Organic light-emitting diode, organic light module, and method for producing an organic light-emitting diode
View Patent ↗An organic light-emitting diode provides a substrate having a top side and one or a plurality of substrate side surfaces running transversely to the top side and connected thereto via a substrate edge; and an organic layer sequence applied to the top side with an emitter layer, which generates electromagnetic radiation coupled out from the diode via a luminous surface during intended operation of the diode. In a plan view of the luminous surface, the sequence adjoins at least a partial region of substrate edge(s), and in the region the luminous surface extends at least as far as the corresponding edge. An encapsulation formed in an uninterrupted and continuous fashion is applied to the sequence. The encapsulation, at least in the region of the edge adjoining the sequence, is led onto the associated substrate side surface, at least partly covers the latter and is in direct contact with the surface.
1. An organic light-emitting diode comprising
a substrate having a top side and one or a plurality of substrate side surfaces running transversely with respect to the top side, wherein the top side and the substrate side surfaces are connected to one another in each case via a substrate edge, and
an organic layer sequence applied to the top side and having an emitter layer, which generates electromagnetic radiation during intended operation of the light-emitting diode, wherein the radiation is coupled out from the organic light-emitting diode via a luminous surface, wherein
in a plan view of the luminous surface the organic layer sequence adjoins at least a partial region of at least one substrate edge, wherein in the partial region the luminous surface extends at least as far as the corresponding substrate edge,
an encapsulation formed in an uninterrupted and continuous fashion is applied to the organic layer sequence,
the encapsulation, at least in the region of the substrate edge adjoining the organic layer sequence, is led right onto the associated substrate side surface, at least partly covers the latter and is in direct contact with the substrate side surface.
2. The organic light-emitting diode as claimed in claim 1 ,
wherein in the region of the mutually adjoining substrate edge and organic layer sequence the lateral distance between substrate edge and organic layer sequence is at most 200 μm.
3. The organic light-emitting diode as claimed in claim 1 ,
wherein in a plan view of the luminous surface the organic layer sequence adjoins the substrate edge along the entire lateral extent of the corresponding substrate edge, such that during operation the luminous surface extends at least as far as the substrate edge along the entire substrate edge.
4. The organic light-emitting diode as claimed in claim 1 ,
wherein the organic layer sequence is completely surrounded by the encapsulation on all surfaces not covered by the substrate.
5. The organic light-emitting diode as claimed in claim 1 , wherein
the encapsulation comprises a thin-film encapsulation,
the thin-film encapsulation is in direct contact with the substrate side surface.
6. The organic light-emitting diode as claimed in claim 5 , wherein
the encapsulation comprises an anti-scratch protective layer,
the thin-film encapsulation has a thickness of between 1 nm and 5 μm and comprises one or more of the following materials: aluminum oxide, zinc oxide, zirconium oxide, titanium oxide, hafnium oxide, lanthanum oxide, tantalum oxide, silicon nitride, silicon oxide, silicon oxynitride, indium tin oxide, indium zinc oxide, aluminum-doped zinc oxide,
the thin-film encapsulation is in direct contact with the organic layer sequence, the anti-scratch protective layer is applied on those sides of the thin-film encapsulation which face away from the organic layer sequence.
7. The organic light-emitting diode as claimed in claim 6 , wherein the anti-scratch protective layer comprises scattering particles that diffusively scatter the radiation emitted by the emitter layer.
8. The organic light-emitting diode as claimed in claim 6 ,
wherein the anti-scratch protective layer forms an uninterrupted and continuous layer that is fitted at least partly on an underside of the substrate, the underside being situated opposite the top side of the substrate, as a result of which the anti-scratch protective layer is prevented from being vertically detached from the light-emitting diode.
9. The organic light-emitting diode as claimed in claim 1 ,
wherein in a plan view of the luminous surface the organic layer sequence adjoins a plurality of substrate edges in each case along the entire lateral extent of the respective substrate edges, such that the luminous surface extends at least as far as the corresponding substrate edges along a plurality of substrate edges.
10. The organic light-emitting diode as claimed in claim 1 ,
wherein the organic layer sequence adjoins a substrate edge that belongs to a marginal surface that laterally delimits the substrate.
