Image pickup apparatus
View Patent ↗An image pickup apparatus includes a circuit board, a solid-state image sensing device disposed on an upper surface of the circuit board, a cylindrical lens barrel disposed above the circuit board, a lens housed in the lens barrel, and a holding member that holds the lens barrel and the circuit board therein. The solid-state image sensing device is positioned in an enclosed space formed by the lens barrel and the circuit board. The lens barrel has a first flange portion protruding in a direction perpendicular to a central axis of the lens barrel. The holding member has a first fitting groove portion in which the first flange portion of the lens barrel is fit. A thermal expansion coefficient of the holding member is smaller than a thermal expansion coefficient of the lens barrel.
1. An image pickup apparatus, comprising:
a circuit board;
a solid-state image sensing device disposed on an upper surface of the circuit board;
a cylindrical lens barrel disposed above the circuit board;
a lens housed in the lens barrel; and
a holding member that holds the lens barrel and the circuit board therein,
wherein the solid-state image sensing device is positioned in an enclosed space formed by the lens barrel and the circuit board;
wherein the lens barrel has a first flange portion protruding in a direction perpendicular to a central axis of the lens barrel;
wherein the holding member has a first fitting groove portion in which the first flange portion of the lens barrel is fit; and
wherein a thermal expansion coefficient of the holding member is smaller than a thermal expansion coefficient of the lens barrel.
2. The image pickup apparatus according to claim 1 , wherein the lens barrel further has a second flange portion protruding in the direction perpendicular to the central axis of the lens barrel; and
wherein the holding member further has a second fitting groove portion in which the second flange portion of the lens barrel is fit.
3. The image pickup apparatus according to claim 2 , wherein an adhesive material is applied to at least a part of a surface of the second flange portion.
4. The image pickup apparatus according to claim 1 , wherein an adhesive material is applied to at least a part of a surface of the first flange portion.
5. The image pickup apparatus according to claim 1 , comprising a recess positioned above the lens barrel and formed by the lens barrel and the holding member,
wherein an elastic member is inserted in the recess.
6. An image pickup apparatus, comprising:
a circuit board;
a solid-state image sensing device disposed on an upper surface of the circuit board;
a cylindrical lens barrel disposed above the circuit board;
a lens housed in the lens barrel; and
a holding member that holds the lens barrel and the circuit board therein,
wherein the solid-state image sensing device is positioned in an enclosed space formed by the lens barrel and the circuit board; and
wherein a thermal expansion coefficient of the holding member is larger than a thermal expansion coefficient of the lens barrel.
7. The image pickup apparatus according to claim 6 , wherein the lens barrel has a first flange portion protruding in a direction perpendicular to a central axis of the lens barrel; and
wherein the holding member has a first fitting groove portion in which the first flange portion of the lens barrel is fit.
8. The image pickup apparatus according to claim 6 , comprising a recess positioned above the lens barrel and formed by the lens barrel and the holding member, wherein an elastic member is inserted in the recess.