Circuit arrangement for reducing the maximum electrical field strength, high voltage generation unit with such a circuit arrangement and x-ray generator with such a high voltage generation unit
The disclosure specifies a circuit arrangement having electronic first components arranged on a circuit board and lying at high-voltage potential. The circuit arrangement includes functionless, electronic second components lying at high-voltage potential, which are arranged on the circuit board adjacent to the electronic first components, and configured to reduce the maximum electrical field strength between the first components and a reference potential and/or between pads of the circuit board and the reference potential. Through the additional, functionless components, the maximum electrical field strength between electronic components at high voltage and at a reference potential will be reduced. The disclosure also specifies a high voltage generation unit and an x-ray generator.
1. A circuit arrangement comprising:
electronic first components arranged on a circuit board and lying at high-voltage potential; and
functionless, electronic second components lying at high-voltage potential,
wherein the electronic second components are arranged on the circuit board adjacent to the electronic first components, and
wherein the electronic second components are configured to reduce a maximum electrical field strength between the electronic first components and a reference potential and/or between pads of the circuit board and the reference potential.
2. The circuit arrangement of claim 1 , wherein the electronic second components are short-circuited.
3. The circuit arrangement of claim 2 , wherein the electronic second components are arranged at points on the circuit board where the maximum electrical field strength occurs.
4. The circuit arrangement of claim 3 , wherein the electronic first components and the electronic second components are surface mount device components.
5. The circuit arrangement of claim 4 , wherein the electronic first components are diodes.
6. The circuit arrangement of claim 5 , wherein the reference potential is a chassis ground.
7. The circuit arrangement of claim 6 , wherein the electronic second components are capacitors.
8. The circuit arrangement of claim 1 , wherein the electronic second components are arranged at points on the circuit board where the maximum electrical field strength occurs.
9. The circuit arrangement of claim 1 , wherein the electronic first components and the electronic second components are surface mount device components.
10. The circuit arrangement of claim 1 , wherein the electronic first components are diodes.
11. The circuit arrangement of claim 10 , wherein the electronic second components are capacitors.
12. The circuit arrangement of claim 1 , wherein the reference potential is a chassis ground.
13. The circuit arrangement of claim 1 , wherein the electronic second components are capacitors.
14. The circuit arrangement of claim 13 , wherein the electronic second components are arranged in a shape of a circular arc.
15. The circuit arrangement of claim 1 , wherein the electronic second components are arranged in a shape of a circular arc.
16. The circuit arrangement of claim 1 , further comprising:
vias lying at high-voltage potential in the circuit board adjacent to the electronic second components.
17. The circuit arrangement of claim 16 , further comprising:
the pads embodied on the circuit board for contacting the electronic first components, wherein the pads are completely covered by the electronic first components.
18. The circuit arrangement of claim 1 , further comprising:
the pads embodied on the circuit board for contacting the electronic first components, wherein the pads are completely covered by the electronic first components.
19. A high voltage generation unit comprising:
at least one high-voltage transformer having a circuit arrangement for rectifying a high voltage connected to the at least one high-voltage transformer, wherein the circuit arrangement comprises:
electronic first components arranged on a circuit board and lying at high-voltage potential; and
functionless, electronic second components lying at high-voltage potential, wherein the electronic second components are arranged on the circuit board adjacent to the electronic first components, and wherein the electronic second components are configured to reduce a maximum electrical field strength between the electronic first components and a reference potential and/or between pads of the circuit board and the reference potential.
20. An x-ray generator comprising:
a parallel-tuned inverter; and
a high voltage generation unit comprising a high-voltage transformer, the high-voltage transformer having a circuit arrangement for rectifying a high voltage connected to the high-voltage transformer, wherein the circuit arrangement comprises:
electronic first components arranged on a circuit board and lying at high-voltage potential; and
functionless, electronic second components lying at high-voltage potential, wherein the electronic second components are arranged on the circuit board adjacent to the electronic first components, and wherein the electronic second components are configured to reduce a maximum electrical field strength between the electronic first components and a reference potential and/or between pads of the circuit board and the reference potential.