IP Library Granted Patent US 10,507,617
Granted Patent B2
US 10,507,617 · App. 15/517,858 · Granted Dec 17, 2019

Laser welded structure, electronic controller and manufacture method for laser welded structure

Inventors: Satoshi Arai (Tokyo, JP); Shigeharu Tsunoda (Tokyo, JP); Wataru Sawada (Tokyo, JP); Masaru Kamoshida (Hitachinaka, JP); Toshikazu Shigyo (Hitachinaka, JP)
Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
B29C65/1635B23K26/21B23K26/324B29C65/1606B29C65/1616B29C65/1629B29C65/1638B29C65/1654B29C65/1661B29C65/1677B29C65/44B29C65/8215B29C65/8223B29C66/028B29C66/112B29C66/114B29C66/1122B29C66/1142B29C66/124B29C66/1222B29C66/1224B29C66/244B29C66/43B29C66/5346B29C66/71B29C66/7212B29C66/72143B29C66/7392B29C66/73115B29C66/73117B29C66/73161B29C66/73521B29C66/73771B29C66/73775B29C66/73921B29C66/73941B29C66/742B29C66/7422B29C66/8322B29C66/9592H05K5/06B29C65/18B29C66/026B29C66/02245B29C66/74283B29C66/8122B29C66/81267B29L2031/3481
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Quick Facts
Patent No.
US 10,507,617
App. No.
15/517,858
Granted
Dec 17, 2019
Kind
B2
Abstract

A laser welded structure is formed by laser welding together a resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal. A glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin.

Claims (34)

1. A laser welded structure comprising a resin molded body and a metal body made of a metal which are laser welded together, the resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin,

wherein a glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin,

wherein at least a joint surface of the resin molded body with the metal body is subjected to an oxygen function amplifying treatment.

2. A laser welded structure comprising a resin molded body and a metal body made of a metal which are laser welded together, the resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and another resin,

wherein a crystallization speed of the polymer alloy is lower than a crystallization speed of the crystalline resin, or a recrystallization temperature of the polymer alloy is lower than a recrystallization temperature of the crystalline resin,

wherein at least a joint surface of the resin molded body with the metal body is subjected to an oxygen function amplifying treatment.

3. The laser welded structure according to claim 1 ,

wherein a crystallization speed of the polymer alloy is lower than a crystallization speed of the crystalline resin, or a recrystallization temperature of the polymer alloy is lower than a recrystallization temperature of the crystalline resin.

4. The laser welded structure according to claim 1 ,

wherein the polymer alloy contains a copolymer of the crystalline resin.

5. The laser welded structure according to claim 1 ,

wherein a content percentage of the amorphous resin in the polymer alloy is 5 to 40%.

6. The laser welded structure according to claim 1 ,

wherein an inorganic filler is added to the polymer alloy.

7. The laser welded structure according to claim 1 ,

wherein a joint surface of the metal body with the resin molded body has a surface roughness Ra of 0.1 μm to 5.0 μm.

8. The laser welded structure according to claim 1 ,

wherein at least a part of the metal body is embedded in the resin molded body.

9. An electronic controller including the laser welded structure according to claim 1 ,

the electronic controller comprising an electronic circuit portion received in an accommodation space defined by the metal body and the resin molded body,

wherein the accommodation space is sealed by laser welding the resin molded body and the metal body.

10. The electronic controller according to claim 9 ,

wherein the resin molded body is an integral molded body formed by integrally molding a cover for covering the electronic circuit portion, and a connector retaining terminals to be electrically connected to the electronic circuit portion.

11. The electronic controller according to claim 9 , comprising:

a cover for covering the electronic circuit portion; and a connector separate from the cover and retaining terminals to be electrically connected to the electronic circuit portion,

wherein the cover and the connector are each composed of the resin molded body and are united with each other.

12. A manufacture method for laser welded structure comprising:

preparing a resin molded body made of a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin, and a metal body made of a metal;

the amorphous resin having a glass transition temperature lower than a melting start temperature of the crystalline resin;

giving an oxygen function amplifying treatment to at least a portion of the resin molded body that is laser welded to the metal body;

heating the resin molded body to a temperature to or above the glass transition temperature of the amorphous resin; and

laser welding the resin molded body and the metal body together in a state where the resin molded body is in pressure contact with the metal body.

13. The manufacture method for laser welded structure according to claim 12 ,

wherein the resin molded body and the metal body are laser welded together in a state where the resin molded body is heated to a temperature equal to or higher than a recrystallization temperature of the polymer alloy and equal to or lower than a melting start temperature of the polymer alloy.

Assignments (2)
CHANGE OF NAME Recorded Mar 25, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 056299/0447 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 10, 2017
From: ARAI, SATOSHI; TSUNODA, SHIGEHARU; SAWADA, WATARU; KAMOSHIDA, MASARU; SHIGYO, TOSHIKAZU
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 041935/0868 →
Priority Claims (1)
JP 2014-209352 · Oct 10, 2014 · national
Continuity (1)
Related Publication 20170326812A1 · Nov 16, 2017