Wiring forming method and circuit board
View Patent ↗To form wiring on circuit board and conductor body, metal ink containing metal particles is dispensed by inkjet head straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device to the dispensed metal ink. The metal ink to which the laser is applied is baked and wiring is formed. A laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body. The metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.
1. A wiring forming method comprising:
forming wiring on a substrate by baking a metal-containing liquid that is a liquid containing metal particles,
wherein the forming includes
applying the metal-containing liquid straddling multiple different types of substrate materials, and
baking the metal-containing liquid applied during the applying with a laser, wherein
the laser emission amount per unit of area is changed based on the substrate material for each of the multiple substrates when baking the metal-containing liquid.
2. The wiring forming method according to claim 1 , wherein
the laser emission amount per unit of area is changed based on at least one of the thermal conductivity, the thermal capacity, or the volume of the substrate for each of the multiple substrates when baking the metal-containing liquid.
3. The wiring forming method according to claim 1 , wherein
the applying includes applying the metal-containing liquid straddling a first substrate and a second substrate that has at least one of a higher thermal conductivity than the thermal conductivity of the first substrate, a higher thermal capacity than the thermal capacity of the first substrate, or a larger volume than the volume of the first substrate, and
the baking includes
a first baking process of baking the metal-containing liquid applied on the first substrate by applying the laser corresponding to a first set emission amount, which is a laser emission amount per unit of area set according to the first substrate, and
a second baking process of, after the first baking processing is complete, baking the metal-containing liquid applied on the second substrate by applying the laser corresponding to an emission amount that is equal to or less than a second set emission amount, which is a laser emission amount per unit of area set according to the second substrate, and greater than the first set emission amount.
4. The wiring forming method according to claim 3 , wherein
the second baking process includes baking the metal-containing liquid applied on the second substrate by applying the laser corresponding to the second set emission amount to the metal-containing liquid applied on the second substrate.
5. The wiring forming method according to claim 3 , wherein
the second baking process includes baking the metal-containing liquid applied on the second substrate by applying, multiple times, the laser corresponding to an emission amount smaller than the second set emission amount and greater than the first set emission amount to the metal-containing liquid applied on the second substrate.
6. The wiring forming method according to claim 3 , wherein
the second baking process includes
baking a substrate-side end section that is an end section on the first substrate side within the metal-containing liquid applied on the second substrate by applying, multiple times, the laser corresponding to an emission amount smaller than the second set emission amount and greater than the first set emission amount to the substrate-side end section, and
baking a portion within the metal-containing liquid applied on the second substrate excluding the substrate-side end section by applying the laser corresponding to second set emission amount to the section within the metal-containing liquid applied on the second substrate excluding the substrate-side end section.
7. The wiring forming method according to claim 3 , wherein
the wavelength of the laser applied to the metal-containing liquid applied on the first substrate and the second substrate is 500 to 1500 nm.
8. The wiring forming method according to claim 3 , wherein
the second baking process includes
baking a portion within the metal-containing liquid applied on the second substrate excluding a substrate-side end section that is an end section on the first substrate side within the metal-containing liquid applied on the second substrate by applying the laser corresponding to second set emission amount to the section within the metal-containing liquid applied on the second substrate excluding the substrate-side end section, and then baking the substrate-side end section within the metal-containing liquid applied on the second substrate by applying the laser with a wavelength of 200 to 1500 nm to the end section on the second substrate side of the wiring formed by the baking of the metal-containing liquid on the first substrate.