11. The organic light-emitting diode as claimed in claim 1 ,
wherein
the organic light-emitting diode comprises at least one cutout,
the cutout extends completely through the organic layer sequence and the substrate in a direction transversely with respect to the top side of the substrate and is laterally completely surrounded by the organic layer sequence and the substrate,
the organic layer sequence adjoins a substrate edge that laterally delimits the cutout in a plan view of the luminous surface.
12. An organic light module comprising:
a plurality of organic light-emitting diodes comprising
a substrate having a top side and one or a plurality of substrate side surfaces running transversely with respect to the top side, wherein the top side and the substrate side surfaces are connected to one another in each case via a substrate edge, and
an organic layer sequence applied to the top side and having an emitter layer, which generates electromagnetic radiation during intended operation of the light-emitting diode, wherein the radiation is coupled out from the organic light-emitting diode via a luminous surface,
wherein in a plan view of the luminous surface the organic layer sequence adjoins at least a partial region of at least one substrate edge, wherein in the partial region the luminous surface extends at least as far as the corresponding substrate edge, an encapsulation formed in an uninterrupted and continuous fashion is applied to the organic layer sequence, the encapsulation, at least in the region of the substrate edge adjoining the organic layer sequence, is led right onto the associated substrate side surface, at least partly covers the latter and is in direct contact with the substrate side surface, wherein
at least two organic light-emitting diodes are combined such that the substrate edges adjoining the organic layer sequences bear against one another and, as a result, a common luminous surface that appears continuous and free of interruption is formed during the operation of both light-emitting diodes.
13. The organic light module as claimed in claim claim 12 , wherein
a continuous scattering layer formed in an uninterrupted fashion is applied to the plurality of the light-emitting diodes and runs parallel to the top sides of the organic light-emitting diodes,
the light modules are covered by the scattering layer at least in the region of the substrate edges placed against one another.
14. A method for producing an organic light-emitting diode comprising the following steps:
A) providing a substrate having a top side and one or a plurality of substrate side surfaces running transversely with respect to the top side, wherein the top side and the substrate side surfaces are connected to one another in each case via a substrate edge;
B) applying an organic layer sequence to the top side of the substrate, such that in a plan view of the top side the organic layer sequence adjoins at least one substrate edge at least in a partial region, wherein the organic layer sequence comprises at least one emitter layer that emits electromagnetic radiation during intended operation of the light-emitting diode;
C) applying an encapsulation formed in an uninterrupted and continuous fashion to the organic layer sequence, wherein the encapsulation, at least in the region of the substrate edge adjoining the organic layer sequence, is led onto the associated substrate side surface, such that the latter is at least partly covered by the encapsulation, wherein
in step A) the substrate is provided on an auxiliary carrier, wherein the top side of the substrate lies on an elevated plane relative to the auxiliary carrier and a step is formed between the top side and the auxiliary carrier, wherein a substrate edge belonging to the step forms a tear-off edge,
in step B) the organic layer sequence is applied laterally beyond the tear-off edge in places, such that both the top side and the auxiliary carrier are at least partly covered by the organic layer sequence, wherein during application the step has the effect that the organic layer sequence is interrupted along the tear-off edge and, as a result, the parts of the organic layer sequence which are applied on the auxiliary carrier are not joined with the parts of the organic layer sequence which are situated on the top side of the substrate,
in a step D), the auxiliary carrier is detached, wherein the parts of the organic layer sequence which are situated on the auxiliary carrier, together with the auxiliary carrier, are removed from the substrate.
15. The method as claimed in claim 14 , wherein
in step B), a mask is used for applying the organic layer sequence,
in step C), a thin-film encapsulation is applied to exposed outer surfaces of the organic layer sequence and/or of the substrate, and afterward an anti-scratch protective layer is applied at least to those sides of the thin-film encapsulation which face away from the organic layer sequence.
16. The method as claimed in claim 14 ,
wherein before step A)
firstly a substrate blank is applied on the auxiliary carrier,
afterward the substrate blank is cut to size to form the substrate by means of a stamping method, a mechanical cutting method or a laser cutting method,
afterward the remnants of the substrate blank that do not belong to the substrate are detached from the auxiliary carrier.
17. The method as claimed in claim 14 ,
wherein before step A)
firstly a substrate blank is applied to an intermediate film,
afterward the substrate is stamped from the substrate blank by means of a stamping method, a mechanical cutting method or a laser cutting method,
afterward the remnants of the substrate blank that do not belong to the substrate are detached from the intermediate film,
afterward the substrate is applied to an auxiliary carrier.