which comprises a carrier having a cavity with a bottom surface and a side wall,

wherein the cavity widens starting from the bottom surface,

the side wall is inclined relative to the bottom surface by an angle different from 45°,

a laser chip, an emission direction of which is oriented parallel to the bottom surface, is arranged on the bottom surface in the cavity,

a reflective element is arranged and fastened in the cavity by a solder connection or an adhesive bond and bears on an edge between the bottom surface and the side wall,

a reflective surface of the reflective element defines an angle of 45° with the bottom surface of the cavity, and

the emission direction defines an angle of 45° with the reflective surface of the reflective element.

2. The laser component according to claim 1 , wherein the reflective element bears on the side wall.

3. The laser component according to claim 1 , wherein the reflective element bears on the bottom surface.

4. The laser component according to claim 1 , wherein the cavity is closed by a cover.

5. The laser component according to claim 1 , wherein the reflective element comprises a glass.

6. The laser component according to claim 1 , wherein the reflective element is configured as a prism.

7. The laser component according to claim 1 , wherein the carrier comprises an at least partially crystalline semiconductor material.

8. The laser component according to claim 7 ,

wherein the carrier comprises silicon,

the bottom surface is formed by a {100} plane of the carrier, and

the side wall is formed by a {111} plane of the carrier.

9. A method of producing a laser component comprising:

providing a carrier having a cavity with a bottom surface and a side wall, the cavity widening starting from the bottom surface, wherein the side wall is inclined relative to the bottom surface by an angle different from 45°;

arranging a laser chip on the bottom surface in the cavity such that an emission direction of the laser chip is oriented parallel to the bottom surface; and

arranging a reflective element in the cavity and fastening the reflective element in the cavity by a solder connection or an adhesive bond such that the reflective element bears on an edge between the bottom surface and the side wall, a reflective surface of the reflective element defines an angle of 45° with the bottom surface of the cavity, and the emission direction defines an angle of 45° with the reflective surface of the reflective element.

10. The method according to claim 9 , wherein the carrier is inclined during the arrangement of the reflective element such that the edge is arranged between the bottom surface and the side wall, below the bottom surface and below the side wall.

11. The method according to claim 9 , wherein etching creates the cavity in the carrier.

12. The method according to claim 9 , further comprising sealing the cavity with a cover.

13. The method according to claim 9 ,

wherein the carrier is provided with a plurality of cavities, each of which has a bottom surface and a side wall,

a laser chip is respectively arranged in each cavity such that an emission direction of the laser chip is oriented parallel to the bottom surface of the cavity,

a reflective element is arranged in each cavity such that the reflective element bears on an edge between the bottom surface and the side wall of the cavity, a reflective surface of the reflective element defines an angle of 45° with the bottom surface of the cavity, and the emission direction defines an angle of 45° with the reflective surface of the reflective element.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051467/0906 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2017
From: SCHOLZ, DOMINIK
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 042078/0549 →