High performance thermal interface materials with low thermal impedance
A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
1. A thermal interface material comprising:
at least one polymer;
at least one phase change material including at least one wax;
a first thermally conductive metal filler having a first particle size between 1 and 25 microns:
a second thermally conductive metal filler having a second particle size between 1 and 10 microns, wherein the first particle size is larger than the second particle size, the first and second thermally conductive fillers being different sized particles of the same material:
a third thermally conductive filler different from the first and second thermally conductive fillers and having a third particle size between 0.5 and 1 micron; and all thermally conductive fillers being present in a total amount of between 90 wt. % and 99 wt. %, based on the total weight of the thermal interface material; and
wherein the thermal interface material has a bond line thickness (BLT) between 5 and 80 microns when subjected to a pressure of 40 psi and heated to 80° C.
2. The thermal interface material of claim 1 , wherein the first and second thermally conductive fillers each comprise aluminum particles.
3. The thermal interface material of claim 1 , wherein the third thermally conductive filler comprises zinc oxide particles.
4. The thermal interface material of claim 1 , wherein the first particle size is between 1 and 15 microns.
5. The thermal interface material of claim 1 , wherein the second particle size is between 1 and 5 microns.
6. The thermal interface material of claim 1 , wherein the third particle size is between 0.7 and 0.9 microns.
7. The thermal interface material of claim 1 , wherein the first particle size is between 1 and 15 microns and the second particle size is between 1 and 5 microns.
8. The thermal interface material of claim 7 , wherein the first and second thermally conductive filler each comprise aluminum and the third thermally conductive filler comprises zinc oxide.
9. The thermal interface material of claim 1 , further comprising at least one coupling agent.
10. The thermal interface material of claim 9 , wherein the coupling agent is a titanate coupling agent.
11. The thermal interface material of claim 1 , further comprising at least one antioxidant.
12. The thermal interface material of claim 1 , further comprising at least one ion scavenger.
13. The thermal interface material of claim 1 , further comprising at least one crosslinker.
14. The thermal interface material of claim 1 , wherein the at least one polymer includes a hydrogenated polybutadiene mono-ol.
15. The thermal interface material of claim 1 , wherein the at least one wax includes a hydrocarbon wax.