IP Library Granted Patent US 10,329,424
Granted Patent B2
US 10,329,424 · App. 15/523,567 · Granted Jun 25, 2019

Silicone composition

Inventors: Yasuyoshi Watanabe (Saitama, JP); Gaku Kitada (Saitama, JP)
Assignee: POLYMATECH JAPAN CO., LTD.
C08L83/04C08K3/22C08K3/36C09D5/24C09K5/14H01B1/20C08G77/20C08K2003/2227C08K2201/001C08L1/02C08L3/02C08L5/00
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Quick Facts
Patent No.
US 10,329,424
App. No.
15/523,567
Granted
Jun 25, 2019
Kind
B2
Abstract

The silicone composition is one that contains liquid silicone, at least one insoluble functionalizing filler, such as a thermally or electrically conductive filler, and a non-liquid anti-thickening or non-thickening anti-settling material, such as a cellulose compound or polysaccharide. In a system that contains liquid silicone and insoluble functionalizing filler(s), a polysaccharide functions as an anti-thickening or non-thickening anti-settling material, providing a low-viscosity and filler-rich silicone composition.

Claims (10)

1. A silicone composition comprising liquid silicone, at least one insoluble functionalizing filler, and a non-liquid anti-thickening anti-settling material,

wherein the anti-thickening anti-settling material is a cellulose compound, and

wherein the composition contains 300 to 2500 parts by weight of the at least one insoluble functionalizing filler and 2.0 to 50 parts by weight of the anti-thickening anti-settling material per 100 parts by weight of the liquid silicone and

wherein the composition has a viscosity of 30 to 700 Pa·S at 23° C.

2. The silicone composition according to claim 1 , wherein the anti-thickening anti-settling material is a non-thickening anti-settling material.

3. The silicone composition according to claim 1 , wherein the at least one insoluble functionalizing filler contains 25% to 60% by volume particles with a particle diameter of more than 50 μm on the basis of a total volume of the filler.

4. The silicone composition according to claim 1 , wherein the at least one insoluble functionalizing filler is at least one thermally conductive filler.

5. The silicone composition according to claim 4 , wherein the at least one insoluble functionalizing or thermally conductive filler is at least one selected from metals, metal oxides, metal nitrides, metal hydroxides, metal carbides, graphite, and carbon fibers, and the silicone composition is a thermally conductive silicone composition.

6. The silicone composition according to claim 1 , wherein the at least one insoluble functionalizing filler is at least one selected from metals, metal oxides, and carbon compounds, and the silicone composition is an electrically conductive silicone composition.

7. The silicone composition according to claim 1 , wherein the cellulose compound is at least any one of cellulose (crystalline cellulose), methyl cellulose, hydroxymethyl cellulose, carboxymethyl cellulose, and derivatives of these cellulose compounds.

Assignments (2)
CHANGE OF NAME Recorded Jun 1, 2018
From: POLYMATECH JAPAN CO., LTD.
To: SEKISUI POLYMATECH CO., LTD.
Reel/Frame 045964/0914 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2017
From: WATANABE, YASUYOSHI; KITADA, GAKU
To: POLYMATECH JAPAN CO., LTD.
Reel/Frame 042379/0009 →
Continuity (1)
Related Publication 20170313881A1 · Nov 2, 2017