Optoelectronic component and method for the production thereof

1. An optoelectronic component comprising:

a composite body comprising a molded body; and

an optoelectronic semiconductor chip embedded into the molded body,

wherein an electrically conductive through contact extends from a top side of the composite body to an underside of the composite body through the molded body,

a top side of the optoelectronic semiconductor chip is at least partly not covered by the molded body,

the optoelectronic semiconductor chip comprises a first electrical contact on its top side,

a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact,

a second top side metallization is arranged on the top side of the composite body and electrically insulated with respect to the first top side metallization,

the second top side metallization completely delimits a part of the top side of the optoelectronic semiconductor chip, and

a wavelength-converting material is arranged in a region completely delimited by the second top side metallization on the top side of the composite body, said wavelength-converting material extending as far as the second top side metallization.

2. The optoelectronic component according to claim 1 , wherein the second top side metallization extends over a part of the top side of the optoelectronic semiconductor chip.

3. The optoelectronic component according to claim 1 , wherein the second top side metallization completely delimits the first top side metallization.

4. The optoelectronic component according to claim 1 , wherein the second top side metallization comprises a higher thickness than the first top side metallization in a direction perpendicular to the top side of the composite body.

5. The optoelectronic component according to claim 1 , wherein above an edge region of the top side of the optoelectronic semiconductor chip an electrically insulating material is arranged between the top side of the optoelectronic semiconductor chip and the first top side metallization.

6. The optoelectronic component according to claim 1 , wherein a first underside metallization is arranged on the underside of the composite body and electrically conductively connects to the through contact.

7. The optoelectronic component according to claim 1 ,

wherein an underside of the optoelectronic semiconductor chip is at least partly exposed on the underside of the composite body, and

the optoelectronic semiconductor chip comprises a second electrical contact on its underside.

8. The optoelectronic component according to claim 7 , wherein the second top side metallization electrically conductively connects to the second electrical contact.

9. The optoelectronic component according to claim 7 , wherein a second underside metallization is arranged on the underside of the composite body and electrically conductively connects to the second electrical contact.

10. The optoelectronic component according to claim 1 ,

wherein a protective diode is embedded into the molded body, and

the first top side metallization electrically conductively connects to the protective diode.

11. The optoelectronic component according to claim 9 , wherein the second underside metallization electrically conductively connects to the protective diode.

12. A method of producing an optoelectronic component comprising:

providing an optoelectronic semiconductor chip comprising a first electrical contact on a top side;

embedding the optoelectronic semiconductor chip into a molded body to form a composite body, the top side of the optoelectronic semiconductor chip is at least partly not covered by the molded body;

establishing an electrically conductive through contact extending from a top side of the composite body to an underside of the composite body through the molded body;

establishing a first top side metallization on the top side of the composite body, said first top side metallization electrically conductively connecting the first electrical contact to the through contact;

establishing a second top side metallization on the top side of the composite body, said second top side metallization being electrically insulated with respect to the first top side metallization, wherein the second top side metallization completely delimits a part of the top side of the optoelectronic semiconductor chip; and

arranging a wavelength-converting material in a region completely delimited by the second top side metallization on the top side of the composite body, wherein the wavelength-converting material extends as far as the second top side metallization.

13. The method according to claim 12 , wherein the wavelength-converting material is arranged in the region delimited by the second top side metallization by a dosing method.

14. The method according to claim 12 , further comprising, before establishing the first top side metallization, arranging an electrically insulating material above an edge region of the top side of the optoelectronic semiconductor chip.

15. The method according to claim 12 , wherein the first top side metallization is established by an electrolytic method or the second top side metallization is established by an electrolytic method or the first top side metallization and the second top side metallization are established by an electrolytic method.

16. The method according to claim 12 , further comprising arranging an encapsulation layer on the first top side metallization and on the second top side metallization.

17. The method according to claim 16 , wherein arranging the encapsulation layer is carried out by electroless deposition.

18. The method according to claim 12 , wherein the through contact is embedded jointly with the optoelectronic semiconductor chip into the molded body.

19. The method according to claim 12 , wherein the first top side metallization and the second top side metallization are established in common work steps.