Method of producing an optoelectronic component, and optoelectronic component

1. A method of producing an optoelectronic component comprising:

embedding an optoelectronic component part into a molded body such that an upper side of the optoelectronic component part is at least partially exposed on an upper side of the molded body;

arranging and structuring a sacrificial layer above the upper side of the optoelectronic component part and the upper side of the molded body;

arranging and structuring a layer of an optical material above the sacrificial layer; and

removing the sacrificial layer.

2. The method as claimed in claim 1 , wherein the optoelectronic component part comprises an optoelectronic semiconductor chip or a light-emitting diode chip.

3. The method as claimed in claim 1 , wherein the optoelectronic component part is embedded into the molded body such that a lower side of the optoelectronic component part is at least partially exposed on a lower side of the molded body.

4. The method as claimed in claim 3 , wherein the optoelectronic component part has electrical contacts on its lower side.

5. The method as claimed in claim 3 , wherein embedding the optoelectronic component part into the molded body is carried out such that the upper side and the lower side of the optoelectronic component part are flush with the upper side and the lower side of the molded body.

6. The method as claimed in claim 1 , wherein the molded body is formed by a molding method, and

the optoelectronic component part is embedded into the molded body during formation of the molded body.

7. The method as claimed in claim 1 , wherein the sacrificial layer comprises a photoresist.

8. The method as claimed in claim 1 , wherein structuring the sacrificial layer is carried out via a photolithographic method via mask, contact, grayscale, or laser-interference lithography, via direct illumination, or via an imprinting method.

9. The method as claimed in claim 1 , wherein removal of the sacrificial layer is carried out by dissolving the sacrificial layer.

10. The method as claimed in claim 9 , wherein dissolving the sacrificial layer is carried out by a solvent or an etching solution.

11. The method as claimed in claim 1 , wherein the optical material comprises a plastic.

12. The method as claimed in claim 1 , wherein structuring the optical material is carried out via a photolithographic method or an imprinting method.

13. The method as claimed in claim 1 , wherein multiple optoelectronic component parts are embedded together into the molded body,

a section of the sacrificial layer is arranged and structured above each optoelectronic component part,

a section of the optical material is arranged and structured above each section of the sacrificial layer, and

the optoelectronic component is singulated by dicing the molded body.

14. The method as claimed in claim 13 , wherein dicing the molded body is carried out before removal of the sacrificial layer or after removal of the sacrificial layer.